Fluid cartridge with vented insert
A fluid cartridge having a plastic fluid body, a bottom wall having a fluid supply opening therein. A metal insert is adhesively attached to the bottom wall. The metal insert has a fluid supply slot therein corresponding to the fluid supply opening in the bottom wall, a die bond surface adjacent to the fluid supply slot for adhesively attaching an ejection head chip thereto, and a plurality of air vents adjacent to the die bond surface. An ejection head chip is adhesively attached to the die bond surface of the metal insert.
1. A fluid cartridge comprising:
a plastic fluid body having a bottom wall having a fluid supply opening therein;
a metal insert adhesively fastened to the bottom wall of the plastic fluid body, the metal insert having a fluid supply slot therein corresponding to the fluid supply opening in the bottom wall, a die bond surface adjacent to the fluid supply slot configured for adhesively fastening an ejection head chip thereto, and a plurality of air vents adjacent to the die bond surface; and
an ejection head chip adhesively fastened to the die bond surface of the metal insert.
2. The fluid cartridge of claim 1 , wherein the metal insert is a stamped, machined, or molded metal insert.
3. The fluid cartridge of claim 1 , wherein the metal insert comprises aluminum or stainless steel.
4. The fluid cartridge of claim 3 , wherein the metal insert comprises anodized aluminum.
5. The fluid cartridge of claim 1 , wherein the metal insert further comprises a stamped chip pocket in the die bond surface configured for adhesively fastening the ejection head chip therein.
6. The fluid cartridge of claim 5 , wherein the chip pocket further comprises a racetrack circumscribing the fluid supply slot.
7. The fluid cartridge of claim 5 , wherein the metal insert further comprises a deck area between the chip pocket and the air vents for a die bond adhesive that is effective to electrically and chemically insolate a back side of a flexible circuit from the metal insert and corrosive fluids.
8. The fluid cartridge of claim 1 , wherein the metal insert has a thickness ranging from about 1.5 to about 4 millimeters.
9. The fluid cartridge of claim 1 , further comprising at least two guide pins extending orthogonally from the bottom wall.
10. The fluid cartridge of claim 9 , wherein the metal insert further comprises apertures therein corresponding to the at least two guide pins configured for positioning the metal insert on the bottom wall of the cartridge body.
11. The fluid cartridge of claim 1 , wherein further comprising a flexible circuit electrically connected to the ejection head chip.
12. A method for eliminating mechanical stresses on an ejection head chip comprising:
providing a fluid cartridge comprising a plastic fluid body having a bottom wall having a fluid supply opening therein;
adhesively attaching a metal insert to the bottom wall, wherein the metal insert has a fluid supply slot therein corresponding to the fluid supply opening in the bottom wall, a die bond surface adjacent to the fluid supply slot for adhesively attaching an ejection head chip thereto, and a plurality of air vents adjacent to the die bond surface;
adhesively attaching an ejection head chip to the die bond surface of the metal insert; and
electrically connecting a flexible circuit to the ejection head chip.
13. The method of claim 12 , wherein the metal insert is a stamped metal insert.
14. The method of claim 12 , wherein the metal insert comprises aluminum or stainless steel, further comprising coating the metal insert with an inert coating to prevent flocculation of solids from fluids ejected by the ejection head chip.
15. The method of claim 12 , wherein the metal insert comprises a stamped chip pocket within the die bond surface having a racetrack circumscribing the fluid supply slot, further comprising applying a die bond adhesive in the chip pocket for adhesively attaching the ejection head chip to the metal insert in the chip pocket.
16. The method of claim 15 , wherein the metal insert comprises a deck area between the chip pocket and the air vents, further comprising applying a die bond adhesive in the deck area to electrically and chemically insolate a back side of the flexible circuit from the metal insert and corrosive fluids.
17. The method of claim 12 , further comprising stamping the metal insert from aluminum or stainless steel having a thickness ranging from about 1.5 to about 4 millimeters.
18. The method of claim 12 , further comprising molding at least two guide pins to extend orthogonally from the bottom wall of the cartridge body.
19. The method of claim 18 , further comprising providing apertures in the metal insert corresponding to the at least two guide pins, and positioning the metal insert on the bottom wall of the cartridge body using the two guide pins and apertures.