Substrate transport

1. A substrate transport system comprising:

a carrier having

a housing forming an interior environment having an opening for holding at least one substrate, and

a door for sealing the opening from an outside atmosphere where when sealed the interior environment is configured to maintain an interior atmosphere therein, the housing including a fluid seal passage exterior to and sealing the interior environment with a higher pressure sealing fluid in the fluid seal passage, the higher pressure sealing fluid being at a higher pressure to the interior atmosphere so the higher pressure sealing fluid in the fluid seal passage forms a non-contact fluidic barrier seal that seals the interior environment and the interior atmosphere therein from an environment exterior to the carrier.

2. The substrate transport system of claim 1 , wherein the fluid seal passage defines a redundant seal forming in the fluid seal passage of the redundant seal a sealing atmosphere reservoir at higher pressure than the interior atmosphere.

3. The substrate transport system of claim 1 , the substrate transport system further comprises a vacuum chamber having a carrier interface, the carrier interface being configured to support the carrier for transport of the at least one substrate in the vacuum chamber.

4. The substrate transport system of claim 3 , wherein the door is released through a dynamic pressure equalization between the interior environment and the vacuum chamber.

5. The substrate transport system of claim 3 , wherein the vacuum chamber includes at least one sealable opening for coupling the vacuum chamber to at least one substrate processing module.

6. The substrate transport system of claim 3 , wherein the carrier interface includes a redundant seal arrangement including a first seal located in a first plane and a second seal located in a second plane where the first and second planes are substantially orthogonal to each other.

7. The substrate transport system of claim 3 , further comprising a passive door lock holding the door to the housing, where the carrier interface is configured to release the passive door lock.

8. The substrate transport system of claim 3 , wherein the carrier interface includes a purge port configured to purge at least one of a space between the door and the carrier interface and a seal between the door and the housing.

9. The substrate transport system of claim 3 , wherein the carrier interface is a passive interface.

10. The substrate transport system of claim 1 , wherein at least one of the housing and door includes a redundant seal arrangement, the redundant seal arrangement including at least one vacuum seal disposed around a periphery of the opening and at least one fluid reservoir seal.

11. The substrate transport system of claim 10 , wherein the at least one vacuum seal of the redundant seal arrangement includes a first seal located in a first plane and a second seal located in a second plane where the first and second planes are distinct from one another.

12. The substrate transport system of claim 10 , wherein each of the seals of the redundant seal arrangement mate with a recessed sealing surface in at least one of the housing and door.

13. The substrate transport system of claim 1 , wherein the housing of the carrier is configured to support a vacuum interior environment.

14. The substrate transport system of claim 10 , wherein the fluid seal passage is in communication with a fluid seal charging chamber such that the non-contact fluidic barrier seal is disposed outward of the at least one vacuum seal and the at least one fluid reservoir seal is disposed around a periphery of the seal passage.

15. The substrate transport system of claim 14 , wherein the fluid reservoir is configured to release a fluid through the fluid reservoir channel into the interior environment upon a breach of the at least one vacuum seal.

16. The substrate transport system of claim 1 , wherein the door is sealed to the housing from a vacuum force of the interior environment.

17. A substrate loader module comprising:

a substrate carrier to processing tool interface module having at least one closable opening through which substrates pass and being configured for coupling to one or more of a vacuum environment of a processing tool and an atmospheric environment of the processing tool, the substrate carrier to processing tool interface module including multiple interfaces;

at least one interface disposed to open an internal environment of a substrate carrier to the vacuum environment of the processing tool, and

an another interface disposed to open the internal environment of the substrate carrier to the atmospheric environment of the processing tool.

18. The substrate loader module of claim 17 , wherein the substrate carrier to processing tool interface module is configured to evacuate or charge a substrate carrier fluidic barrier seal located between a door of the substrate carrier and a housing of the substrate carrier.

19. The substrate loader module of claim 17 , wherein the substrate carrier to processing tool interface module is configured to evacuate or charge an internal environment of the substrate carrier.

20. The substrate loader module of claim 17 , wherein the substrate carrier to processing tool interface module includes a Z-axis drive for moving at least a portion of the substrate carrier in a direction transverse to a transfer plane of a substrate into and out of the substrate carrier.

21. The substrate loader module of claim 17 , wherein the substrate carrier to processing tool interface module is configured to separate a shell of the substrate carrier from a door of the substrate carrier to expose substrate racks connected to the door.

22. A substrate processing tool comprising:

a central transfer chamber and ports for process module attachment communicably coupled to one or more sides of the central transfer chamber; and

a controlled environment interface module being connected to the central transfer chamber;

wherein the interface module having at least one closable opening through which substrates pass and being configured for coupling to one or more of a vacuum environment of the processing tool and an atmospheric environment of the processing tool, a substrate carrier to processing tool interface module including multiple pass through interfaces, at least one of which is a vacuum interface and another is an atmospheric interface.

23. The substrate processing tool of claim 22 , further comprising process modules attached to the ports for process module attachment.