IP Library Granted Patent US 11,948,859
Granted Patent B2
US 11,948,859 · App. 17/424,695 · Granted Apr 2, 2024

Element module

Inventors: Takayuki Furuya (Tokyo, JP); Akira Kagami (Tokyo, JP)
Assignee: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
H01L23/473H01L23/4922H01L25/071
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Quick Facts
Patent No.
US 11,948,859
App. No.
17/424,695
Granted
Apr 2, 2024
Kind
B2
Abstract

An element module includes a cooler, a plurality of elements, and a conductive member. The cooler includes a first element disposition portion and a second element disposition portion which are provided on both sides in a predetermined direction. The plurality of elements are disposed in each of the first element disposition portion and the second element disposition portion. The conductive member is disposed in a space portion of the cooler. The space portion penetrates the cooler between the plurality of elements in each of the first element disposition portion and the second element disposition portion. The space portion allows the first element disposition portion and the second element disposition portion to communicate with each other. The conductive member is connected to the element of the first element disposition portion and the element of the second element disposition portion.

Claims (12)

1. An element module, comprising:

a cooler including a first element disposition portion and a second element disposition portion which are provided on both sides in a predetermined direction, and including at least one refrigerant storage portion configured to internally store a refrigerant between the first element disposition portion and the second element disposition portion;

a plurality of elements disposed in each of the first element disposition portion and the second element disposition portion, and including transistors;

a conductive member disposed in a space portion through which the first element disposition portion and the second element disposition portion are allowed to communicate with each other by penetrating the cooler between the plurality of elements in each of the first element disposition portion and the second element disposition portion, and connected to the element of the first element disposition portion and the element of the second element disposition portion;

a plurality of conductor plates disposed on a side opposite to each facing side of the first element disposition portion and the second element disposition portion, and to which the plurality of elements are connected; and

a plurality of gate lines connected to a gate of each of the transistors,

wherein the space portion is formed in a long slit shape along a flow direction of the refrigerant in the refrigerant storage portion,

each of the first element disposition portion and the second element disposition portion is divided into two portions on both sides in a direction orthogonal to the flow direction of the refrigerant across the space portion, and thereby, the refrigerant storage portion has two of refrigerant storage portions,

each of the transistors is disposed in line along the flow direction of the refrigerant in each divided portion of the first element disposition portion and the second element disposition portion, and

the plurality of gate lines intersect with a current path in each of the conductor plates.

2. The element module according to claim 1 ,

wherein the cooler includes a connection portion through which internal communication is allowed in end portions of two of refrigerant storage portions.

Assignments (2)
CHANGE OF NAME Recorded Apr 26, 2024
From: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
To: TMEIC CORPORATION
Reel/Frame 067244/0359 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 21, 2021
From: FURUYA, TAKAYUKI; KAGAMI, AKIRA
To: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
Reel/Frame 056934/0821 →
Continuity (1)
Related Publication 20220102243A1 · Mar 31, 2022