Etching method and plasma processing apparatus
A disclosed etching method includes (a) generating plasma of a processing gas in a chamber of a plasma processing apparatus. The plasma is generated in a state where a substrate is placed on a substrate support having a lower electrode in the chamber. The substrate has a film and a mask. The mask is provided on the film. The etching method further includes (b) etching the film by supplying ions from the plasma to the substrate by periodically applying a pulse of a voltage to a lower electrode. In the operation (b), a level of a voltage of the pulse is changed at least once such that an absolute value of a negative potential of the substrate has a tendency to increase according to progress of etching of the film.
1. An etching method comprising:
placing a substrate on a substrate support provided in a chamber of a plasma processing apparatus, the substrate having a film and a mask provided on the film; and
etching the film of the substrate placed on the substrate support, said etching the film including
(a) generating plasma of a processing gas in the chamber, and
(b) etching the film by supplying ions from the plasma to the substrate by periodically applying a pulse of a voltage to a lower electrode in the substrate support,
wherein in said (b), a level of a voltage of the pulse is changed at least once such that an absolute value of a negative potential of the substrate has a tendency to increase according to progress of etching of the film.
2. The etching method according to claim 1 , wherein the pulse is a pulse of a negative voltage or a pulse of a negative direct-current voltage, and
in said (b), an absolute value of the voltage of the pulse is increased at least once such that the absolute value of the voltage of the pulse has a tendency to increase according to the progress of the etching of the film.
3. The etching method according to claim 1 , wherein in said (b), a duty ratio of the pulse is set to 20% or less.
4. The etching method according to claim 1 , wherein in said (b), a duty ratio of the pulse is decreased at least once to have a tendency to decrease according to the progress of the etching of the film.
5. The etching method according to claim 4 , wherein in said (b), the duty ratio of the pulse is decreased to have a ratio of 15% or more and 20% or less.
6. The etching method according to claim 4 , wherein in said (b), the duty ratio of the pulse is stepwise or gradually reduced.
7. The etching method according to claim 1 , wherein in said (b), the level of the voltage of the pulse is stepwise or gradually changed.
8. An etching method comprising:
placing a substrate on a substrate support provided in a chamber of a plasma processing apparatus, the substrate having a film and a mask provided on the film; and
etching the film of the substrate placed on the substrate support, said etching the film including
(a) generating plasma of a processing gas in the chamber of the plasma processing apparatus, and
(b) etching the film by supplying ions from the plasma to the substrate by periodically applying a pulse of a voltage to a lower electrode in the substrate support,
wherein in said (b), a duty ratio of the pulse is decreased at least once to have a tendency to decrease according to progress of the etching of the film.
9. The etching method according to claim 8 , wherein the pulse is a pulse of a negative voltage or a pulse of a negative direct-current voltage.
10. The etching method according to claim 1 , wherein the film includes a silicon-containing film.
11. The etching method according to claim 1 , wherein the film includes a silicon-containing dielectric film.
12. The etching method according to claim 1 , wherein the film includes a silicon oxide film.
13. The etching method according to claim 12 , wherein the film further includes a silicon nitride film.
14. The etching method according to claim 12 , wherein the mask is formed of polycrystalline silicon.