Preparation method of copper-based graphene composite with high thermal conductivity
A preparation method of a copper-based graphene composite with high thermal conductivity is provided. A new electrodeposited solution is used for direct current (DC) electrodeposition at a reasonable electrodeposition frequency, which fabricates a new copper-based graphene composite with high tensile strength and thermal conductivity. The copper-based graphene composite prepared by electrodeposition has high thermal conductivity of 390-1112 W/(m·k) and tensile strength of 300-450 MPa, which meets the requirements in the field of thermal conduction.
1. A preparation method of a copper-based graphene composite with a high thermal conductivity, comprising the following steps;
(1) preparing an electrodeposition solution for the copper-based graphene composite, wherein the electrodeposition solution comprises additives of thiourea and boric acid;
(2) an activation of anode and cathode plates; washing the anode and cathode plates with an activation solution to remove oil, rust, and a surface oxide film, wherein the activation solution comprises: 50 mL of sulfuric acid and 350 mL of deionized water; and
(3) conducting an electrodeposition with the electrodeposition solution prepared in step (1) to obtain the copper-based graphene composite, wherein the electrodeposition refers to a direct current (DC) electrodeposition, and the copper-based graphene composite has a thermal conductivity of 390-1,112 W/(m·k).
2. The preparation method of the copper-based graphene composite according to claim 1 , wherein
the electrodeposition solution for the copper-based graphene composite in step (1) is composed of the following components in mass concentration: 90-200 g/L of copper sulfate pentahydrate, 2-20 mg/L of thiourea, 1-10 g/L of boric acid, 10-50 mg/L of polyethylene glycol (PEG) fatty acid ester, 0.05-2.0 g/L of graphene and a balance of deionized water.
3. The preparation method of the copper-based graphene composite according to claim 1 , wherein
a method for preparing the electrodeposition solution in step (1) comprises:
subjecting a graphene solution to an ultrasonic dispersion and a dispersion in a high-speed homogenizer;
mixing thiourea, boric acid, and PEG fatty acid ester into the graphene solution, accompanying with mechanical stirring; and
mixing and dispersing a copper sulfate solution with the graphene solution by an electric mixer and the high-speed homogenizer to obtain the electrodeposition solution for the copper-based graphene composite.
4. The preparation method of the copper-based graphene composite according to claim 1 , wherein
the DC electrodeposition in step (3) is conducted under the following electrical parameters: 20-180 mA/cm 2 of a current density and 300-1,000 Hz of a DC frequency; and
the DC electrodeposition is conducted under the following environmental parameters: 0.5-5.0 h of an electrodeposition time, 15-50° C. of an electrodeposition solution temperature and 0.5-3 of an electrodeposition solution pH.
5. The preparation method of the copper-based graphene composite according to claim 1 , wherein a coating obtained in step (3) has a thickness of 30 μm to 300 μm.
6. A method of using the copper-based graphene composite prepared by the preparation method according to claim 1 , comprising: using the copper-based graphene composite in a field of thermal conduction.