Compositions and methods thereof
Aspects of the present disclosure include compositions and methods of making and use thereof. In at least one aspect, a composition, includes a polyaniline and a polysiloxane having a density of about 1.05 g/cm 3 or greater. The composition optionally includes a solvent. In at least one aspect, a method includes introducing a polyaniline with a polysiloxane having a density of about 1.05 g/cm 3 or greater to form a composition. In at least one aspect, a method includes disposing a composition onto a substrate. The composition includes a polyaniline and a polysiloxane having a density of about 1.05 g/cm 3 or greater.
1. A composition layer comprising a cured product prepared from a composition comprising:
about 5 wt % to about 30 wt % of a polyaniline comprising a weight average molecular weight (Mw) of about 100,000 g/mol to about 130,000 g/mol; and
a polysiloxane having a density of about 1.05 g/cm 3 or greater as measured by ASTM D792;
wherein the composition layer has a thickness of about 1 um to about 20 mm and a resistivity of about 4 E+5Ω/□ to about 2.5 E+11Ω/□ when cured at curing temperatures of about 100° ° C. to about 175° C.
2. The composition layer of claim 1 , wherein the composition comprises:
about 70 wt % to about 95 wt % polysiloxane, wherein an amount of polyaniline+polysiloxane does not exceed 100 wt %.
3. The composition layer of claim 1 , wherein the composition layer has a resistivity of about 4 E+5Ω/□ to about 3 E+8Ω/□ when cured at curing temperatures of about 100° C. to about 175° C.
4. The composition layer of claim 1 , wherein the polysiloxane has a thermal stability of about 150° C. to about 160° C. for at least 24 hours.
5. The composition layer of claim 1 , wherein the polysiloxane has a density of about 1.1 g/cm 3 to about 1.5 g/cm 3 as measured by ASTM D792.
6. The composition layer of claim 1 , wherein the polyaniline has a thermal stability of about 150° ° C. to about 160° C. for at least 24 hours.
7. The composition layer of claim 1 , wherein the polyaniline has:
a molecular weight distribution (MWD) of about 1 to about 5.
8. The composition layer of claim 7 , wherein the polyaniline has a molecular weight distribution (MWD) of about 1.3 to about 1.7.
9. The composition layer of claim 1 , wherein the polyaniline has an outgassing % of about 0.1% or less, according to ASTM E595-93.
10. The composition layer of claim 1 , wherein the composition layer has a resistivity of about 4 E+5Ω/□ to about 3 E+6Ω/□ when cured at curing temperatures of about 100° C. to about 175° C.
11. The composition layer of claim 10 , wherein the composition layer is cured at curing temperatures of about 130° C. to about 155° C.
12. The composition layer of claim 1 , wherein the polysiloxane has an elongation of about 100% to about 700%.
13. The composition layer of claim 1 , wherein the polysiloxane has a tensil modulus of about 70 psi to about 420 psi.
14. The composition layer of claim 1 , wherein the composition layer has a thickness of about 1 μm to about 10 μm.