IP Library Granted Patent US 11,490,185
Granted Patent B2
US 11,490,185 · App. 17/388,326 · Granted Nov 1, 2022

Electronic device

Inventors: Wenjin Niu (Kanagawa, JP); Jun Iwasaki (Kanagawa, JP); Toshikazu Horino (Kanagawa, JP); Toshinari Sumikawa (Kanagawa, JP); Shigehiro Horiuchi (Kanagawa, JP); Takehito Yamauchi (Kanagawa, JP); Yalu Liu (Kanagawa, JP); Keita Ishikawa (Kanagawa, JP)
Assignee: Lenovo (Singapore) Pte. Ltd.
H04R1/04H04R19/04
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Quick Facts
Patent No.
US 11,490,185
App. No.
17/388,326
Granted
Nov 1, 2022
Kind
B2
Abstract

An electronic device includes a chassis, a microphone hole penetrating an outer wall of the chassis, and a microphone module that faces the microphone hole. The microphone module has a microphone that obtains sound information outside the chassis through the microphone hole, a flexible substrate laminated on a back surface of the microphone, a metallic plate laminated on a back surface of the flexible substrate, and a sound hole opened in the back surface of the microphone and penetrating the flexible substrate and the metallic plate. The electronic device further includes a double-sided tape fastened to a first region, surrounding the sound hole, of a back surface of the metallic plate, and to an inner surface of the chassis, and that fixes the microphone module to the chassis, and a conductive member that electrically connects the second region of the metallic plate and the inner surface of the chassis.

Claims (44)

1. An electronic device comprising:

a chassis;

a microphone hole that penetrates an outer wall of the chassis and communicates an inside and an outside of the chassis; and

a microphone module provided in the chassis and disposed so as to face the microphone hole, wherein

the microphone module has:

a microphone that obtains sound information outside the chassis through the microphone hole;

a flexible substrate laminated on a back surface of the microphone and mounted with the microphone;

a metallic plate laminated on a back surface of the flexible substrate; and

a sound hole opened in the back surface of the microphone and penetrating the flexible substrate and the metallic plate, and

the electronic device further comprises:

a double-sided tape fastened to a first region, surrounding the sound hole, of a back surface of the metallic plate, and to an inner surface of the chassis, and that fixes the microphone module to the chassis; and

a conductive member that electrically connects a second region, except the first region, of the metallic plate and the inner surface of the chassis.

2. The electronic device according to claim 1 , wherein

the metallic plate has a projecting part that projects from an outer edge of the flexible substrate, and

the conductive member is connected between a front surface of the projecting part and the inner surface of the chassis.

3. The electronic device according to claim 2 , wherein the conductive member is composed of a metallic sheet stuck both to the front surface of the projecting part and to the inner surface of the chassis.

4. The electronic device according to claim 2 , further comprising:

a display mounted on the chassis, wherein

the microphone module is disposed between an outer peripheral end surface of the display and the outer wall of the chassis, and

the metallic plate extends along the outer peripheral end surface of the display.

5. An electronic device comprising:

a chassis;

a microphone hole penetrating an outer wall of the chassis and communicating an inside and an outside of the chassis; and

a microphone module provided in the chassis and disposed so as to face the microphone hole, wherein

the microphone module has:

a microphone that obtains sound information outside the chassis through the microphone hole;

a flexible substrate laminated on a back surface of the microphone and mounted with the microphone;

a metallic plate laminated on a back surface of the flexible substrate; and

a sound hole opened in the back surface of the microphone and penetrating the flexible substrate and the metallic plate, and

the electronic device further comprises:

a double-sided tape fastened to a first region, surrounding the sound hole, of a back surface of the metallic plate, and to an inner surface of the chassis, and that fixes the microphone module to the chassis; and

a conductive member installed between a second region, except the first region, of the back surface of the metallic plate, and the inner surface of the chassis, and that electrically connects the second region and the inner surface of the chassis.

6. The electronic device according to claim 5 , wherein

the conductive member is a conductive double-sided tape whose thickness is thicker than the double-sided tape, and

the conductive double-sided tape is compressed to be installed between the second region and the inner surface of the chassis.

7. The electronic device according to claim 6 , wherein

the conductive member is a conductive double-sided tape whose thickness is thicker than the double-sided tape and less than or equal to 110% of the thickness of the double-sided tape, and

the conductive double-sided tape is compressed to be installed between the second region and the inner surface of the chassis.

8. The electronic device according to claim 5 , wherein

the conductive member is composed of a conductive double-sided tape whose thickness is thinner than the double-sided tape,

a metallic sheet is stuck to the inner surface of the chassis, and

the metallic sheet has a non-adhesive region not to be stuck to the inner surface of the chassis in a range overlapping the conductive double-sided tape.

9. The electronic device according to claim 5 , wherein the conductive member is composed of a metallic sheet fastened both to the back surface of the metallic plate and to the inner surface of the chassis.

10. The electronic device according to claim 9 , wherein the metallic sheet has, in a state of being folded into a U-shape, one end part of the U-shape fastened to the back surface of the metallic plate and another end part of the U-shape fastened to the inner surface of the chassis.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 20, 2025
From: LENOVO PC INTERNATIONAL LIMITED
To: LENOVO SWITZERLAND INTERNATIONAL GMBH
Reel/Frame 070269/0092 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 19, 2025
From: LENOVO (SINGAPORE) PTE LTD.
To: LENOVO PC INTERNATIONAL LIMITED
Reel/Frame 070269/0019 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 17, 2021
From: NIU, WENJIN; IWASAKI, JUN; HORINO, TOSHIKAZU; SUMIKAWA, TOSHINARI; HORIUCHI, SHIGEHIRO; YAMAUCHI, TAKEHITO; LIU, YALU; ISHIKAWA, KEITA
To: LENOVO (SINGAPORE) PTE. LTD.
Reel/Frame 057202/0836 →
Priority Claims (1)
JP JP2020-199385 · Dec 1, 2020 · national
Continuity (1)
Related Publication 20220174386A1 · Jun 2, 2022
Cited By (1)
US 12,287,682