Vertical and horizontal circuit assemblies
In a general aspect, an apparatus can include a leadframe including a plurality of leads disposed along a single edge of the apparatus. The apparatus can also include an assembly including a substrate and a plurality of semiconductor die disposed on the substrate, the assembly being mounted on the leadframe and an inductor having a first terminal and a second terminal. The first terminal of the inductor can be electrically coupled with the leadframe via a first contact pad of the leadframe. The second terminal of the inductor can be electrically coupled with the leadframe via a second contact pad of the leadframe. The first contact pad and the second contact pad can be exposed through a molding compound by respective mold cavities defined in the molding compound. The leadframe, the assembly and the inductor can be arranged in a stacked configuration.
1. An apparatus comprising:
a leadframe including a plurality of leads;
an assembly including a substrate and a plurality of semiconductor die disposed on the substrate, the assembly being coupled to the leadframe;
a molding compound that at least partially encapsulates the leadframe and the assembly; and
an inductor having a first terminal and a second terminal,
the first terminal of the inductor being electrically coupled with a first contact pad of the leadframe, the first contact pad being exposed through a mold cavity defined in the molding compound, at least a portion of the first terminal being recessed in the mold cavity,
the second terminal of the inductor being electrically coupled with a second contact pad of the leadframe, and
the leadframe, the assembly and the inductor being arranged in a stacked configuration.
2. The apparatus of claim 1 , wherein:
the mold cavity is a first mold cavity;
the second contact pad is exposed through a second mold cavity defined in the molding compound; and
at least a portion of the second terminal is recessed in the second mold cavity.
3. The apparatus of claim 1 , wherein the substrate includes a ceramic substrate.
4. The apparatus of claim 1 , wherein the assembly include a multi-chip module.
5. The apparatus of claim 1 , wherein a surface of the substrate is exposed through the molding compound.
6. The apparatus of claim 5 , wherein the mold cavity is disposed on a first side of the apparatus, and the surface of the substrate exposed through the molding compound is disposed on a second side of the apparatus that is opposite the first side.
7. The apparatus of claim 1 , further comprising at least one passive device coupled to the leadframe.
8. The apparatus of claim 1 , wherein the plurality of leads of the leadframe includes at least one straight lead and at least one bent lead, the at least one straight lead being configured to be coupled with a through-hole of a printed circuit board and the at least one bent lead being configured to be mounted on a surface of the printed circuit board.
9. The apparatus of claim 1 , wherein the first terminal of the inductor and the second terminal of the inductor are soldered, respectively, to the first contact pad and the second contact pad.
10. The apparatus of claim 1 , wherein the first terminal of the inductor and the second terminal of the inductor are coupled with a same side of the leadframe to which the assembly is coupled.
11. The apparatus of claim 1 , wherein the first terminal of the inductor and the second terminal of the inductor are coupled with an opposite side of the leadframe to which the assembly is coupled.
12. The apparatus of claim 1 , wherein the plurality of leads of the leadframe are disposed along a single edge of the apparatus.
13. The apparatus of claim 1 , wherein the inductor includes a coil that is disposed outside the molding compound.
14. An apparatus comprising:
a leadframe including a plurality of leads;
an assembly including a substrate and a plurality of semiconductor die disposed on the substrate, the assembly being coupled to the leadframe;
a molding compound that at least partially encapsulates the leadframe and the assembly; and
an inductor having a first terminal and a second terminal,
the first terminal of the inductor being electrically coupled with a first contact pad of the leadframe, the first contact pad being exposed through a first mold cavity defined in the molding compound, at least a portion of the first terminal being recessed in the first mold cavity,
the second terminal of the inductor being electrically coupled with a second contact pad of the leadframe, the second contact pad being exposed through a second mold cavity defined in the molding compound, at least a portion of the second terminal being recessed in the second mold cavity, and
the assembly and the inductor each being disposed on a same side of the leadframe.
15. The apparatus of claim 14 , wherein a surface of the assembly is exposed through the molding compound.
16. The apparatus of claim 14 , further comprising at least one passive device coupled with the leadframe.
17. The apparatus of claim 14 , wherein the substrate includes a ceramic substrate.
18. An apparatus comprising:
a leadframe including a plurality of leads;
an assembly including a substrate and a plurality of semiconductor die disposed on the substrate, the assembly being coupled to the leadframe;
a molding compound that at least partially encapsulates the leadframe and the assembly; and
an inductor having a first terminal and a second terminal,
the first terminal of the inductor being electrically coupled with a first contact pad of the leadframe, the first contact pad being exposed through a first mold cavity defined in the molding compound, at least a portion of the first terminal being recessed in the first mold cavity,
the second terminal of the inductor being electrically coupled with a second contact pad of the leadframe, the second contact pad being exposed through a second mold cavity defined in the molding compound, at least a portion of the second terminal being recessed in the second mold cavity, and
the assembly and the inductor each being disposed on opposite sides of the leadframe.
19. The apparatus of claim 18 , wherein a surface of the assembly is exposed through the molding compound.
20. The apparatus of claim 18 , wherein the substrate includes a ceramic substrate.