Fingerprint sensor and button combinations and methods of making same
A biometric sensor may comprise a plurality of a first type of signal traces formed on a first surface of a first layer of a multi-layer laminate package; at least one trace of a second type, formed on a second surface of the first layer or on a first surface of a second layer of the multi-layer laminate package; and connection vias in at least the first layer electrically connecting the signal traces of the first type or the signal traces of the second type to respective circuitry of the respective first or second type contained in an integrated circuit physically and electrically connected to one of the first layer, the second layer or a third layer of the multi-layer laminate package.
1. A sensor assembly, comprising:
a flexible substrate; and
an encapsulated sensor package mounted on the flexible substrate;
wherein the encapsulated sensor package comprises:
an upper circuit board layer, wherein a first plurality of traces is disposed on an upper surface of the upper circuit board layer and a second plurality of traces is disposed on a lower surface of the upper circuit board layer;
a core layer, disposed below the upper circuit board layer; and
a lower circuit board layer, disposed below the core layer, wherein a third plurality of traces is disposed on an upper surface of the lower circuit board layer and a fourth plurality of traces is disposed on a lower surface of the lower circuit board layer;
wherein the encapsulated sensor package further comprises a plurality of connection vias which traverse the core layer and are electrically connected to the second plurality of traces of the upper circuit board layer and the third plurality of traces of the lower circuit board layer.
2. The sensor assembly according to claim 1 , wherein the encapsulated sensor package further comprises:
an integrated circuit, disposed below the lower circuit board layer, wherein the first plurality of traces and the second plurality of traces are electrically connected to the integrated circuit through the plurality of connection vias.
3. The sensor assembly according to claim 1 , wherein the first plurality of traces comprise drive signal traces; and
wherein the second plurality of traces comprise receive signal traces.
4. The sensor assembly according to claim 1 , wherein the sensor assembly is disposed within an opening in a mobile device housing, and a top surface of the encapsulated sensor package is flush with an outer surface of the mobile device housing.
5. The sensor assembly according to claim 1 , wherein the sensor assembly further comprises a switch, wherein the switch is configured to be depressed based on an input object being pressed against the encapsulated sensor package.
6. The sensor assembly according to 5 , wherein the flexible substrate is configured to flex based on the input object being pressed against a top surface of the encapsulated sensor package, and wherein the sensor assembly further comprises one or more stops configured to limit flexing of the flexible substrate.
7. The sensor assembly according to claim 5 , wherein the switch comprises:
a depression member; and
a toggling two position element;
wherein the depression member and the toggling two position element being in contact with one another corresponds to a closed state of the switch, and the depression member and the toggling two position element not being in contact with one another corresponds to an open state of the switch.
8. A method for manufacturing a sensor assembly, the method comprising:
providing a flexible substrate; and
mounting an encapsulated sensor package on the flexible substrate;
wherein the encapsulated sensor package comprises:
an upper circuit board layer, wherein a first plurality of traces is disposed on an upper surface of the upper circuit board layer and a second plurality of traces is disposed on a lower surface of the upper circuit board layer;
a core layer, disposed below the upper circuit board layer; and
a lower circuit board layer, disposed below the core layer, wherein a third plurality of traces is disposed on an upper surface of the lower circuit board layer and a fourth plurality of traces is disposed on a lower surface of the lower circuit board layer;
wherein the encapsulated sensor package further comprises a plurality of connection vias which traverse the core layer and are electrically connected to the second plurality of traces of the upper circuit board layer and the third plurality of traces of the lower circuit board layer.
9. The method according to claim 8 , wherein the encapsulated sensor package further comprises:
an integrated circuit, disposed below the lower circuit board layer, wherein the first plurality of traces and the second plurality of traces are electrically connected to the integrated circuit through the plurality of connection vias.
10. The method according to claim 8 , wherein the first plurality of traces comprise drive signal traces; and
wherein the second plurality of traces comprise receive signal traces.
11. The method according to claim 8 , further comprising:
providing a switch, wherein the switch is configured to be depressed based on an input object being pressed against the encapsulated sensor package.
12. The method according to claim 11 , wherein the flexible substrate is configured to flex based on the input object being pressed against a top surface of the encapsulated sensor package; and
wherein the method further comprises providing one or more stops configured to limit flexing of the flexible substrate.
13. The method according to claim 11 , wherein the switch comprises:
a depression member; and
a toggling two position element;
wherein the depression member and the toggling two position element being in contact with one another corresponds to a closed state of the switch, and the depression member and the toggling two position element not being in contact with one another corresponds to an open state of the switch.
14. The method according to claim 8 , further comprising:
locating the sensor assembly within an opening in a mobile device housing such that a top surface of the encapsulated sensor package is flush with an outer surface of the mobile device housing.