Package comprising an acoustic device and a cap substrate comprising an inductor
A package that includes an acoustic device, a frame coupled to the acoustic device and a cap substrate coupled to the acoustic device through the frame. The acoustic device includes a substrate and an acoustic element coupled to the substrate. The cap substrate includes an inductor. The cap substrate is configured as a cap for the acoustic device. The package includes a cavity located between the acoustic device and the cap substrate. The frame may include a polymer frame.
1 . A package comprising:
an acoustic device comprising:
a substrate; and
an acoustic element coupled to the substrate;
a frame coupled to the acoustic device;
a cap substrate coupled to the acoustic device through the frame,
wherein the cap substrate is a single glass layer comprising a first surface and a second surface, wherein the second surface is opposite to the first surface,
wherein the cap substrate includes an inductor defined by a plurality inductor interconnects,
wherein a first set of inductor interconnects from the plurality of inductor interconnects are located at least partially in the single glass layer,
wherein a second set of inductor interconnects from the plurality of inductor interconnects are located on the first surface of the single glass layer,
wherein a third set of inductor interconnects from the plurality of inductor interconnects are located on the second surface of the single glass layer, and
wherein the cap substrate is configured as a cap for the acoustic device,
a first plurality of interconnects comprising one or more interconnects that extend through (i) the entire thickness of the cap substrate and (ii) the frame, to a surface of the substrate, wherein a side wall of the one or more interconnect that touches the frame has a vertical curve; and
a cavity located between the acoustic device and the first surface of the cap substrate, wherein at least part of the first set of inductor interconnects is exposed to the cavity.
2 . The package of claim 1 , wherein the frame includes a polymer frame.
3 . The package of claim 1 , further comprising a metallization portion coupled to the cap substrate.
4 . The package of claim 3 , wherein the metallization portion includes a plurality of metallization interconnects.
5 . The package of claim 1 , wherein the inductor includes a solenoid inductor.
6 . The package of claim 5 , wherein a magnetic field generated by the solenoid inductor has a direction that is parallel to a surface of a passive device facing the acoustic device.
7 . The package of claim 1 , wherein the package has a thickness of about 450 micrometers or less.
8 . The package of claim 1 , wherein the package has a thickness of about 200 micrometers or less.
9 . The package of claim 1 ,
wherein the acoustic device includes a first coefficient of thermal expansion,
wherein the cap substrate is part of a passive device coupled to the acoustic device, and
wherein the passive device includes a second coefficient of thermal expansion.
10 . The package of claim 9 , wherein a difference between the second coefficient of thermal expansion and the first coefficient of thermal expansion is about 2 parts per million (ppm) or less.
11 . The package of claim 1 , wherein the acoustic device and the cap substrate are configured to allow an electrical signal from the acoustic device to travel through one or more interconnects from the cap substrate.
12 . The package of claim 1 , wherein the acoustic device is configured to operate as a surface acoustic wave (SAW) filter or a bulk acoustic wave (BAW) filter.
13 . A package comprising:
an acoustic device comprising:
a substrate; and
an acoustic element coupled to the substrate;
a polymer frame coupled to the acoustic device;
a cap substrate coupled to the acoustic device through the polymer frame,
wherein the cap substrate includes an inductor defined by a plurality of inductor interconnects, and
wherein the cap substrate is configured as a cap for the acoustic device,
a first plurality of interconnects comprising an interconnect that extends through (i) an entire single glass layer of the cap substrate and (ii) the polymer frame, wherein a side wall of the interconnect that touches the polymer frame has a vertical curve; and
a cavity located between the acoustic device and the cap substrate, wherein at least part of the plurality of inductor interconnects is exposed to the cavity.
14 . The package of claim 13 , further comprising:
a dielectric layer coupled to the cap substrate; and
a second plurality of interconnects located in and over the dielectric layer.
15 . The package of claim 14 ,
wherein the dielectric layer includes prepreg and/or polyimide.
16 . The package of claim 14 , wherein the plurality of the second interconnects includes a plurality of redistribution interconnects.
17 . The package of claim 13 , wherein the substrate comprises a piezoelectric material.
18 . The package of claim 17 , wherein the substrate comprising the piezoelectric material includes a substrate and a piezoelectric layer formed over the substrate.
19 . The package of claim 13 , wherein the first plurality of interconnects is at least partially located in the polymer frame.