IP Library Granted Patent US 11,514,933
Granted Patent B1
US 11,514,933 · App. 17/398,714 · Granted Nov 29, 2022

Method to enhance magnetic strength and robustness of rear hard bias for dual free layer read

Inventors: Chen-Jung Chien (Mountain View, CA); Ming Mao (Dublin, CA); Daniele Mauri (San Jose, CA)
Assignee: Western Digital Technologies, Inc.
G11B5/3932G11B5/398G11B5/3912G11B5/3945
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Quick Facts
Patent No.
US 11,514,933
App. No.
17/398,714
Granted
Nov 29, 2022
Kind
B1
Abstract

The present disclosure generally relates to read heads having dual free layer (DFL) sensors. The read head has a sensor disposed between two shields. The sensor is a DFL sensor and has a surface at the media facing surface (MFS). Recessed from the DFL sensor, and from the MFS, is a rear hard bias (RHB) structure. The RHB structure is disposed between the shields as well. In between the DFL sensor and the RHB structure is insulating material. The RHB is disposed on the insulating material. The RHB includes a RHB seed layer as well as a RHB bulk layer. The RHB bulk layer includes a first bulk layer and a second bulk layer, the first bulk layer having a different density relative to the second bulk layer.

Claims (22)

1. A magnetic read head, comprising:

a first shield;

a second shield spaced from the first shield;

a sensor disposed between the first shield and the second shield; and

a rear hard bias (RHB) structure disposed between the first shield and the second shield, and recessed from a media facing surface (MFS), wherein the RHB structure comprises:

a seed layer;

a first bulk layer comprising a first RHB density; and

a second bulk layer comprising a second RHB density, wherein the first RHB density is different from the second RHB density.

2. The magnetic read head of claim 1 , wherein the RHB structure comprises an RHB coercivity (Hcr) of about 3100 Oersted (Oe) to about 3200 Oe as measured at a total bulk thickness of the first and second bulk layer of about 225 Å to about 265 Å.

3. The magnetic read head of claim 1 , wherein the RHB structure comprises a remnant magnetization thickness (Mrt) of about 1.7 to about 1.8 memu/cm 2 , as measured at a total bulk thickness of the first and second bulk layer of about 225 Å to about 265 Å.

4. The magnetic read head of claim 3 , wherein the RHB structure comprises having a squareness (S′) of about 0.825 to about 0.875, as measured at a total bulk thickness of the first and second bulk layer of about 225 Å to about 265 Å.

5. The magnetic read head of claim 1 , wherein a second thickness of the second bulk layer is about 4 to 15 times of a first thickness of the first bulk layer.

6. The magnetic read head of claim 5 , wherein the first thickness of the first bulk layer is about 15 Å to about 45 Å and the second thickness of the second bulk layer is about 200 Å to about 230 Å, wherein a total bulk thickness of the first and second bulk layer is about 225 Å to about 265 Å.

7. The magnetic read head of claim 1 , wherein the first RHB density is lower than the second RHB density.

8. The magnetic read head of claim 1 , wherein the second bulk layer is closer to the second shield as compared to the first bulk layer relative to the second shield.

9. The magnetic read head of claim 1 , wherein the first bulk layer and the second bulk layer each comprise CoPt.

10. The magnetic read head of claim 1 , wherein the RHB seed layer is selected from the group consisting of tantalum (Ta), tungsten (W), combinations thereof, and alloys thereof.

11. The magnetic read head of claim 1 , wherein the seed layer comprises a multilayer structure and wherein the multilayer structure has a collective thickness of about 26 Å to about 46 Å.

12. The magnetic read head of claim 11 , wherein the seed layer comprises:

a first seed layer comprising a first seed thickness of about 11 Å to about 20 Å; and

a second seed layer comprising a second seed thickness of about 15 Å to about 26 Å.

13. A magnetic recording device comprising the magnetic read head of claim 1 .

Assignments (5)
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
RELEASE OF SECURITY INTEREST AT REEL 058426 FRAME 0815 Recorded Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 058965/0679 →
SECURITY INTEREST Recorded Dec 9, 2021
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS AGENT
Reel/Frame 058426/0815 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 10, 2021
From: CHIEN, CHEN-JUNG; MAO, MING; MAURI, DANIELE
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 057139/0624 →