IP Library Granted Patent US 11,571,861
Granted Patent B2
US 11,571,861 · App. 17/412,440 · Granted Feb 7, 2023

System and method for thermoplastic welding using an induced thermal gradient

Inventors: Mark Anthony Wadsworth (Sedan, KS); Kerrick Robert Dando (Wichita, KS)
Assignee: Spirit AeroSystems, Inc.
B29C66/3474B29C65/32B29C65/368B29C66/0244B29C66/1122B29C66/45B29K2701/12
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Quick Facts
Patent No.
US 11,571,861
App. No.
17/412,440
Granted
Feb 7, 2023
Kind
B2
Abstract

A system and method for thermoplastic composite welding comprising a cooling means and a heat source. The cooling means cools a heat-side laminate so as to create a thermal gradient in the heat-side laminate. The heat source heats the heat-side laminate after the cooling step is initiated but before the thermal gradient dissipates so that a first side of the heat-side laminate closer to the heat source does not deform as faying surfaces of the heat-side laminate and another laminate farther away from the heat source are welded together.

Claims (42)

1. A method for thermoplastic composite welding, the method comprising steps of:

placing a heat-side laminate prepared at a first consolidation pressure so as to have a first electrical conductivity, the heat-side laminate including opposing first and second sides, adjacent to a backing laminate prepared at a second consolidation pressure higher than the first consolidation pressure so as to have a second electrical conductivity with the first electrical conductivity being lower than the second electrical conductivity, the backing laminate including opposing first and second sides;

inductively heating the heat-side laminate and the backing laminate to weld the second side of the heat-side laminate and the first side of the backing laminate together, the first electrical conductivity being lower than the second electrical conductivity resulting in the first side of the heat-side laminate staying below a temperature at which rigidity would be lost and thereby remaining rigid during the heating step.

2. The method of claim 1 , further comprising a step of applying a force against the heat-side laminate.

3. The method of claim 2 , further comprising a step of distributing the applied force to the heat-side laminate via a non-conductive compliant layer.

4. The method of claim 1 , wherein the backing laminate is a substructure laminate.

5. The method of claim 4 , wherein the backing laminate is a stiffener laminate.

6. The method of claim 1 , wherein the first electrical conductivity is at least one order of magnitude lower than the second electrical conductivity.

7. The method of claim 1 , wherein the heat-side laminate is a vacuum bag only (VBO) material and the backing laminate is a press or autoclave consolidated laminate.

8. The method of claim 1 , wherein the inductive heating is performed via an induction coil, the method further comprising a step of spacing the induction coil from the heat-side laminate so that the heat-side laminate is subjected to a relatively more dispersed and less intense magnetic field region induced by the induction coil than if the induction coil was directly adjacent the heat-side laminate.

9. The method of claim 1 , wherein at least a portion of the backing laminate stays below a temperature at which rigidity would be lost so the at least a portion of the backing laminate remains sufficiently rigid to provide back-end support to the heat-side laminate during the heating step.

10. The method of claim 1 , wherein the backing laminate is inaccessible after the heat-side laminate is placed adjacent to the backing laminate.

11. The method of claim 1 , further comprising a step of cooling the heat-side laminate so as to create a thermal gradient in the heat-side laminate.

12. The method of claim 1 , wherein the heat-side laminate is a skin laminate.

13. A method for thermoplastic composite welding, the method comprising steps of:

placing a heat-side laminate including opposing first and second sides adjacent to a backing laminate including opposing first and second sides;

inductively heating the heat-side laminate and the backing laminate so the second side of the heat-side laminate and the first side of the backing laminate are welded together,

the heat-side laminate having a first electrical conductivity, the backing laminate having a second electrical conductivity, the first electrical conductivity being lower than the second electrical conductivity so that at least a portion of the heat-side laminate stays below a temperature at which rigidity would be lost and thereby remains rigid during the heating step;

inducing a test magnetic field into the welded heat-side laminate and backing laminate;

measuring an electrical characteristic resulting from the induced test magnetic field; and

performing an additional inductive heating step after the measuring step.

14. The method of claim 13 , wherein the backing laminate is a substructure laminate.

15. The method of claim 14 , wherein the backing laminate is a stiffener laminate.

16. The method of claim 13 , wherein the steps of heating the heat-side laminate and inducing the test magnetic field are performed via a single power supply.

