IP Library Granted Patent US 11,777,201
Granted Patent B2
US 11,777,201 · App. 17/408,195 · Granted Oct 3, 2023

Apparatus, system, and method for transferring radio frequency signals between waveguides and radiating elements in antennas

Inventors: Qi Tang (Los Angeles, CA); Srishti Saraswat (Santa Clara, CA); Farbod Tabatabai (San Francisco, CA)
Assignee: Meta Platforms, Inc.
H01Q1/38H01Q13/10H01Q21/0006H01Q23/00
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Quick Facts
Patent No.
US 11,777,201
App. No.
17/408,195
Granted
Oct 3, 2023
Kind
B2
Abstract

A radio frequency coupling structure comprising (1) a substrate that forms a top side of a waveguide, (2) a first conductive layer disposed on a bottom side of the substrate, (3) a second conductive layer incorporated within the substrate, (4) a through via that is communicatively coupled to the first conductive layer and extends through an opening in the second conductive layer toward a top side of the substrate, and/or (5) a ring slot formed around the through via in the first conductive layer. Various other apparatuses, systems, and methods are also disclosed.

Claims (49)

1. A radio frequency coupling structure comprising:

a substrate that forms a top side of a waveguide;

a first conductive layer disposed on a bottom side of the substrate;

a second conductive layer incorporated within the substrate;

a through via that is communicatively coupled to the first conductive layer and extends through an opening in the second conductive layer toward a top side of the substrate; and

a ring slot formed around the through via in the first conductive layer.

2. The radio frequency coupling structure of claim 1 , further comprising a plurality of cavity vias communicatively coupled between the first conductive layer and the second conductive layer.

3. The radio frequency coupling structure of claim 2 , wherein the cavity vias are arranged radially around the ring slot and the through via within the substrate.

4. The radio frequency coupling structure of claim 2 , wherein the top side of the substrate is coupled to a radiating element configured to radiate energy in accordance with radio frequency signals traversing the waveguide.

5. The radio frequency coupling structure of claim 1 , wherein the ring slot exposes the substrate to the waveguide.

6. The radio frequency coupling structure of claim 1 , wherein the ring slot comprises a whole annular slot that completely encompasses the through via in the first conductive layer.

7. The radio frequency coupling structure of claim 1 , wherein the ring slot:

encompasses a majority of the through via in the first conductive layer; and

includes a break in which conductive material from the first conductive layer remains.

8. The radio frequency coupling structure of claim 7 , further comprising an additional ring slot formed around the through via and the ring slot in the first conductive layer, wherein the additional ring slot exposes the substrate to the waveguide.

9. The radio frequency coupling structure of claim 8 , wherein the additional ring slot:

encompasses a majority of the through via in the first conductive layer;

encompasses a majority of the ring slot; and

includes an additional break in which conductive material from the first conductive layer remains.

10. The radio frequency coupling structure of claim 9 , wherein:

the ring slot is oriented such that the break faces a specific direction relative to the through via; and

the additional ring slot is oriented such that the additional break faces the specific direction relative to the through via.

11. The radio frequency coupling structure of claim 9 , wherein:

the ring slot is oriented such that the break faces a specific direction relative to the through via; and

the additional ring slot is oriented such that the additional break faces an additional direction relative to the through via, wherein the additional direction is substantially opposite the specific direction.

12. An antenna comprising:

a bottom Radio Frequency (RF) guide plate rotatably coupled to a base via a first shaft controlled by an azimuth motor;

a top array plate rotatably coupled to the base via a second shaft controlled by an elevation motor, the top array plate and the bottom RF guide plate collectively forming a waveguide configured to direct radio frequency signals in a specific direction; and

a plurality of radio frequency coupling structures disposed on a substrate of the top array plate, the plurality of radio frequency coupling structures comprising:

a first conductive layer disposed on a bottom side of the substrate;

a second conductive layer incorporated within the substrate;

a through via that is communicatively coupled to the first conductive layer and extends through an opening in the second conductive layer toward a top side of the substrate; and

a ring slot formed around the through via in the first conductive layer.

13. The antenna of claim 12 , wherein the plurality of radio frequency coupling structures comprise a plurality of cavity vias communicatively coupled between the first conductive layer and the second conductive layer.

14. The antenna of claim 13 , wherein the cavity vias are arranged radially around the ring slot and the through via within the substrate.

15. The antenna of claim 12 , wherein the top side of the substrate is coupled to a radiating element configured to radiate energy in accordance with radio frequency signals traversing the waveguide.

16. The antenna of claim 12 , wherein the ring slot exposes the substrate to the waveguide.

17. A method comprising:

fabricating, on a substrate that forms a top side of a waveguide, a through via that is communicatively coupled to a first conductive layer disposed on a bottom side of the substrate;

extending the through via from the first conductive layer through an opening in a second conductive layer incorporated within the substrate toward a top side of the substrate;

fabricating, in the first conductive layer, a ring slot that substantially surrounds the through via and exposes the substrate to the waveguide; and

fabricating a plurality of cavity vias that:

are communicatively coupled between the first conductive layer and the second conductive layer; and

are arranged radially around the ring slot and the through via within the substrate.

18. The method of claim 17 , further comprising coupling the top side of the substrate to a radiating element configured to radiate energy in accordance with radio frequency signals traversing the waveguide.

19. The method of claim 17 , wherein fabricating the ring slot comprises fabricating a whole annular slot that completely encompasses the through via in the first conductive layer.

20. The method of claim 17 , wherein fabricating the ring slot comprises fabricating the ring slot to:

encompass a majority of the through via in the first conductive layer; and

include a break in which conductive material from the first conductive layer remains.

Assignments (2)
CHANGE OF NAME Recorded Jan 11, 2022
From: FACEBOOK, INC.
To: META PLATFORMS, INC.
Reel/Frame 058685/0901 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 18, 2021
From: TANG, QI; SARASWAT, SRISHTI; TABATABAI, FARBOD
To: FACEBOOK, INC.
Reel/Frame 057812/0356 →
Continuity (2)
Provisional Application 63074339 · Sep 3, 2020
Related Publication 20220069455A1 · Mar 3, 2022