Optical assembly and manufacturing method thereof
An optical assembly includes a base plate, a light transmitting component arranged on the base plate, a lens component arranged on the base plate along an optical path of light transmitted from the light transmitting component, a supporting member, and an auxiliary member. The supporting member includes a bottom surface that bonds to the base plate and a side surface that connects to the auxiliary member. The auxiliary member includes a side surface on which the lens component is disposed and a bonding surface that bonds to the side surface of the supporting member. The lens component is configured to focus and couple, or collimate, an optical signal transmitted from the light transmitting component. A bottom surface of the auxiliary member and a bottom surface of the lens component are both higher than the top surface of the base plate.
1. An optical assembly, comprising:
a base plate;
a light transmitting component arranged on the base plate;
a lens component arranged on the base plate along an optical path of light transmitted from the light transmitting component;
a supporting member; and
an auxiliary member,
wherein the lens component and the auxiliary member are formed as a one-piece structure,
the supporting member comprises a bottom surface that bonds to the base plate,
the auxiliary member comprises a bonding surface that bonds to a side surface of the supporting member,
the lens component is configured to focus and couple, or collimate, an optical signal transmitted from the light transmitting component, and
a bottom surface of the auxiliary member and a bottom surface of the lens component are both higher than a top surface of the base plate,
the light transmitting component is a semiconductor laser,
the optical assembly further comprises an optical waveguide, an optical integrated chip, or an optical fiber, and
an optical signal transmitted from the semiconductor laser passes through the lens component before entering into the optical waveguide, optical integrated chip, or optical fiber.
2. The optical assembly of claim 1 , wherein glue is used to bond the bottom surface of the supporting member to the base plate and to bond the side surface of the supporting member and the bonding surface of the auxiliary member, both of a glue layer between the bottom surface of the supporting member and the base plate and a glue layer between the side surface and the bonding surface of the auxiliary member being less than or equal to 15 micrometers in thickness.
3. The optical assembly of claim 1 , wherein the supporting member further comprises a light passing surface or a light passing hole on the optical path,
the lens component being located between the light transmitting component and the supporting member, or, the supporting member being located between the light transmitting component and the lens component.
4. The optical assembly of claim 3 , further comprising:
one of an optical isolator, a polarization component, a spectroscopic component, a wave plate, or an optical filter arranged on the light passing surface or the light passing hole of the supporting member.
5. The optical assembly of claim 1 , wherein the supporting member is located to the side of the auxiliary member and the lens component.
6. The optical assembly of claim 1 , further comprising:
an optical component secured onto the base plate, the optical component being located on the optical path between the light transmitting component and the lens component, or the lens component being located on the optical path between the light transmitting component and the optical component,
wherein the supporting member is glued on the optical component, the supporting member being installed on the base plate by means of the optical component, and
the optical component comprises at least one of an optical isolator, a polarization component, a spectroscopic component, a wave plate, or an optical filter.
7. The optical assembly of claim 6 , wherein glue is used to bond the supporting member to the optical component and to the bonding surface of the auxiliary member, both of a glue layer between the supporting member and the optical component and a glue layer between the supporting member and the bonding surface of the auxiliary member both being less than or equal to 15 micrometers in thickness.
8. An optical assembly, comprising:
a base plate;
a light transmitting component arranged on the base plate;
a lens component arranged on the base plate along an optical path of light transmitted from the light transmitting component;
a supporting member; and
an auxiliary member,
wherein the lens component and the auxiliary member are formed as a one-piece structure,
the supporting member comprises a bottom surface that bonds to the base plate,
the auxiliary member comprises a bonding surface that bonds to a side surface of the supporting member,
the lens component is configured to focus and couple, or collimate, an optical signal transmitted from the light transmitting component, and
a bottom surface of the auxiliary member and a bottom surface of the lens component are both higher than a top surface of the base plate,
the light transmitting component is an optical waveguide or an optical fiber,
the optical assembly further comprises a light receiving component, and
an optical signal transmitted from the optical waveguide or optical fiber passes through the lens component before being received by the light receiving component.
9. The optical assembly of claim 8 , further comprising, on the optical path between the lens component and the light receiving component, at least one of a wavelength division demultiplexer, a beam shaping component, or an optical path adjustment component.
10. The optical assembly of claim 1 , further comprising, on the optical path between the lens component and the optical waveguide or optical fiber, at least one of a wavelength division multiplexer, a beam shaping component, or an optical path adjustment component.
11. An optical assembly, comprising:
a base plate;
a light transmitting component arranged on the base plate;
a lens component arranged on the base plate along an optical path of light transmitted from the light transmitting component;
a supporting member; and
an auxiliary member,
wherein the lens component and the auxiliary member are formed as a one-piece structure,
the supporting member comprises a bottom surface that bonds to the base plate,
the auxiliary member comprises a bonding surface that bonds to a side surface of the supporting member, and
a bottom surface of the auxiliary member and a bottom surface of the lens component are both higher than a top surface of the base plate,
wherein the light transmitting component is a semiconductor laser,
the optical assembly further comprises an optical waveguide, an optical integrated chip, or an optical fiber, and
an optical signal transmitted from the semiconductor laser passes through the lens component before entering into the optical waveguide, optical integrated chip, or optical fiber.
12. The optical assembly of claim 11 , wherein the supporting member is located outside of the optical path.
13. The optical assembly of claim 12 , wherein the auxiliary member's bonding surface that bonds to the supporting member is located on a side surface of the auxiliary member that is parallel to and farther away from the optical path.