IP Library Granted Patent US 11,838,002
Granted Patent B2
US 11,838,002 · App. 17/460,729 · Granted Dec 5, 2023

High frequency multilayer filter

Inventors: Kwang Choi (Simpsonville, SC); Marianne Berolini (Greenville, SC)
Assignee: KYOCERA AVX Components Corporation
H03H7/0115H03H1/00H03H3/00H03H7/1725H03H7/1766H03H7/1775H03H2001/0085
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Quick Facts
Patent No.
US 11,838,002
App. No.
17/460,729
Granted
Dec 5, 2023
Kind
B2
Abstract

A high frequency multilayer filter may include a plurality of dielectric layers and a signal path having an input and an output. The multilayer filter may include an inductor including a conductive layer formed over a first dielectric layer. The inductor may be electrically connected at a first location with the signal path and electrically connected at a second location with at least one of the signal path or a ground. The multilayer filter may include a capacitor including a first electrode and a second electrode that is separated from the first electrode by a second dielectric layer. The multilayer filter has a characteristic frequency that is greater than about 6 GHz.

Claims (43)

1. A high frequency multilayer filter comprising:

a plurality of dielectric layers;

a signal path having an input and an output;

an inductor comprising a conductive layer formed over a first dielectric layer;

a first via at a first location electrically connecting the conductive layer with the signal path;

a second via at a second location electrically connecting the conductive layer with at least one of the signal path or a ground; and

a capacitor comprising a first electrode and a second electrode that is separated from the first electrode by a second dielectric layer;

wherein the multilayer filter has a characteristic frequency that is greater than about 8 GHz, and

wherein the conductive layer of the inductor has an effective length between the first location and the second location that is less than about 5 mm.

2. The high frequency multilayer filter as in claim 1 , wherein the characteristic frequency comprises at least one of a low pass frequency, a high pass frequency, or an upper bound of a bandpass frequency.

3. The high frequency multilayer filter as in claim 1 , wherein the conductive layer of the inductor is parallel with an X-Y plane and spaced apart from each of the first electrode and second electrode of the capacitor in a Z-direction that is perpendicular with the X-Y plane by at least 10 microns.

4. The high frequency multilayer filter as in claim 1 , wherein the inductor comprises a first elongated section elongated in a first direction and having a first width and a second elongated section elongated in a second direction and having a second width, and wherein the first direction is greater than about 15 degrees from the second direction.

5. The high frequency multilayer filter as in claim 4 , wherein the first width of the first elongated section is approximately equal to the second width of the second elongated section.

6. The high frequency multilayer filter as in claim 1 , wherein the inductor comprises at least two corners.

7. The high frequency multilayer filter as in claim 1 , wherein the inductor defines less than one half of a loop.

8. The high frequency multilayer filter as in claim 1 , wherein the inductor defines at least one half of a loop.

9. The high frequency multilayer filter as in claim 1 , further comprising an additional capacitor having a capacitive area that is less than about 0.05 mm 2 .

10. The high frequency multilayer filter as in claim 1 , wherein the conductive layer of the inductor has a width that is less than 1 mm.

11. The high frequency multilayer filter as in claim 1 , wherein the dielectric layer on which the conductive layer of the inductor is formed has a thickness that is less than about 100 microns.

12. The high frequency multilayer filter as in claim 1 , wherein the second via is formed in the dielectric layer on which the conductive layer of the inductor is formed, the second via being electrically connected to the inductor and the ground.

13. The high frequency multilayer filter as in claim 12 , further comprising:

an additional conductive layer formed over another of the plurality of dielectric layers; and

an additional via formed in the dielectric layer on which the conductive layer of the inductor is formed, the additional via being electrically connected to the inductor and the additional conductive layer.

14. The high frequency multilayer filter as in claim 1 , further comprising a self-aligning capacitor, and wherein the ground comprises a ground plane, and wherein the self-aligning capacitor is electrically connected to the ground plane and capacitively coupled with the signal path.

15. The high frequency multilayer filter as in claim 1 , further comprising a dielectric material that comprises a ceramic-filled epoxy.

16. The high frequency multilayer filter as in claim 1 , further comprising an organic dielectric material.

17. A high frequency multilayer filter comprising:

a plurality of dielectric layers;

a signal path having an input and an output;

an inductor comprising a conductive layer formed over a first dielectric layer, and wherein the inductor is electrically connected at a first location with the signal path and electrically connected at a second location with at least one of the signal path or a ground; and

a capacitor comprising a first electrode and a second electrode that is separated from the first electrode by a second dielectric layer;

wherein the multilayer filter has a characteristic frequency that is greater than about 8 GHz,

wherein the inductor comprises a first elongated section elongated in a first direction and having a first width and a second elongated section elongated in a second direction and having a second width,

wherein the first direction is greater than about 15 degrees from the second direction, and

wherein the first width of the first elongated section is approximately equal to the second width of the second elongated section.

18. A high frequency multilayer filter comprising:

a plurality of dielectric layers;

a signal path having an input and an output;

an inductor comprising a conductive layer formed over a first dielectric layer, and wherein the inductor is electrically connected at a first location with the signal path and electrically connected at a second location with at least one of the signal path or a ground; and

a capacitor comprising a first electrode and a second electrode that is separated from the first electrode by a second dielectric layer;

wherein the multilayer filter has a characteristic frequency that is greater than about 8 GHz,

wherein the multilayer filter comprises a dielectric material disposed between the first electrode and the second electrode, the dielectric material having a dielectric constant that ranges from about 5 to about 8 in accordance with IPC TM-650 2.5.5.3 at an operating temperature of 25° C. and frequency of 1 MHz, and

wherein the multilayer filter further comprises an additional dielectric material having a dielectric constant that ranges from about 1 to about 4 in accordance with IPC TM-650 2.5.5.3 at an operating temperature of 25° C. and frequency of 1 MHz.

Assignments (1)
CHANGE OF NAME Recorded Dec 22, 2021
From: AVX CORPORATION
To: KYOCERA AVX COMPONENTS CORPORATION
Reel/Frame 058563/0762 →
Continuity (3)
Continuation 16718250 · Dec 18, 2019
Provisional Application 62782464 · Dec 20, 2018
Related Publication 20210391842A1 · Dec 16, 2021