IP Library › Granted Patent US 11,866,614
Granted Patent B2
US 11,866,614 · App. 17/471,642 · Granted Jan 9, 2024

Pressure-sensitive adhesive compound containing a cross-linked nanoparticle network, method of production and use thereof

Inventors: Klaus Keite-Telgenbuscher (Hamburg, DE); Christian Schuh (Hamburg, DE); Bernd Luhmann (Norderstedt, DE); Thilo Dollase (Hamburg, DE); Minyoung Bai (Hamburg, DE); Thorsten Krawinkel (Hamburg, DE)
Assignee: TESA SE
C09J125/08C08L63/00C09J7/387C09J153/00C09J153/025B82Y30/00B82Y40/00C08L2205/04C09J2301/122C09J2301/124C09J2301/302C09J2301/312C09J2425/00C09J2453/00H10K50/844Y10T428/269Y10T428/287
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,866,614
App. No.
17/471,642
Granted
Jan 9, 2024
Kind
B2
Abstract

A structural adhesive bond formed with a pressure-sensitive adhesive that comprises at least two components forming one phase each, from which an interpenetrating network with at least two phases is produced by a cross-linking build-up reaction, the first phase and second phase having at least a softening point temperature of less than 23° C. and greater than 23° C., respectively, the two phases having a morphology of a cross-linked nanoparticle network after the build-up reaction.

Claims (29)

1. A structural adhesive bond formed with a pressure-sensitive adhesive, the pressure-sensitive adhesive comprising:

at least one kind of an at least partly hydrogenated tackifier resin primarily compatible with at least one styrene block copolymer;

a first constituent forming a first phase having a differential scanning calorimetry softening temperature of less than 23° C., the first phase comprising:

vinylaromatic block copolymers, and

at least one of the at least one styrene block copolymer, the at least one of the at least one styrene block copolymer comprising an elastomer block comprised of unsaturated, partly, or fully hydrogenated polydiene; and

a second constituent forming a second phase that is formed from a crosslinking buildup reaction, the second phase having a differential scanning calorimetry softening temperature greater than 23° C. and a morphology of a connected nanoparticle network, the second phase comprising epoxide reactive components,

wherein

the crosslinking buildup reaction forms an interpenetrating network comprising the first phase and the second phase,

a mass ratio of the first phase to the second phase is between 85:15 and 50:50, and

the pressure-sensitive adhesive is transparent in the visible light range of the spectrum.

2. The structural adhesive bond of claim 1 , wherein the structural adhesive bond is disposed on a single-sided tape.

3. The structural adhesive bond of claim 1 , wherein the structural adhesive bond is disposed on a double-sided tape.

4. The structural adhesive bond of claim 3 , wherein the structural adhesive bond is formed with a pressure-sensitive adhesive.

5. The structural adhesive bond of claim 4 , wherein the interpenetrating network has a softening point that is greater than 23° C.

6. The structural adhesive bond of claim 5 , wherein the mass ratio of the first phase formed after the buildup reaction to the second phase formed after the buildup reaction is between 80:20 and 60:40.

7. The structural adhesive bond of claim 1 , wherein the interpenetrating network has a softening point that is greater than 23° C.

8. The structural adhesive bond of claim 1 , wherein the mass ratio of the first phase formed after the buildup reaction to the second phase formed after the buildup reaction is between 80:20 and 60:40.

9. A method for forming a structural adhesive bond which comprises forming said structural adhesive bond with the pressure-sensitive adhesive of claim 1 .

10. A method for forming a structural adhesive bond which comprises forming said structural adhesive bond with a single-sided adhesive tape formed with the pressure-sensitive adhesive of claim 1 .

11. A method for forming a structural adhesive bond which comprises forming said structural adhesive bond with a double-sided adhesive tape formed with the pressure-sensitive adhesive of claim 1 .

12. A method for forming a structural adhesive bond which comprises forming said structural adhesive bond with the pressure-sensitive adhesive of claim 7 .

13. A method for forming a structural adhesive bond which comprises forming said structural adhesive bond with a single-sided adhesive tape formed with the pressure-sensitive adhesive of claim 7 .

14. A method for forming a structural adhesive bond which comprises forming said structural adhesive bond with a double-sided adhesive tape formed with the pressure-sensitive adhesive of claim 7 .

15. A method for forming a structural adhesive bond which comprises forming said structural adhesive bond with the pressure-sensitive adhesive of claim 8 .

16. A method for forming a structural adhesive bond which comprises forming said structural adhesive bond with a single-sided adhesive tape formed with the pressure-sensitive adhesive of claim 8 .

17. A method for forming a structural adhesive bond which comprises forming said structural adhesive bond with a double-sided adhesive tape formed with the pressure-sensitive adhesive of claim 8 .

18. A method for forming a structural adhesive bond which comprises forming said structural adhesive bond with the pressure-sensitive adhesive of claim 6 .

19. A method for forming a structural adhesive bond which comprises forming said structural adhesive bond with a single-sided adhesive tape formed with the pressure-sensitive adhesive of claim 6 .

20. A method for forming a structural adhesive bond which comprises forming said structural adhesive bond with a double-sided adhesive tape formed with the pressure-sensitive adhesive of claim 6 .