Method for forming memory device comprising bottom-select-gate structure
Memory device includes a bottom-select-gate (BSG) structure formed on a substrate. Cut slits are formed vertically through the BSG structure. A cell-layers structure is formed on the BSG structure. Gate-line slits are formed vertically through the cell-layers structure and the BSG structure, into the substrate and arranged along a first lateral direction to distinguish finger regions. The gate-line slits include a first gate-line slit between first and second finger regions, the first gate-line slit including gate-line sub-slits. The cut slits include a first cut-slit, formed in the second finger region and connecting to a gate-line sub-slit to define a BSG in a first portion of the second finger region. The BSG in the first portion of the second finger region is electrically connected to cell strings in the first finger region through an inter portion between the one gate-line sub-slit and an adjacent gate-line sub-slit.
1. A method for forming a memory device, comprising:
forming a bottom-select-gate (BSG) structure on a substrate;
forming cut slits vertically through the BSG structure on the substrate;
forming a cell-layers structure on the BSG structure; and
forming gate-line slits that are vertically through the cell-layers structure and the BSG structure, into the substrate and arranged along a first lateral direction to distinguish a plurality of finger regions, wherein:
the gate-line slits include a first gate-line slit between first and second finger regions of the plurality of finger regions, the first gate-line slit including gate-line sub-slits, and
the cut slits include a first cut-slit, formed in the second finger region and connecting to a gate-line sub-slit of the first gate-line slit to define a BSG in a first portion of the second finger region, wherein:
the BSG in the first portion of the second finger region is electrically connected to cell strings in the first finger region through an inter portion between the one gate-line sub-slit and an adjacent gate-line sub-slit of the first gate-line slit.
2. The method according to claim 1 , wherein:
the first cut-slit electrically separates the BSG in the first portion of the second finger region from a BSG in a second portion of the second finger region.
3. The method according to claim 2 , wherein:
the BSG in the second portion of the second finger region is electrically connected to cell strings in the second finger region.
4. The method according to claim 3 , wherein:
the BSG in the first portion of the second finger region and the BSG in the second portion of the second finger region have a same height from the substrate.
5. The method according to claim 1 , wherein:
the cut slits further include one or more second cut-slits, each connecting adjacent gate-line sub-slits in a same gate-line slit.
6. The method according to claim 1 , further including:
forming dummy channels in the plurality of finger regions over the substrate; and
forming contacts on BSGs in the plurality of finger regions excluding the first finger region.
7. The method according to claim 1 , wherein:
the first finger region is defined between a continuous gate-line slit and the first gate-line slit including the gate-line sub-slits, and
a wall structure is formed in the first finger region over the substrate, wherein the wall structure includes a stack structure of alternating electrode/insulating layer pairs.
8. The method according to claim 1 , wherein:
an orthogonal projection of the cut slits on the substrate includes straight-line segments.
9. The method according to claim 1 , further including:
forming another BSG structure, wherein:
the substrate includes a staircase-structure region and a doped well is formed in the staircase-structure region of the substrate, and
the BSG structure and the another BSG structure are formed on the staircase-structure region of the substrate and on opposite sides of the doped well.
10. The method according to claim 9 , wherein:
a top of the BSG structure and a top of the another BSG structure have different heights from the substrate.
11. The method according to claim 9 , wherein:
the substrate further includes a first array region and a second array region, and
the staircase-structure region is between the first array region and the second array region, arranged along a second lateral direction.
12. The method according to claim 1 , wherein:
the cell-layers structure includes a stack structure of alternating sacrificial layer/insulating layer pairs before forming the gate-line slits.
13. The method according to claim 1 , wherein:
a word line in the second finger region over the BSG structure is connected to an electrode layer in the first finger region through the inter portion between the one gate-line sub-slit and the adjacent gate-line sub-slit of the first gate-line slit.
14. The method according to claim 1 , further including:
depositing an insulating material in the cut slits.