IP Library Granted Patent US 11,910,583
Granted Patent B2
US 11,910,583 · App. 17/406,586 · Granted Feb 20, 2024

Electromagnetic wave absorption structure

Inventor: Feng-Yu Wu (Taipei, TW)
Assignee: BLACK SOLUTION NANOTECH CO., LTD.
H05K9/0084B32B9/007H01Q17/002H05K9/009H05K9/0088B32B2250/42B32B2307/206B32B2307/212B32B2307/732B32B2571/00
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Quick Facts
Patent No.
US 11,910,583
App. No.
17/406,586
Granted
Feb 20, 2024
Kind
B2
Abstract

An electromagnetic wave absorption structure includes at least one electromagnetic wave composite absorbing layer. The electromagnetic wave composite absorbing layer includes a conductive composite layer and an insulating layer. The insulating layer is stacked and overlapped with the conductive composite layer. The electromagnetic wave absorption structure can provide good electromagnetic wave absorption function, and have the features of light and thin, so it is particularly suitable for satisfying the electromagnetic wave absorption or shielding requirements of thin electronic products.

Claims (30)

1. An electromagnetic wave absorption structure, comprising:

at least one electromagnetic wave composite absorbing layer;

wherein the electromagnetic wave composite absorbing layer comprises a conductive composite layer and an insulating layer, and the insulating layer is stacked and overlapped with the conductive composite layer,

wherein the conductive composite layer comprises a plurality of conductive layers and a plurality of interlayer insulating layers, and the conductive layers and the interlayer insulating layers are stacked in a staggered manner,

wherein the conductive layer is a graphene layer, a graphite layer, a graphite nanoplatelet layer or a carbon nanotube layer, and

wherein the insulating layer or one of the interlayer insulating layers is a resin/ceramic mixture layer being formed by a ceramic powder mixed into a polymer resin, or a resin/metal mixture layer being formed by a metal powder or the metal powder that has undergone insulation treatment mixed into a polymer resin.

2. The electromagnetic wave absorption structure of claim 1 , wherein a thickness of the electromagnetic wave absorption structure is between 5 μm and 5000 μm.

3. The electromagnetic wave absorption structure of claim 1 , wherein a thickness of the conductive composite layer is between 1 μm and 100 μm.

4. The electromagnetic wave absorption structure of claim 1 , wherein a thickness of the insulating layer is between 0.1 μm and 200 μm.

5. The electromagnetic wave absorption structure of claim 1 , wherein amounts of the conductive layers and the interlayer insulating layers in the conductive composite layer are different.

6. The electromagnetic wave absorption structure of claim 1 , wherein a thickness of the conductive layer is between 5 nm and 200 nm.

7. The electromagnetic wave absorption structure of claim 1 , wherein a thickness of the interlayer insulating layer is between 5 nm and 10000 nm.

8. The electromagnetic wave absorption structure of claim 1 , wherein a sheet resistance of the conductive layer is between 10 ohm per square and 1000 ohm per square.

9. The electromagnetic wave absorption structure of claim 1 , wherein the electromagnetic wave absorption structure comprises at least two electromagnetic wave composite absorbing layers stacked and overlapped with each other.

10. The electromagnetic wave absorption structure of claim 9 , wherein amounts of the conductive layers and the interlayer insulating layers in the conductive composite layer are different.

11. An electromagnetic wave absorption structure, comprising:

at least one electromagnetic wave composite absorbing layer,

wherein the electromagnetic wave composite absorbing layer comprises a conductive composite layer and an insulating layer, and the insulating layer is stacked and overlapped with the conductive composite layer,

wherein the conductive composite layer comprises a plurality of conductive layers and a plurality of interlayer insulating layers, and the conductive layers and the interlayer insulating layers are stacked in a staggered manner,

wherein the conductive layer is a graphene layer, a graphite layer, a graphite nanoplatelet layer or a carbon nanotube layer, and

wherein the interlayer insulating layer comprises epoxy resin mixed with boron nitride, the insulating layer comprises epoxy resin mixed with iron oxide.

12. The electromagnetic wave absorption structure of claim 11 , wherein a thickness of the electromagnetic wave absorption structure is between 5 μm and 5000 μm.

13. The electromagnetic wave absorption structure of claim 11 , wherein a thickness of the conductive composite layer is between 1 μm and 100 μm.

14. The electromagnetic wave absorption structure of claim 11 , wherein a thickness of the insulating layer is between 0.1 μm and 200 μm.

15. The electromagnetic wave absorption structure of claim 11 , wherein amounts of the conductive layers and the interlayer insulating layers in the conductive composite layer are different.

16. The electromagnetic wave absorption structure of claim 11 , wherein a thickness of the conductive layer is between 5 nm and 200 nm.

17. The electromagnetic wave absorption structure of claim 11 , wherein a thickness of the interlayer insulating layer is between 5 nm and 10000 nm.

18. The electromagnetic wave absorption structure of claim 11 , wherein a sheet resistance of the conductive layer is between 10 ohm per square and 1000 ohm per square.

19. The electromagnetic wave absorption structure of claim 11 , wherein the electromagnetic wave absorption structure comprises at least two electromagnetic wave composite absorbing layers stacked and overlapped with each other.

20. The electromagnetic wave absorption structure of claim 19 , wherein amounts of the conductive layers and the interlayer insulating layers in the conductive composite layer are different.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 20, 2021
From: WU, FENG-YU
To: BLACK SOLUTION NANOTECH CO., LTD.
Reel/Frame 057252/0544 →
Priority Claims (1)
TW 109134116 · Sep 30, 2020 · national
Continuity (1)
Related Publication 20220104408A1 · Mar 31, 2022