IP Library Granted Patent US 11,909,390
Granted Patent B2
US 11,909,390 · App. 17/474,171 · Granted Feb 20, 2024

Button structure

Inventors: You Dawei (Suzhou Industrial Park, CN); Li Zefeng (Suzhou Industrial Park, CN); Cao Jin (Suzhou Industrial Park, CN); Xu Feng (Suzhou Industrial Park, CN)
Assignee: Peratech Holdco Limited
H03K17/9625H01H13/14H01H13/20H03K2217/96015
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Quick Facts
Patent No.
US 11,909,390
App. No.
17/474,171
Granted
Feb 20, 2024
Kind
B2
Abstract

A button structure has a base having a slot and a sensing element inserted into the slot. A pressure concentration element is fixedly connected by bonding to the sensing element and a key cap is mounted to the base. The key cap has a core member fixedly connected to a lower surface of a top plate of the key cap. The lower surface of the core member can be brought into contact with the pressure concentration element on application of a pressure to an upper surface of the top plate, such that the applied pressure is transmitted to the sensing element through the core member and the pressure concentration part. The sensing element is a piezoresistive film sensor.

Claims (20)

1. A button structure, comprising:

a base comprising a slot;

a sensing element inserted into said slot;

a pressure concentration element fixedly connected by bonding to said sensing element; and

a key cap mounted to said base, said key cap comprising a core member fixedly connected to a lower surface of a top plate of said key cap; wherein:

said core member comprises a lower surface configured to be brought into contact with said pressure concentration element on application of a pressure to an upper surface of said top plate, such that said applied pressure is transmitted to said sensing element through said core member and said pressure concentration element;

said sensing element comprises a piezoresistive film sensor;

said slot comprises an opening and a groove for receiving said sensing element, and an opening direction of said opening is substantially perpendicular to said applied pressure to said key cap; and

said opening direction extends in a direction extending perpendicular to a surface of said base defining said slot.

2. The button structure of claim 1 , wherein said piezoresistive film sensor comprises a quantum tunnelling material.

3. The button structure of claim 1 , wherein said sensing element comprises a sensing sheet and a connector, said sensing sheet being inserted into said slot, and said connector being electrically connected to said sensing sheet.

4. The button structure of claim 1 , wherein said groove is provided with a recessed portion.

5. The button structure of claim 1 , wherein said pressure concentration element is bonded to an upper surface of said sensing element.

6. The button structure according to claim 1 , wherein said pressure concentration element has a cross-sectional area which is smaller than a cross-sectional area of an upper surface of a sensing sheet of said sensing element.

7. The button structure according to claim 1 , wherein said pressure concentration element has a cross-section which is substantially circular.

8. The button structure of claim 1 , wherein said pressure concentration element is located in a substantially central position of an upper surface of a sensing sheet of said sensing element.

9. The button structure of claim 1 , further comprising a printed circuit board electrically connected to a connector of said sensing element.

10. A handheld input device for gaming, comprising said button structure of claim 1 .

11. The handheld input device of claim 10 , comprising four button structures, said button structures being arranged in a cross shape to form a cross-shaped direction key.

12. An electronic gaming device, comprising said handheld input device of claim 10 .

Assignments (4)
LIEN Recorded Oct 28, 2024
From: PERATECH IP LTD.; PERATECH HOLDCO LTD.
To: DARK MATTER LEND CO LTD.
Reel/Frame 069272/0745 →
LICENSE Recorded Oct 28, 2024
From: PERATECH IP LTD.
To: PERATECH HOLDCO LTD.
Reel/Frame 069444/0115 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 5, 2024
From: PERATECH HOLDCO LTD.
To: PERATECH IP LTD
Reel/Frame 068840/0351 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 3, 2021
From: DAWEI, YOU; ZEFENG, LI; JIN, CAO; FENG, XU
To: PERATECH HOLDCO LTD
Reel/Frame 058278/0336 →
Continuity (1)
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