Wafer alignment features
A method of manufacturing a plurality of optical elements includes providing a first wafer ( 200 ) having lower alignment features ( 192 ) arranged on a first surface of the substrate, providing a second wafer ( 201 ) comprising, on a replication side, a plurality of replication sections, each replication section defining a surface structure of one of the optical elements, the second wafer ( 201 ) further comprising upper alignment features ( 194 ) protruding, on the replication side, further than an outermost feature of the replication sections, depositing liquid droplets ( 196 ) on the first side of the first wafer ( 200 ), and bringing the second wafer ( 201 ) and the first side of the first wafer ( 200 ) together, with liquid droplets ( 196 ) between the first wafer ( 200 ) and the second wafer ( 201 ), the upper alignment features ( 194 ) contacting the liquid droplets ( 196 ) on the lower alignment features ( 192 ) on the first side of the first wafer ( 200 ), and thereby causing the second wafer ( 201 ) to align with the first wafer ( 200 ) by capillary action.
1. A method of manufacturing optical elements, the method comprising:
providing a first wafer having lower alignment features, comprising a first sloped lower alignment feature surface and a second sloped lower alignment feature surface;
providing a second wafer comprising, on a replication side, at least one surface structure,
the second wafer further comprising upper alignment features protruding, on the replication side, further than the at least one surface structure, wherein the upper alignment features comprise a first sloped upper alignment feature surface and a second sloped upper alignment feature surface;
depositing liquid droplets on the first sloped lower alignment feature surface and the second sloped lower alignment feature surface of the first wafer and/or the first sloped upper alignment feature surface and the second sloped upper alignment feature surface of the second wafer; and
aligning the first wafer and the second wafer with respect to each other and bringing the first wafer and the second wafer together, with liquid droplets between the first wafer and the second wafer,
the first sloped lower alignment feature surface contacting the first sloped upper alignment feature surface and the second sloped lower alignment feature surface contacting the second sloped upper alignment feature surface through the liquid droplets, and thereby causing the first wafer to align with the second wafer by capillary action,
wherein the lower alignment features are shaped such that distances between the lower alignment features and the upper alignment features depend on a contact angle between a liquid droplet of the liquid droplets and air outside of the lower alignment features and upper alignment features.
2. The method of claim 1 , wherein the liquid droplets are deposited between the lower alignment features of the first wafer and the upper alignment features of the second wafer.
3. The method of claim 1 , wherein the liquid droplets are deposited in a ring on the lower alignment features of the first wafer.
4. The method of claim 1 , wherein the liquid droplets are deposited on the upper alignment features of the second wafer.
5. The method of claim 1 , comprising hardening the liquid droplets.
6. An apparatus for manufacturing optical elements, the apparatus comprising:
a first wafer having lower alignment features, comprising a first sloped lower alignment feature surface and a second sloped lower alignment feature surface; and
a second wafer comprising, on a replication side, at least one surface structure,
the second wafer further comprising at least one upper alignment feature,
the upper alignment feature protruding, on the replication side, further than the at least one surface structure, wherein the upper alignment features comprise a first sloped upper alignment feature surface and a second sloped upper alignment feature surface;
with liquid droplets deposited on the first sloped lower alignment feature surface and the second sloped lower alignment feature surface of the first wafer and/or the first sloped upper alignment feature surface and the second sloped upper alignment feature surface of the second wafer, and the second wafer and the first wafer aligned with respect to each other and bringing the first and second wafers together,
the first sloped lower alignment feature surface contacting the first sloped upper alignment feature surface and the second sloped lower alignment feature surface contacting the second sloped upper alignment feature surface through the liquid droplets, and thereby causing the first wafer to align with the second wafer by capillary action,
wherein the lower alignment features are shaped such that distances between the lower alignment features and the upper alignment features depend on a contact angle between a liquid droplet of the liquid droplets and air outside of the lower alignment features and upper alignment features.
7. The apparatus of claim 6 , wherein the liquid droplets are deposited between the lower alignment features of the first wafer and the upper alignment features of the second wafer.
8. The apparatus of claim 6 , wherein the liquid droplets are deposited in a ring on the lower alignment features of the first wafer.
9. The apparatus of claim 6 , wherein the liquid droplets are deposited on the upper alignment features of the second wafer.
10. The apparatus of claim 6 , wherein the liquid droplets deposited on the lower alignment features of the first wafer and/or the upper alignment features of the second wafer are hardened.