Methods of forming active materials for electrochemical cells using low-temperature electrochemical deposition
Provided are methods of forming active materials for electrochemical cells using low-temperature electrochemical deposition, e.g., less than 200° C. Specifically, these processes allow precise control of the morphology, composition, and size of deposited structures. For example, the deposited structure may be doped, alloyed, or surface treated during their deposition using a combination of different precursors. In particular, silicon structure may be pre-lithiated while these structures are being formed. The selection of working electrodes (surface size and properties), electrolyte composition, and other parameters result in different types of structures, e.g., precipitating from the electrolyte or deposited on the electrode. Low-temperature plating does not require a lot of energy and volatile and invisible precursors. Furthermore, this plating produces a more confined waste stream, suitable for post-reaction recycling. Finally, low-temperature electrochemical deposition can be readily scaled up such that plating bathes and electrode sizes can be chosen to fit the production requirements.
1. A method of continuously forming active material structures for electrochemical cells, the method comprising:
introducing an electroplating solution into an electroplating bath, wherein:
the electroplating bath comprises a working electrode and a counter electrode,
the electroplating solution comprises one or more precursors, one or more salts, and one or more solvents,
the one or more salts are selected from the group consisting of tetrabutylammonium chloride (Bu 4 NCl), tetrabutylammonium bromide (Bu 4 NBr), tetrapropylammonium chloride (Py 4 NCl), tetraethylammonium chloride (Et 4 NCl), and lithium chloride (LiCl), 1-butyl-1-methylpyrrolidinium chloride (PYR 14 Cl), and 1-propyl-1-methylpyrrolidinium chloride (PYR 13 Cl), and
the one or more precursors comprise one or more elements selected from the group consisting of silicon (Si) and germanium (Ge); and
applying an electrical potential between the working electrode and the counter electrode and through the electroplating solution thereby forming a pre-processed plating solution from the electroplating solution; and
after applying the electrical potential, adding a precipitating solvent to the pre-processed plating solution thereby causing precipitation of the active material structures,
wherein the precipitating solvent comprises one or more of dimethyloxyethane, tetraglyme, triglyme, diglyme, monoglyme, and tetrahydrofuran (THF).
2. The method of claim 1 , wherein:
the working electrode comprises a metal plate, and
the counter electrode comprises a carbon structure.
3. The method of claim 1 , wherein the working electrode is a metal foam or mesh.
4. The method of claim 3 , wherein the metal foam of the working electrode comprises nickel or stainless steel.
5. The method of claim 1 , wherein the working electrode comprises an insulating mask disposed on a metal surface of the working electrode.
6. The method of claim 1 , wherein the one or more precursors of the electroplating solution are selected from the group consisting of trichlorosilane (SiHCl 3 ), silicon tetrachloride (SiCl 4 ), silicon tetrabromide (SiBr 4 ), and silicon tetraiodide (SiI 4 ).
7. The method of claim 1 , wherein:
the one or more precursors of the electroplating solution comprise trichlorosilane comprising the silicon (Si), and
the electroplating solution further comprises at least one of lithium chloride and titanium tetrachloride.
8. The method of claim 1 , wherein the electroplating solution is maintained at a temperature of less than 200° C.
9. The method of claim 1 ,
wherein the one or more precursors further comprise lithium (Li), and
wherein the active material structures comprise a combination of the silicon (Si) and the lithium (Li) while the active material structures are being formed.
10. The method of claim 1 , wherein the precipitation of the active material structures while adding the precipitating solvent to the pre-processed plating solution causes the active material structures to have a porosity of at least 20%.
11. The method of claim 1 , wherein the precipitation of the active material structures while adding the precipitating solvent to the pre-processed plating solution causes the active material structures to form as loose particles suspended in a combination of the precipitating solvent and the pre-processed plating solution and have a size from 1 nanometer to 100 micrometers.
12. The method of claim 1 , wherein the electroplating solution further comprises an additional non-reactive ionic liquid selected from the group consisting of 1-ethyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide (EMIMTFSI), 1-butyl-1-methylpyrrolidinium bis(trifluoromethanesulfonyl)imide (BMPTFSI), 1-propyl-1-methylpyrrolidinium bis(trifluoromethanesulfonyl)imide (PMPTFSI), or 1-butyl-3-methylimidazolium tetrafluoroborate (bmimBF 4 ).
13. The method of claim 1 , further comprising:
separating the active material structures from a combination of the precipitating solvent and the pre-processed plating solution, and
annealing the active material structures.
14. The method of claim 1 , wherein the active material structures, precipitated after adding the precipitating solvent to the pre-processed plating solution, are amorphous.
15. The method of claim 1 , wherein:
the one or more salts are operable as a conductivity agent in the electroplating solution, and
a molar ratio of the conductivity agent to the one or more precursors is greater than 1.
16. The method of claim 15 , wherein the molar ratio of the conductivity agent to the one or more precursors is greater than 2.
17. The method of claim 1 , wherein the one or more elements in the pre-processed plating solution are in a partially reduced state.
18. The method of claim 1 , wherein applying the electrical potential between the working electrode and the counter electrode comprises limiting a total charge passed between the working electrode and the counter electrode thereby limiting a reduction degree of the one or more elements in the pre-processed plating solution to not fully reduced states.
19. The method of claim 1 , wherein:
the one or more elements comprise silicon, and
in the pre-processed plating solution, the one or more elements are a part of one or more of Si 2 Cl 4 , SiCl 4 2− , SiCl + , and SiCl 3 − .
20. The method of claim 1 , wherein the one or more solvents of the electroplating solution are selected from the group consisting of tetrahydrofuran, monoglyme, diglyme, triglyme, tetraglyme, acetonitrile, propyl carbonate, and an ionic liquid.