Thin-film devices and fabrication
Thin-film devices, for example electrochromic devices for windows, and methods of manufacturing are described. Particular focus is given to methods of patterning optical devices. Various edge deletion and isolation scribes are performed, for example, to ensure the optical device has appropriate isolation from any edge defects. Methods described herein apply to any thin-film device having one or more material layers sandwiched between two thin film electrical conductor layers. The described methods create novel optical device configurations.
1. A method of cutting an optical device laminate, the method comprising, in order:
receiving an optical device assembly comprising a first substrate with a plurality of electrochromic stacks disposed thereon;
testing at least some of the plurality of electrochromic stacks to find defects;
mitigating at least some of the found defects;
laminating a second substrate onto the first substrate to form an optical device laminate; and
cutting, using a laser, the optical device laminate into a plurality of optical device lites.
2. The method of claim 1 , wherein laser radiation from the laser is provided from a first side of the optical device laminate opposite a second side upon which the electrochromic stacks are disposed.
3. The method of claim 1 , wherein the electrochromic stacks comprise one or more material layers including at least one conductive layer.
4. The method of claim 3 , further comprising forming one or more bus bars on the at least one conductive layer.
5. The method of claim 1 , wherein the optical device laminate is cut in direction perpendicular to a direction of movement of the optical device laminate.
6. The method of claim 1 , wherein the second substrate is an annealed glass substrate or a polymeric substrate.
7. The method of claim 1 , wherein the first substrate and/or the second substrate is a glass substrate.
8. The method of claim 1 , wherein the first substrate and/or the second substrate comprises a flexible substrate having a thickness of (i) less than 0.3 mm, (ii) less than 0.2 mm, (iii) or less than 0.1 mm.
9. The method of claim 1 , wherein the first substrate and/or the second substrate comprises a flexible substrate having a thickness of about 0.5 mm or less.
10. The method of claim 1 , wherein the first substrate and/or the second substrate comprises a flexible substrate having a thickness between 0.5 mm and 2.0 mm.
11. The method of claim 1 , wherein the second substrate is laminated to the first substrate with a lamination adhesive.
12. The method of claim 1 , wherein the electrochromic stacks are all solid-state and inorganic.
13. The method of claim 1 , further comprising incorporating the optical device lites into windows.
14. The method of claim 1 , further comprising incorporating the optical device lites into insulated glass units.