IP Library Granted Patent US 11,778,768
Granted Patent B2
US 11,778,768 · App. 17/408,312 · Granted Oct 3, 2023

High-speed performance electrical connector for modular electronics systems

Inventors: Richard G. Baldwin, Jr. (Austin, TX); Dennis Vance Toth (Austin, TX)
Assignee: National Instruments Corporation
H05K7/1424G06F1/183H01R12/7005H05K7/1454H05K7/1488H05K2201/044
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Quick Facts
Patent No.
US 11,778,768
App. No.
17/408,312
Granted
Oct 3, 2023
Kind
B2
Abstract

A connector gap between a module connector mating surface and the backplane connector of a chassis may be eliminated through a mechanism that forcefully pushes (or pulls) the module towards the backplane and/or forcefully pushes (or pulls) the backplane toward the module. A spring-loaded or resilient element may be used to fasten the module in a way that effectively fills any designed-in and tolerance-induced gap in the connector interface, allowing the connector to fully seat. In addition, a gasket or other compressible member may be included at the connector mating interface. The gap in the connector interface may be reduced by introducing adjustable card cage members that are capable of being set during the assembly or manufacturing process using special alignment fixtures. The gap in the connector interface may also be reduced by introducing a higher tolerance capable manufacturing process, such as machining, to the card cage sub-assembly.

Claims (43)

1. A mechanism for connecting a module to a chassis, the mechanism comprising:

a plug configured to couple the module to the chassis;

wherein the plug comprises a compressible gap filling material configured to fill an air gap between an end of a connector inserted into the plug and a back surface of the plug to meet signal performance acceptance criteria; and

an element configured to move the module towards a backplane of the chassis to effectively reduce or eliminate a designed-in and/or tolerance-induced gap between the end of the connector of the module and the back surface of the plug when the connector is inserted into the plug,

wherein the element comprises a first spring-loaded plunger assembly configured at a top end of the chassis and a second spring-loaded plunger assembly configured at a bottom end of the chassis.

2. The mechanism of claim 1 , wherein the mechanism further comprises a module front panel-to-chassis ground.

3. The mechanism of claim 1 ,

wherein the first spring-loaded plunger assembly and the second spring-loaded plunger assembly each include a plunger which, when engaged, pushes the module into a fully seated position in the plug.

4. The mechanism of claim 1 , wherein the mechanism further comprises a grounding gasket for each spring-loaded plunger assembly, wherein the grounding gasket takes up any remaining gap between a front panel of the module and the chassis.

5. The mechanism of claim 1 , wherein the mechanism further comprises an ejector handle that includes a member configured to provide a positive mating pressure on the module when the connector is inserted into the plug;

wherein the ejector handle is configured to unseat the module from the plug when the ejector handle is in an eject position.

6. The mechanism of claim 5 , wherein the mechanism further comprises a second ejector handle that includes a member configured to provide a positive mating pressure on the module when the connector is inserted into the plug, wherein the ejector handle is configured at the top end of the chassis and the second ejector handle is configured at the bottom end of the chassis.

7. A chassis comprising:

one or more plugs, each plug configured to couple a respective module to the chassis;

wherein at least one of the one or more plugs comprises a compressible gap filling material configured to fill an air gap between an end of a connector inserted into the plug and a back surface of the at least one plug to meet signal performance acceptance criteria; and

a respective mechanism for connecting each respective module to the chassis via a corresponding plug of the one or more plugs,

each respective mechanism comprising:

an element configured to move the respective module towards a backplane of the chassis to effectively reduce or eliminate a designed-in and/or tolerance-induced gap between an end of a connector of the respective module and a back surface of the corresponding plug when the connector is inserted into the corresponding plug,

wherein the element comprises a first spring-loaded plunger assembly configured at a top end of the chassis and a second spring-loaded plunger assembly configured at a bottom end of the chassis.

8. The chassis of claim 7 , wherein each respective mechanism further comprises a respective module front panel-to-chassis ground.

9. The chassis of claim 7 ,

wherein the first spring-loaded plunger assembly and the second spring-loaded plunger assembly each include a plunger which, when engaged, pushes the respective module into a fully seated position in the corresponding plug.

10. The chassis of claim 7 , wherein each respective mechanism further comprises a grounding gasket for each spring-loaded plunger assembly, wherein the grounding gasket takes up any remaining gap between a front panel of the respective module and the chassis.

11. The chassis of claim 7 , wherein each respective mechanism further comprises an ejector handle that includes a member configured to provide a positive mating pressure on the respective module when the connector is inserted into the corresponding plug;

wherein the ejector handle is configured to unseat the module from the corresponding plug when the ejector handle is in an eject position.

12. The chassis of claim 11 , wherein each respective mechanism further comprises a second ejector handle that includes a member configured to provide a positive mating pressure on the module when the connector is inserted into the corresponding plug, wherein the ejector handle is configured at the top end of the chassis and the second ejector handle is configured at the bottom end of the chassis.

13. A mechanism for connecting a module to a chassis, the mechanism comprising:

a plug configured to couple the module to the chassis and comprising gap filling material configured to fill an air gap between an end of a connector inserted into the plug and a back surface of the plug to meet signal performance acceptance criteria; and

one of:

a first element configured to move the module towards a backplane of the chassis to effectively reduce or eliminate a designed-in and/or tolerance-induced gap between the end of the connector of the module and the back surface of the plug when the connector is inserted into the plug; or

a second element configured to move the backplane towards the chassis to effectively reduce or eliminate the designed-in and/or tolerance-induced gap between the end of the connector and the back surface of the plug when the connector is inserted into the plug.

14. The mechanism of claim 13 , wherein the mechanism further comprises a module front panel-to-chassis ground.

15. The mechanism of claim 13 , wherein the first element includes a first spring-loaded plunger assembly configured at a top end of the chassis and a second spring-loaded plunger assembly configured at a bottom end of the chassis.

16. The mechanism of claim 15 ,

wherein the first spring-loaded plunger assembly and the second spring-loaded plunger assembly each include a plunger which, when engaged, pushes the module into a fully seated position in the plug.

17. The mechanism of claim 15 , wherein the mechanism further comprises a grounding gasket for at least one of:

the spring-loaded plunger assembly; or

the second spring-loaded plunger assembly;

wherein the grounding gasket takes up any remaining gap between a front panel of the module and the chassis.

18. The mechanism of claim 13 , wherein the mechanism further comprises an ejector handle that includes a member configured to provide a positive mating pressure on the module when the connector is inserted into the plug;

wherein the ejector handle is configured to unseat the module from the plug when the ejector handle is in an eject position.

19. The mechanism of claim 18 , wherein the mechanism further comprises a second ejector handle that includes a member configured to provide a positive mating pressure on the module when the connector is inserted into the plug, wherein the ejector handle is configured at a top end of the chassis and the second ejector handle is configured at a bottom end of the chassis.

20. The mechanism of claim 13 , wherein the second element includes a first spring-loaded fastener configured at a top end of the chassis and a second spring-loaded fastener configured at a bottom end of the chassis.

Assignments (2)
RELEASE OF SECURITY INTEREST IN PATENTS Recorded Oct 13, 2023
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
To: NATIONAL INSTRUMENTS CORPORATION
Reel/Frame 065231/0561 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 25, 2021
From: BALDWIN, RICHARD G., JR.; TOTH, DENNIS VANCE
To: NATIONAL INSTRUMENTS CORPORATION
Reel/Frame 057286/0063 →