Heatsink installation
An information handling system includes a heatsink interface component, a printed circuit board assembly, and an upstream heatsink. The heatsink interface component aligns the upstream heatsink on the printed circuit board assembly. The heatsink interface component includes first, second, third, and fourth sides. The heatsink interface component also includes multiple posts. Each of a first set of the posts is located on a top surface of the second side, and each of a second set of the posts is located on a top surface of the fourth side. The heatsink interface component also includes recesses located within the second and fourth sides. Each of a first set of the recesses extends from a bottom surface to the top surface of the second side, and each of a second set of the recesses extends from a bottom surface to the top surface of the fourth side.
1. A heatsink interface component to align an upstream heatsink of an information handling system on a printed circuit board assembly of the information handling system, the heatsink interface component comprising:
first, second, third, and fourth sides;
a plurality of posts, wherein each of a first set of the posts is located on a top surface of the second side, and each of a second set of the posts is located on a top surface of the fourth side;
a plurality of recesses located within the second and fourth sides, wherein each of a first set of the recesses extends from a bottom surface to the top surface of the second side, and each of a second set of the recesses extends from a bottom surface to the top surface of the fourth side; and
a first portion that extends beyond both the bottom surface of the second side and the bottom surface of the fourth side.
2. The heatsink interface component of claim 1 , when the heatsink interface component is placed in physical communication with the printed circuit board assembly, the first portion of the first side extends between an upstream processor and a downstream processor on the printed circuit board.
3. The heatsink interface component of claim 2 , wherein the third side includes:
a second portion that extends beyond both the bottom surface of the second side and the bottom surface of the fourth side.
4. The heatsink interface component of claim 3 , when the heatsink interface component is placed in physical communication with the printed circuit board assembly, the second portion of the second side extends below a top surface of the upstream processor.
5. The heatsink interface component of claim 1 , when the upstream heatsink is placed in physical communication with the heatsink interface component, each of the posts is placed within a respective notch of a plurality of notches in a heatsink base of the upstream heatsink.
6. The heatsink interface component of claim 1 , when the heatsink interface component is placed in physical communication with the printed circuit board assembly, each of the recesses receives a respective post of a second plurality of posts on the printed circuit board assembly.
7. The heatsink interface component of claim 1 , when a downstream heatsink is placed in physical communication with the heatsink interface component, each of the posts interferes with a bottom surface of a heatsink base of the downstream heatsink, wherein the interference between the posts and the bottom surface creates a gap between the downstream heatsink and a top surface of an upstream processor of the printed circuit board.
8. An information handling system comprising:
a printed circuit board assembly including an upstream processor; and
a heatsink interface component in physical communication with the upstream processor on the printed circuit board assembly, the heatsink interface component including:
first, second, third, and fourth sides;
a plurality of posts, wherein each of a first set of the posts is located on a top surface of the second side, and each of a second set of the posts is located on a top surface of the fourth side; and
a plurality of recesses located within the second and fourth sides, wherein each of a first set of the recesses extends from a bottom surface to the top surface of the second side, and each of a second set of the recesses extends from a bottom surface to the top surface of the fourth side; and
the first side including a first portion that extends beyond both the bottom surface of the second side and the bottom surface of the fourth side.
9. The information handling system of claim 8 , when the heatsink interface component is placed in physical communication with the printed circuit board assembly, the first portion of the first side extends between the upstream processor and a downstream processor on the printed circuit board assembly.
10. The information handling system of claim 9 , wherein the third side includes:
a second portion that extends beyond both the bottom surface of the second side and the bottom surface of the fourth side.
11. The information handling system of claim 10 , when the heatsink interface component is placed in physical communication with the printed circuit board assembly, the second portion of the second side extends below a top surface of the upstream processor.
12. The information handling system of claim 8 , when an upstream heatsink is placed in physical communication with the heatsink interface component, each of the posts are placed within a respective notch of a plurality of notches in a heatsink base of the upstream heatsink.
13. The information handling system of claim 8 , when the heatsink interface component is placed in physical communication with the printed circuit board assembly, each of the recesses receives a respective post of a second plurality of posts on the printed circuit board assembly.
14. The information handling system of claim 8 , when a downstream heatsink is placed in physical communication with the heatsink interface component, each of the posts interferes with a bottom surface of a heatsink base of the downstream heatsink, wherein the interference between the posts and the bottom surface creates a gap between the downstream heatsink and a top surface of the upstream processor of the printed circuit board.
15. An information handling system comprising:
a printed circuit board assembly including an upstream processor and a downstream processor;
an upstream heatsink to provide heat dissipation to the upstream processor;
a downstream heatsink to provide heat dissipation to the downstream processor; and
a heatsink interface component in physical communication with and located between the upstream processor and the upstream heatsink, the heatsink interface component includes:
first, second, third, and fourth sides;
a plurality of posts, wherein each of a first set of the posts is located on a top surface of the second side, and each of a second set of the posts is located on a top surface of the fourth side; and
a plurality of recesses located within the second and fourth sides, wherein each of a first set of the recesses extends from a bottom surface to the top surface of the second side, and each of a second set of the recesses extends from a bottom surface to the top surface of the fourth side,
when the downstream heatsink is placed in physical communication with the heatsink interface component, each of the posts interferes with a bottom surface of a heatsink base of the downstream heatsink, wherein the interference between the posts and the bottom surface creates a gap between the downstream heatsink and a top surface of the upstream processor of the printed circuit board.
16. The information handling system of claim 15 , when the upstream heatsink is placed in physical communication with the heatsink interface component, each of the posts are placed within a respective notch of a plurality of notches in a heatsink base of the upstream heatsink.
17. The information handling system of claim 15 , when the heatsink interface component is placed in physical communication with the printed circuit board assembly, each of the recesses receives a respective post of a second plurality of posts on the printed circuit board assembly.