IP Library Granted Patent US 11,764,505
Granted Patent B2
US 11,764,505 · App. 17/382,243 · Granted Sep 19, 2023

Add-in card connector contact optimization for high-speed signaling

Inventors: Sandor Farkas (Round Rock, TX); Bhyrav Mutnury (Austin, TX)
Assignee: Dell Products L.P.
H01R12/737G06F13/4068H01R12/721H01R13/03H01R43/16
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Quick Facts
Patent No.
US 11,764,505
App. No.
17/382,243
Granted
Sep 19, 2023
Kind
B2
Abstract

A contact for a high-speed data communication interface includes a first portion configured to be coupled to a first component associated with the high-speed data communication interface, a second portion configured to be coupled to a mating contact of a second component associated with the high-speed data communication interface, and a third portion configured to provide a sliding surface when coupled to the mating contact. The sliding surface is coated with a ferromagnetic coating.

Claims (32)

1. A contact for a high-speed data communication interface, the contact comprising:

a first portion configured to be coupled to a first component associated with the high-speed data communication interface;

a second portion configured to be coupled to a mating contact of a second component associated with the high-speed data communication interface; and

a third portion configured to provide a sliding surface when coupled to the mating contact, wherein the sliding surface is coated with a ferromagnetic coating.

2. The contact of claim 1 , wherein the sliding surface presents an open-circuit stub when a signal of the high-speed data communication interface is transmitted through the contact.

3. The contact of claim 2 , wherein the ferromagnetic coating operates to reduce a resonance of the open-circuit stub.

4. The contact of claim 2 , wherein the ferromagnetic coating operates to reduce an insertion loss through the contact.

5. The contact of claim 1 , wherein the ferromagnetic coating comprises a bonding material infused with a ferromagnetic material.

6. The contact of claim 5 , wherein the coating material comprises one of a paint, an epoxy, a powder coating, and a sealant.

7. The contact of claim 5 , wherein the ferromagnetic material comprises one of iron particles, nickel particles, cobalt particles, neodymium magnet particles, and rare earth magnetic particles.

8. The contact of claim 1 , wherein the contact is fabricated of one of copper, and bronze.

9. The contact of claim 8 , wherein the contact is plated with one of gold, copper, tin, and tin-lead.

10. A method for forming a contact for a high-speed data communication interface, the method comprising:

forming, on the contact, a first portion configured to be coupled to a first component associated with the high-speed data communication interface;

forming a second portion configured to be coupled to a mating contact of a second component associated with the high-speed data communication interface;

forming a third portion configured to provide a sliding surface when coupled to the mating contact; and

coating the sliding surface with a ferromagnetic coating.

11. The method of claim 10 , wherein the sliding surface presents an open-circuit stub when a signal of the high-speed data communication interface is transmitted through the contact.

12. The method of claim 11 , wherein the ferromagnetic coating operates to reduce a resonance of the open-circuit stub.

13. The method of claim 11 , wherein the ferromagnetic coating operates to reduce an insertion loss through the contact.

14. The method of claim 10 , wherein the ferromagnetic coating comprises a bonding material infused with a ferromagnetic material.

15. The method of claim 14 , wherein the coating material comprises one of a paint, an epoxy, a powder coating, and a sealant.

16. The method of claim 14 , wherein the ferromagnetic material comprises one of iron particles, nickel particles, cobalt particles, neodymium magnet particles, and rare earth magnetic particles.

17. The method of claim 10 , wherein the contact is fabricated of one of copper, and bronze.

18. The method of claim 17 , wherein the contact is plated with one of gold, copper, tin, and tin-lead.

19. A connector for coupling an add-in card to a printed circuit board, the connector comprising:

a housing configured to be affixed to the printed circuit board and including a slot for retaining the add-in card; and

a contact for a high-speed data communication interface between the printed circuit board and the add-in card, the contact including:

a first portion configured to be coupled to a first component associated with the high-speed data communication interface;

a second portion configured to be coupled to a mating contact of a second component associated with the high-speed data communication interface; and

a third portion configured to provide a sliding surface when coupled to the mating contact, wherein the sliding surface is coated with a ferromagnetic coating.

20. The contact of claim 19 , wherein the sliding surface presents an open-circuit stub when a signal of the high-speed data communication interface is transmitted through the contact.

Assignments (8)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (058014/0560) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 062022/0473 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (057931/0392) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 062022/0382 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (057758/0286) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 061654/0064 →
SECURITY INTEREST Recorded Oct 6, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 058014/0560 →
SECURITY INTEREST Recorded Oct 6, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 057758/0286 →
SECURITY INTEREST Recorded Oct 6, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 057931/0392 →
SECURITY AGREEMENT Recorded Oct 1, 2021
From: DELL PRODUCTS, L.P.; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 057682/0830 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 21, 2021
From: FARKAS, SANDOR; MUTNURY, BHYRAV
To: DELL PRODUCTS, LP
Reel/Frame 056939/0476 →
Continuity (1)
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