Local stretch package structure and manufacturing method thereof

1. A local stretch packaging structure, comprising:

a substrate;

a flexible electronic element, disposed on the substrate;

a plurality of light-emitting display elements, disposed on the flexible electronic element; and

a packaging layer, wherein the packaging layer comprises:

a packaging area, continuously covering an upper surface and sidewalls of each one of the plurality of light-emitting display elements; and

a non-packaging area, directly covering the flexible electronic element that is not disposed with the plurality of light-emitting display elements, wherein some portions of the non-packaging area are respectively located between every adjacent two of the light-emitting display element;

wherein at a processing temperature of the substrate, and the processing temperature is from 80° C. to 180° C.:

when a storage modulus of the substrate is higher than a storage modulus of the packaging layer, an elasticity of the non-packaging area is higher than 30%, and the elasticity of the non-packaging area increases with the increase of the storage modulus difference between the substrate and the packaging layer;

when the storage modulus of the substrate is lower than the storage modulus of the packaging layer, the elasticity of the non-packaging area is lower than 30%, and the elasticity of the non-packaging area decreases with the increase of the storage modulus difference between the substrate and the packaging layer;

wherein the storage modulus of the substrate at the processing temperature is from 1 MPa to 20000 MPa.

2. The local stretch packaging structure of claim 1 , wherein a top surface of the packaging layer over the packaging area is higher than a top surface of the packaging layer over the non-packaging area.

3. The local stretch packaging structure of claim 1 , wherein a volume ratio of the non-packaging area to the packaging area is less than 1.

4. The local stretch packaging structure of claim 1 , wherein an elasticity of the non-packaging area is higher than an elasticity of the packaging area, and the elasticity difference between the non-packaging area and the packaging area is higher than or equal to 10%, the elasticity of the packaging area is ranged from approximately 4% to approximately 6%, and the elasticity of the non-packaging area is ranged from approximately 14% to approximately 18%.

5. The local stretch packaging structure of claim 1 , wherein the substrate is made of polycarbonate, polymethyl methacrylate, polyethylene terephthalate, cyclic olefin polymers or a combination thereof.

6. The local stretch packaging structure of claim 1 , wherein the plurality of light-emitting display elements comprises light-emitting diodes, mini light-emitting diodes, micro light-emitting diodes, organic light-emitting diodes, or a combination thereof.

7. The local stretch packaging structure of claim 1 , wherein the packaging layer is made of epoxy resin, silicone, acrylic resin or a combination thereof.

8. The local stretch packaging structure of claim 1 , wherein a storage modulus of the packaging layer at a processing temperature of the substrate is from 1 MPa to 10000 MPa.

9. The local stretch packaging structure of claim 1 , wherein the packaging layer is made of epoxy resin, silicone, acrylic resin or a combination thereof, and a glass transition temperature of the packaging layer is from −20° C. to 150° C.

10. A method of manufacturing a local stretch packaging structure, comprising steps of:

providing a substrate;

disposing a flexible electronic element on the substrate;

disposing a plurality of light-emitting display elements on the flexible electronic element; and

disposing a packaging layer on the plurality of light-emitting display elements and a portion of the flexible electronic element,

wherein the packaging layer comprises a packaging area and a non-packaging area, the packaging area continuously covers an upper surface and sidewalls of each one of the plurality of light-emitting display elements, and the non-packaging area directly covers the flexible electronic element that is not disposed with these light-emitting display elements, some portions of the non-packaging area are respectively located between every adjacent two of the light-emitting display element;

wherein at a processing temperature of the substrate, and the processing temperature is from 80° C. to 180° C.:

when a storage modulus of the substrate is higher than a storage modulus of the packaging layer, an elasticity of the non-packaging area is higher than 30%, and the elasticity of the non-packaging area increases with the increase of the storage modulus difference between the substrate and the packaging layer;

when the storage modulus of the substrate is lower than the storage modulus of the packaging layer, the elasticity of the non-packaging area is lower than 30%, and the elasticity of the non-packaging area decreases with the increase of the storage modulus difference between the substrate and the packaging layer;

wherein the storage modulus of the substrate at the processing temperature is from 1 MPa to 20000 MPa.

11. The method of claim 10 , wherein the step of disposing the packaging layer on the plurality of light-emitting display elements and the portion of the flexible electronic element comprises:

measuring and coating a packaging material on the plurality of light-emitting display elements and the portion of the flexible electronic element;

aligning a plurality of recesses of a mold to the plurality of light-emitting display elements, and aligning a plurality of protrusions of the mold to the flexible electronic element that is not disposed with the plurality of light-emitting display elements;

pressing the mold, and heating and solidifying the packaging material, then forming the packaging layer on the plurality of light-emitting display elements and the portion of the flexible electronic element; and

cooling the packaging layer and removing the mold.

12. The method of claim 10 , wherein the step of disposing the packaging layer on the plurality of light-emitting display elements and the portion of the flexible electronic element comprises:

aligning a plurality of recesses of a mold to the plurality of light-emitting display elements, and aligning a plurality of protrusions of the mold to the flexible electronic element that is not disposed with the plurality of light-emitting display elements, wherein the mold is not attached with the plurality of light-emitting display elements and the flexible electronic element;

injecting a packaging material between the mold and the plurality of light-emitting display elements and the flexible electronic element;

heating and solidifying the packaging material, then forming the packaging layer on the plurality of light-emitting display elements and the portion of the flexible electronic element; and

cooling the packaging layer and removing the mold.

13. The method of claim 12 , wherein the mold is made of vulcanized silicone rubber, polydimethylsiloxane or a combination thereof.

14. The method of claim 10 , wherein the step of disposing the packaging layer on the plurality of light-emitting display elements and the portion of the flexible electronic element comprises:

measuring and coating a packaging material along the upper surface and sidewalls of each one of the plurality of light-emitting display elements and surfaces of the portion of the flexible electronic element; and

applying UV light to solidify the packaging material, so that the packaging layer is formed on the plurality of light-emitting display elements and the portion of the flexible electronic element.

15. The method of claim 14 , wherein the step of coating the packaging material comprises screen printing process or spin coating process.

16. The method of claim 10 , wherein a top surface of the packaging layer over the packaging area being higher than a top surface of the packaging layer over the non-packaging area.

17. The method of claim 10 , wherein an elasticity of the non-packaging area is higher than an elasticity of the packaging area, and the elasticity difference between the non-packaging area and the packaging area is higher than or equal to 10%, the elasticity of the packaging area is ranged from approximately 4% to approximately 6%, and the elasticity of the non-packaging area is ranged from approximately 14% to approximately 18%.

18. The method of claim 10 , wherein a volume ratio of the non-packaging area to the packaging area is less than 1.