IP Library Granted Patent US 12,616,991
Granted Patent B2
US 12,616,991 · App. 17/429,642 · Granted May 5, 2026

Ultrasonic atomization apparatus

Inventors: Hiroyuki Orita (Tokyo, JP); Takahiro Hiramatsu (Tokyo, JP)
Assignee: TMEIC CORPORATION
B05B17/0615
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Quick Facts
Patent No.
US 12,616,991
App. No.
17/429,642
Granted
May 5, 2026
Kind
B2
Abstract

In an ultrasonic atomization apparatus being the present invention, a source solution is accommodated in a separator cup being a part of a container. A constituent material of the separator cup is PTFE being one of fluorocarbon resins, whose entire thickness is uniformly 0.5 mm. Therefore, the separator cup satisfies a thin film condition that “the thickness of a bottom surface BP 1 is 0.5 mm or less”.

Claims (22)

1 . An ultrasonic atomization apparatus comprising:

a container including a separator cup configured to accommodate a source solution at a lower part;

an internal hollow structure body including a hollow inside being provided above said separator cup in said container;

a water tank configured to accommodate an ultrasonic wave conveyance medium inside, said water tank and said separator cup being positioned so that a bottom surface of said separator cup is immersed in said ultrasonic wave conveyance medium; and

a plurality of ultrasonic vibrators provided in a bottom surface of said water tank, wherein

said separator cup uses fluorocarbon resin as a constituent material,

said separator cup is integrally formed by a cylindrical side surface and a bottom surface without a joint member, said bottom surface of said separator cup is inclined from a bottom end of said cylindrical side surface toward a center of said bottom surface of said separator cup, and is formed into a spherical surface shape having a predetermined curvature,

said bottom surface of said separator cup includes a plurality of thin film regions corresponding to said plurality of ultrasonic vibrators, and each of said plurality of thin film regions includes an ultrasonic wave transmission region allowing transmission of ultrasonic waves applied from a corresponding ultrasonic vibrator out of said plurality of ultrasonic vibrators,

in said bottom surface of said separator cup, said plurality of thin film regions satisfy a first thin film condition, and other region except for said plurality of thin film regions does not satisfy said first thin film condition,

in said bottom surface of said separator cup, each of said plurality of thin film regions has a recess at a contact side contacting said source solution and does not have a recess at a contact side contacting said ultrasonic wave conveyance medium,

said first thin film condition is that said thickness of said plurality of thin film regions in said bottom surface is 0.5 mm or less,

entire thickness of said separator cup including the cylindrical side surface and the bottom surface other than said plurality of thin film regions is uniform and satisfying a second thin film condition, and

said second thin film condition is that the entire thickness of said separator cup other than said plurality of thin film regions is larger than 0.5 mm.

2 . The ultrasonic atomization apparatus according to claim 1 , wherein

said water tank and said separator cup being positioned so that at least a part of said cylindrical side surface of said separator cup is immersed in said ultrasonic wave conveyance medium in said water tank from horizontal direction.

3 . The ultrasonic atomization apparatus according to claim 1 , wherein

said container includes an upper cup having a cylindrical shape,

said upper cup and said separator cup are coupled by a connector along circumference of said cylindrical side surface of said separator cup.

4 . The ultrasonic atomization apparatus according to claim 3 , wherein

a liquid level of the source solution is positioned lower than a position at which said connector is disposed in lateral view.

5 . The ultrasonic atomization apparatus according to claim 1 , wherein

said first thin film condition includes a limited thin film condition that said thickness of said plurality of thin film regions in said bottom surface is 0.3 mm or less.

Assignments (2)
CHANGE OF NAME Recorded Apr 26, 2024
From: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
To: TMEIC CORPORATION
Reel/Frame 067244/0359 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 10, 2021
From: ORITA, HIROYUKI; HIRAMATSU, TAKAHIRO
To: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
Reel/Frame 057130/0331 →
Continuity (1)
Related Publication 20220111412A1 · Apr 14, 2022
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