IP Library Granted Patent US 12,029,012
Granted Patent B2
US 12,029,012 · App. 17/383,607 · Granted Jul 2, 2024

Fluid immersion cooling system with multiple layers of coolant fluids

Inventors: Yueh Ming Liu (Taipei, TW); Yu Hsiang Huang (Taipei, TW); Yu Chuan Chang (Taipei, TW); Tan Hsin Chang (Taipei, TW); Hsiao Chung Chen (Taipei, TW); Chia-Wei Chen (Taipei, TW); Chih-Ta Chen (Taipei, TW); Cheng-Hung Lin (Taipei, TW); Ming-Te Hsu (Taipei, TW)
Assignee: Super Micro Computer, Inc.
H05K7/203H05K7/20318H05K7/20327
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Quick Facts
Patent No.
US 12,029,012
App. No.
17/383,607
Granted
Jul 2, 2024
Kind
B2
Abstract

A fluid immersion cooling system includes a fluid tank that contains a layer of a dual-phase coolant fluid and one or more layers of single-phase coolant fluids. The dual-phase and single-phase coolant fluids are immiscible, with the dual-phase coolant fluid having a lower boiling point and higher density than a single-phase coolant fluid. A substrate of an electronic system is submerged in the tank such that high heat-generating components are immersed at least in the layer of the dual-phase coolant fluid. Heat from the components is dissipated to the dual-phase coolant fluid to generate vapor bubbles of the dual-phase coolant fluid. The vapor bubbles rise to a layer of a single-phase coolant fluid that is above the layer of the dual-phase coolant fluid. The vapor bubbles condense to droplets of the dual-phase coolant fluid. The droplets fall down into the layer of the dual-phase coolant fluid.

Claims (19)

1. A fluid immersion cooling system comprising:

a fluid tank containing a component of an electronic system;

a layer of a dual-phase coolant fluid in liquid state in the fluid tank, the component of the electronic system being immersed at least in the layer of the dual-phase coolant fluid in the fluid tank;

a layer of a first single-phase coolant fluid in liquid state in the fluid tank, the first single-phase coolant fluid and the dual-phase coolant fluid being immiscible, the layer of the first single-phase coolant fluid being over the layer of the dual-phase coolant fluid,

wherein the dual-phase coolant fluid has a higher density and a lower boiling point than the first single-phase coolant fluid;

wherein the cooling system further comprising: a layer of a second single-phase coolant fluid in the fluid tank,

wherein the second single-phase coolant fluid, the first single-phase coolant fluid, and the dual-phase coolant fluid are immiscible,

wherein the layer of the second single-phase coolant fluid is over the layer of the first single-phase coolant fluid, and

wherein the dual-phase coolant fluid has a higher density and a lower boiling point than the second single-phase coolant fluid.

2. The fluid immersion cooling system of claim 1 , wherein the first single-phase coolant fluid comprises a dielectric oil.

3. The fluid immersion cooling system of claim 1 , wherein the dual-phase coolant fluid comprises a fluorochemical.

4. The fluid immersion cooling system of claim 1 , further comprising:

a cooler unit that is coupled to an outlet and an inlet of the fluid tank, the cooler unit being configured to cool the first single-phase coolant fluid.

5. The fluid immersion cooling system of claim 1 , further comprising:

a condenser that is disposed above the layer of the first single-phase coolant fluid, the condenser being configured to collect and condense vapor bubbles of the dual-phase coolant fluid that have not been contained by the layer of the first single-phase coolant fluid.

6. The fluid immersion cooling system of claim 1 , wherein the component of the electronic system is a central processing unit (CPU).

7. The fluid immersion cooling system of claim 4 , wherein the cooler unit comprises:

a pump that is configured to circulate the first single-phase coolant fluid; and

a heat exchanger that is configured to cool the first single-phase coolant fluid.

Assignments (2)
SECURITY INTEREST Recorded Jan 20, 2026
From: SUPER MICRO COMPUTER, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 074447/0643 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 10, 2021
From: LIU, YUEH MING; HUANG, YU HSIANG; CHANG, YU CHUAN; CHANG, TAN HSIN; CHEN, HSIAO CHUNG; CHEN, CHIA-WEI; CHEN, CHIH-TA; LIN, CHENG-HUNG; HSU, MING-TE
To: SUPER MICRO COMPUTER, INC.
Reel/Frame 057134/0066 →
Continuity (1)
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