Apparatuses for executing a direct transfer of a semiconductor device die disposed on a first substrate to a second substrate
An apparatus for executing a direct transfer of a semiconductor device die from a first substrate to a second substrate. The apparatus includes a first substrate conveyance mechanism movable in two axes. A micro-adjustment mechanism is coupled with the first substrate conveyance mechanism and is configured to hold the first substrate and to make positional adjustments on a scale smaller than positional adjustments caused by the first substrate conveyance mechanism. The micro-adjustment mechanism includes a micro-adjustment actuator having a distal end and a first substrate holder frame that is movable via contact with the distal end of the micro-adjustment actuator. A second frame is configured to secure the second substrate such that a transfer surface is disposed facing the semiconductor device die disposed on a surface of the first substrate. A transfer mechanism is configured to press the semiconductor device die into contact with the transfer surface of the substrate.
1. An apparatus for executing a direct transfer of a semiconductor device die disposed on a first substrate to a second substrate, the apparatus comprising:
a substrate conveyance mechanism to make macro positional adjustments of the first substrate;
a micro-adjustment mechanism coupled with the substrate conveyance mechanism, the micro-adjustment mechanism configured to hold the first substrate and to make micro positional adjustments of the first substrate, and the micro-adjustment mechanism including:
a micro-adjustment actuator having a movable distal end, and
a substrate holder frame configured to secure the first substrate, and the substrate holder frame being secured to a slide plate that is movable via contact with the distal end of the micro-adjustment actuator;
a substrate frame configured to secure the second substrate such that a transfer surface of the second substrate is disposed facing the semiconductor device die disposed on the first substrate; and
a transfer mechanism configured to press on the first substrate and transfer the semiconductor device die to the second substrate.
2. The apparatus according to claim 1 , wherein the micro-adjustment actuator is a first a micro-adjustment actuator,
wherein the slide plate is a first slide plate of the micro-adjustment mechanism and is positionally adjustable in a first direction, and
wherein the micro-adjustment mechanism further includes:
a second slide plate that is positionally adjustable in a second direction that is transverse to the first direction, and
a second micro-adjustment actuator having a movable distal end that is disposed to contact and adjust a position of the second slide plate.
3. The apparatus according to claim 2 , wherein the first slide plate and the second slide plate are interconnected by a pair of parallel rails such that the second slide plate is movable with respect to the first slide plate in a linear direction.
4. The apparatus according to claim 2 , wherein the micro-adjustment mechanism further includes:
a first compressive bumper disposed on a side of the first slide plate opposite the first micro-adjustment actuator to stop the first slide plate after actuation of the first micro-adjustment actuator, and
a second compressive bumper disposed on a side of the second slide plate opposite the second micro-adjustment actuator to stop the second slide plate after actuation of the second micro-adjustment actuator.
5. The apparatus according to claim 1 , wherein the substrate conveyance mechanism is movable in at least two directions.
6. The apparatus according to claim 1 , wherein the micro-adjustment actuator is configured to make positional adjustments ranging between 0.5 micron to 5000 microns.
7. The apparatus according to claim 1 , wherein the micro-adjustment actuator is configured to make positional adjustments ranging between 1 micron to 1000 microns.
8. The apparatus according to claim 1 , wherein the micro-adjustment actuator is configured to make positional adjustments ranging between 5 microns to 50 microns.
9. An apparatus for executing a direct transfer of a semiconductor device die disposed on a first substrate to a second substrate, the apparatus comprising:
a substrate conveyance mechanism configured to move in one or more directions to convey the first substrate in macro positional adjustments;
a micro-adjustment mechanism coupled with the substrate conveyance mechanism, the micro-adjustment mechanism configured to further convey the first substrate in micro positional adjustments with respect to the substrate conveyance mechanism, and the micro-adjustment mechanism including:
one or more micro-adjustment actuators having a movable distal end, and
a substrate holder frame configured to secure the first substrate to be movable via actuation of the one or more micro-adjustment actuators;
a substrate frame configured to secure the second substrate such that a transfer surface of the second substrate is disposed facing the semiconductor device die disposed on the first substrate; and
a transfer member that is actuatable to press on the first substrate and transfer the semiconductor device die to the second substrate.
10. The apparatus according to claim 9 , wherein the one or more micro-adjustment actuators are controlled to counteract locational inaccuracies of the macro positional adjustments.
11. The apparatus according to claim 9 , wherein the micro-adjustment mechanism is configured to adjust a position of the first substrate with respect to the substrate conveyance mechanism while the substrate conveyance mechanism is in motion.
12. The apparatus according to claim 11 , wherein the motion of the substrate conveyance mechanism is vibrational motion created when the substrate conveyance mechanism stops after a macro positional adjustment.
13. The apparatus according to claim 11 , wherein the motion of the substrate conveyance mechanism is motion created when the substrate conveyance mechanism moves continuously in during the macro positional adjustments.