IP Library Granted Patent US 12,472,731
Granted Patent B2
US 12,472,731 · App. 17/406,184 · Granted Nov 18, 2025

Thermoset sealant film

Inventors: Hyo Chang (Chris) Yun (Fremont, CA); Lei Wang (Fremont, CA)
Assignee: TE CONNECTIVITY SOLUTIONS GmbH
B32B27/18B29C65/485B32B27/08B32B27/38H01R13/5216B29K2663/00B32B2250/24B32B2307/31B32B2457/00B32B2581/00
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Quick Facts
Patent No.
US 12,472,731
App. No.
17/406,184
Granted
Nov 18, 2025
Kind
B2
Abstract

A thermoset sealant film includes an epoxy and a hardener. The hardener is integrated with the epoxy and remains physically distinct from the epoxy in a formed state of the thermoset sealant film.

Claims (9)

1 . A thermoset sealant film, comprising:

an epoxy; and

a hardener integrated with the epoxy and remaining physically distinct from the epoxy in a formed state of the thermoset sealant film, the hardener is formed as a hardener film and the epoxy is formed as an epoxy film, the hardener film is attached to the epoxy film to form the thermoset sealant film in the formed state, a gap is disposed between the hardener film and the epoxy film in the formed state, the thermoset sealant film enters a melting state at which the epoxy is mixable with the hardener at a melting temperature less than or equal to 100° C., the epoxy and the hardener remain in a solid state at room temperature, the hardener is mixed with the epoxy and is no longer physically distinct from the epoxy in a cured state of the thermoset sealant film, the mixture of the hardener and the epoxy exhibits thermoset qualities and cures to the cured state when the mixture is held above 100° C., the thermoset sealant film in the cured state remains in a solid phase up to an operating temperature of approximately 200° C.

2 . The thermoset sealant film of claim 1 , wherein the hardener film includes a polymeric binder, a hardener material, and a catalyst.

3 . The thermoset sealant film of claim 2 , wherein the polymeric binder is greater than or equal to 10% and less than or equal to 80% of a material composition of the hardener film by weight.

4 . The thermoset sealant film of claim 3 , wherein the hardener material is greater than or equal to 20% and less than or equal to 80% of the material composition of the hardener film by weight.

5 . The thermoset sealant film of claim 4 , wherein the catalyst is greater than or equal to 0.1% and less than or equal to 1% of the material composition of the hardener film by weight.

6 . The thermoset sealant film of claim 1 , wherein a ratio of a weight of the epoxy film to a weight of the hardener film is greater than or equal to 0.9 and less than or equal to 1.1.

7 . The thermoset sealant film of claim 1 , wherein the epoxy film is one of a pair of epoxy films with the hardener film disposed between the epoxy films or the hardener film is one of a pair of hardener films with the epoxy film disposed between the hardener films.

Assignments (2)
MERGER Recorded Jun 7, 2022
From: TE CONNECTIVITY SERVICES GMBH
To: TE CONNECTIVITY SOLUTIONS GMBH
Reel/Frame 060305/0923 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 19, 2021
From: WANG, LEI; YUN, HYO CHANG (CHRIS)
To: TE CONNECTIVITY SERVICES GMBH
Reel/Frame 057224/0572 →
Continuity (1)
Related Publication 20230054693A1 · Feb 23, 2023
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