17. The method of claim 13 , wherein the steps of heating the heat-side laminate and inducing the test magnetic field are performed via different coils.

18. The method of claim 13 , wherein the step of inducing the test magnetic field includes generating a momentary current.

19. The method of claim 13 , wherein the step of heating the heat-side laminate is achieved via a primary induction power supply and the step of inducing the test magnetic field is achieved via a secondary testing instrument.

20. The method of claim 13 , further comprising a step of determining a desired welding parameter value from a look-up table corresponding to welding parameter values with the measured electrical characteristic.

21. The method of claim 13 , further comprising a step of applying a force against the heat-side laminate during the heating step, the inducing step, and the measuring step.

22. The method of claim 13 , further comprising a step of comparing a value of the measured electrical characteristic to a baseline test value.

23. The method of claim 13 , wherein the additional inductive heating step is a rewelding step if the electrical characteristic measurement produces a value indicating an undesirable weld.

24. The method of claim 13 , wherein the heat-side laminate is a skin laminate.

25. A method for thermoplastic composite welding, the method comprising steps of:

placing a heat-side laminate prepared at a first consolidation pressure so as to have a first electrical conductivity, the heat-side laminate including opposing first and second sides, adjacent to a backing laminate prepared at a second consolidation pressure higher than the first consolidation pressure so as to have a second electrical conductivity with the first electrical conductivity being lower than the second electrical conductivity, the backing laminate including opposing first and second sides;

inducing a test magnetic field into the heat-side laminate and the backing laminate;

measuring an electrical characteristic resulting from the induced test magnetic field;

adjusting a welding parameter to a desired welding parameter value based on the measured electrical characteristic;

cooling the heat-side laminate so as to create a thermal gradient in the heat-side laminate;

inductively heating the heat-side laminate and the backing laminate at least partially according to the adjusted welding parameter after the cooling step is initiated but before the thermal gradient dissipates such that the thermal gradient and the first electrical conductivity being lower than the second electrical conductivity cooperatively result in the first side of the heat-side laminate staying below a temperature at which rigidity would be lost and thereby remaining rigid during the heating step;

inducing a post-weld test magnetic field into the heat-side laminate and the backing laminate;

measuring a post-weld electrical characteristic resulting from the induced post-test magnetic field; and

repeating the heating step if the electrical characteristic measurement is an unacceptable value.

Assignments (11)
RELEASE OF SECURITY INTEREST Recorded Dec 9, 2025
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: SPIRIT AEROSYSTEMS, INC.
Reel/Frame 073902/0798 →
RELEASE OF SECURITY INTEREST Recorded Dec 9, 2025
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: SPIRIT AEROSYSTEMS, INC.
Reel/Frame 073916/0346 →
SECURITY AGREEMENT Recorded Jul 8, 2024
From: SPIRIT AEROSYSTEMS, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 068217/0456 →
RELEASE OF SECURITY INTEREST Recorded Dec 4, 2023
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
To: SPIRIT AEROSYSTEMS, INC.; SPIRIT AEROSYSTEMS HOLDINGS, INC.; SPIRIT AEROSYSTEMS NORTH CAROLINA, INC.
Reel/Frame 065756/0978 →
SECURITY AGREEMENT (SECOND LIEN NOTES) Recorded Nov 21, 2023
From: SPIRIT AEROSYSTEMS, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 065659/0585 →
RELEASE OF SECURITY INTEREST Recorded Nov 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
To: SPIRIT AEROSYSTEMS, INC.
Reel/Frame 061869/0213 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Nov 23, 2022
From: SPIRIT AEROSYSTEMS, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 061993/0847 →
SECURITY INTEREST Recorded Jan 24, 2022
From: SPIRIT AEROSYSTEMS, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 058749/0524 →
SECURITY INTEREST Recorded Jan 24, 2022
From: SPIRIT AEROSYSTEMS, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 058749/0584 →
SECURITY INTEREST Recorded Jan 24, 2022
From: SPIRIT AEROSYSTEMS, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 058749/0601 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 26, 2021
From: WADSWORTH, MARK ANTHONY; DANDO, KERRICK ROBERT
To: SPIRIT AEROSYSTEMS, INC.
Reel/Frame 057321/0684 →