Single-shot encapsulation
A semiconductor device includes a semiconductor wafer. A plurality of pillar bumps is formed over the semiconductor wafer. A solder is deposited over the pillar bumps. The semiconductor wafer is singulated into a plurality of semiconductor die after forming the pillar bumps while the semiconductor wafer is on a carrier. An encapsulant is deposited around the semiconductor die and pillar bumps while the semiconductor die remains on the carrier. The encapsulant covers an active surface of the semiconductor die between the pillar bumps.
1. A method of making a semiconductor device, comprising:
providing a semiconductor wafer;
forming a plurality of pillar bumps over the wafer;
singulating the semiconductor wafer into a plurality of semiconductor die; and
depositing an encapsulant over the semiconductor die with the pillar bumps exposed from the encapsulant.
2. The method of claim 1 , wherein the pillar bumps include solder caps.
3. The method of claim 2 , wherein the solder caps include lead-free solder.
4. The method of claim 1 , further including transfer-mounting the semiconductor die prior to depositing the encapsulant.
5. The method of claim 1 , further including singulating the semiconductor die through the encapsulant.
6. The method of claim 5 , further including singulating the semiconductor die with a plurality of semiconductor die packaged together.
7. A method of making a semiconductor device, comprising:
providing a semiconductor die;
forming a pillar bump over the semiconductor die;
forming a solder cap over the pillar bump; and
depositing an encapsulant over the semiconductor die, pillar bump, and solder cap.
8. The method of claim 7 , wherein a surface of the encapsulant is coplanar with a surface of the solder cap.
9. The method of claim 7 , further including disposing the semiconductor die over a substrate after depositing the encapsulant, wherein the encapsulant contacts the substrate.
10. The method of claim 9 , further including reflowing the solder cap onto a contact pad of the substrate.
11. The method of claim 7 , further including forming a redistribution layer over the semiconductor die prior to forming the pillar bump.
12. The method of claim 7 , further including:
depositing the encapsulant over a plurality of semiconductor die; and
singulating through the encapsulant, wherein the plurality of semiconductor die remains mechanically connected to each other by the encapsulant after singulating.
13. The method of claim 12 , further including disposing the plurality of semiconductor die over a substrate, wherein the plurality of semiconductor die are mechanically connected to the substrate by the solder cap and remain mechanically connected to each other by the encapsulant.
14. A semiconductor device, comprising:
a semiconductor die;
a pillar bump formed over the semiconductor die;
a solder cap formed over the pillar bump; and
an encapsulant deposited over the semiconductor die, pillar bump, and solder cap, wherein a surface of the solder cap is coplanar with a surface of the encapsulant.
15. The semiconductor device of claim 14 , further including a second semiconductor die disposed in the encapsulant, wherein the encapsulant extends continuously from the first semiconductor die to the second semiconductor die.
16. The semiconductor device of claim 15 , further including a printed circuit board, wherein the solder cap is bonded to a conductive trace or contact pad of the printed circuit board.
17. The semiconductor device of claim 14 , wherein the solder cap includes lead-free solder.
18. The semiconductor device of claim 14 , further including a first insulating layer formed over the first semiconductor die, wherein the pillar bump extends through an opening of the first insulating layer to contact the first semiconductor die.
19. The semiconductor device of claim 18 , wherein a footprint of the opening is smaller than a footprint of the pillar bump.
20. A semiconductor device, comprising:
a semiconductor die;
a pillar bump formed over the semiconductor die;
a solder cap formed over the pillar bump; and
an encapsulant deposited over the semiconductor die, pillar bump, and solder cap.
21. The semiconductor device of claim 20 , wherein a surface of the encapsulant is coplanar with a surface of the solder cap.
22. The semiconductor device of claim 20 , further including a substrate, wherein the encapsulant contacts the substrate.
23. The semiconductor device of claim 20 , further including a redistribution layer formed between the semiconductor die and pillar bump.
24. The semiconductor device of claim 20 , further including a plurality of semiconductor die mechanically connected to each other by the encapsulant.
25. The semiconductor device of claim 24 , further including a substrate, wherein the plurality of semiconductor die is mechanically connected to the substrate by the solder cap.