Dual parallel path cooling system for dual socket information handling systems
An air duct for cooling dual socket information handling systems divides airflow into two parallel paths. Inner walls, a chassis divider and a top surface form a main channel. An intermediate divider and intermediate wall are positioned between the sockets, wherein airflow exiting the first socket is prevented from flowing through the second socket. Lower lateral channels and upper lateral channels are formed between each inner wall and a corresponding outer wall, wherein lower lateral channels allow airflow to bypass the first socket to cool the second socket and the upper lateral channels allow heated airflow exiting the first socket to bypass the second socket.
1. A dual parallel path cooling system for removing heat from two sockets in an air duct in a chassis of an information handling system, the air duct defined by a top surface, a chassis divider and two outer walls, each outer wall extending a length between a first fan and a second fan and extending between the chassis divider and the top surface, wherein the first fan and the second fan generate an airflow through the air duct, the dual parallel path cooling system comprising:
two inner walls, each inner wall parallel with the two outer walls and extending between the first fan and the second fan, each inner wall comprising an initial opening formed between the first fan and a first socket of the two sockets, an intermediate opening formed between the first socket and a second socket of the two sockets, a bypass opening formed between the first socket and the second socket, and an end opening formed between the second socket and the second fan, wherein the two inner walls, the chassis divider and the top surface form a main channel;
two initial dividers, wherein each initial divider extends between one inner wall and a corresponding outer wall, wherein each initial divider, the inner wall, the corresponding outer wall and the chassis divider form a lower lateral channel;
an intermediate divider extending between the two inner walls and positioned parallel to the chassis divider;
an intermediate wall extending between the two inner walls and positioned a height above the chassis divider;
an upper divider extending between the two inner walls and positioned above the second socket, wherein the two inner walls, the upper divider and the chassis divider form a bypass duct; and
an upper lateral channel divider extending between each inner wall and each outer wall, wherein the upper lateral channel divider, the inner wall, the outer wall and the top surface form an upper lateral channel,
wherein the main channel is connected to the upper lateral channel by the bypass opening,
wherein the lower lateral channel is connected to the bypass duct by the intermediate opening,
wherein the intermediate divider, the intermediate wall, and the upper divider are integrated to physically separate the bypass opening from the intermediate opening such that the bypass duct is separated from the main channel,
wherein the bypass opening is spaced-apart from the chassis divider a first distance and the intermediate opening is spaced-apart from the chassis divider a second distance less than the first distance to separate the upper lateral channel from the lower later channel such that the bypass duct is separated from the main channel.
2. The dual parallel path cooling system of claim 1 , wherein the first socket has a first height and the second socket has a second height greater than the first height, wherein the intermediate divider is positioned relative to a base of the first socket.
3. The system of claim 1 , wherein a base of the first socket forms part of the intermediate divider.
4. The system of claim 1 , wherein the intermediate wall is orthogonal to a flow direction of the airflow generated by the first fan and the second fan.
5. The system of claim 1 , wherein the intermediate wall is oriented at an angle relative to a flow direction of the airflow generated by the fans.
6. The system of claim 1 , wherein the chassis divider separates the air duct from a memory duct.
7. The system of claim 1 , wherein a top surface of the second socket forms part of the bypass duct.
8. The system of claim 1 , wherein the top surface comprises a panel of the chassis.
9. The system of claim 1 , wherein the outer walls of the air duct are integrated with side walls of a main duct of the chassis.
10. A chassis of an information handling system, the chassis comprising:
a first fan on a first side of the chassis;
a second fan on a second side of the chassis opposite the first side, wherein the first fan and the second fan generate an airflow; and
an air duct in a main duct, the air duct comprising:
a top surface;
a chassis divider;
two outer walls, each outer wall extending a length between the first fan and the second fan and extending between the chassis divider and the top surface;
two inner walls, each inner wall parallel with the two outer walls and extending between the first fan and the second fan, each inner wall comprising an initial opening formed between the first fan and a first socket of two sockets, an intermediate opening formed between the first socket and a second socket of the two sockets, a bypass opening formed between the first socket and the second socket, and an end opening formed between the second socket and the second fan, wherein the two inner walls, the chassis divider and the top surface form a main channel;
two initial dividers, wherein each initial divider extends between one inner wall and a corresponding outer wall, wherein each initial divider, the inner wall, the corresponding outer wall and the chassis divider form a lower lateral channel:
an intermediate divider extending between the two inner walls and positioned parallel to the chassis divider;
an intermediate wall extending between the two inner walls and positioned a height above the chassis divider;
an upper divider extending between the two inner walls and positioned above the second socket, wherein the two inner walls, the upper divider and the chassis divider form a bypass duct; and
an upper lateral channel divider extending between each inner wall and each outer wall, wherein the upper lateral channel divider, the inner wall, the outer wall and the top surface form an upper lateral channel,
wherein the main channel is connected to the upper lateral channel by the bypass opening,
wherein the lower lateral channel is connected to the bypass duct by the intermediate opening,
wherein the intermediate divider, the intermediate wall, and the upper divider are integrated to physically separate the bypass opening from the intermediate opening such that the bypass duct is separated from the main channel,
wherein the bypass opening is spaced-apart from the chassis divider a first distance and the intermediate opening is spaced-apart from the chassis divider a second distance less than the first distance to separate the upper lateral channel from the lower later channel such that the bypass duct is separated from the main channel.
11. The chassis of claim 10 , wherein the first socket has a first height and the second socket has a second height greater than the first height, wherein the intermediate divider is positioned relative to a base of the first socket.
12. The chassis of claim 11 , wherein the base of the first heat socket forms part of the intermediate divider.
13. The chassis of claim 10 , wherein the intermediate wall is orthogonal to a flow direction of the airflow generated by the first fan and the second fan.
14. The chassis of claim 10 , wherein the intermediate wall is oriented at an angle relative to a flow direction of the airflow generated by the fans.
15. The chassis of claim 10 , wherein the chassis divider separates the air duct from a memory duct.
16. The chassis of claim 10 , wherein a top surface of the second socket forms part of the bypass duct.
17. The chassis of claim 10 , wherein the top surface comprises a panel of the chassis.
18. The chassis of claim 10 , wherein the outer walls of the air duct are integrated with side walls of the main duct of the chassis.