Oxide semiconductor-based FRAM
An oxide semiconductor based FRAM is provided in the present invention, including a substrate, a write electrode on the substrate, a ferroelectric dielectric layer on the write electrode, an oxide semiconductor layer on the ferroelectric dielectric layer, a source and a drain respectively on the oxide semiconductor layer and spaced apart at a distance, wherein the source and the drain are further connected to a plate line and a bit line respectively, a gate insulating layer on the source, the drain and the oxide semiconductor layer, and a word line on the gate insulating layer, wherein the word line, the oxide semiconductor layer, the ferroelectric dielectric layer and the write electrode overlapping each other in a direction vertical to the substrate.
1. An oxide semiconductor-based FRAM, comprising:
a substrate;
a write electrode on said substrate;
a ferroelectric dielectric layer on said write electrode;
an oxide semiconductor layer on said ferroelectric dielectric layer, wherein said write electrode, said ferroelectric dielectric layer and said oxide semiconductor layer constitute a ferroelectric capacitor;
a source and a drain respectively on said oxide semiconductor layer and spaced apart at a distance, wherein said source and said drain further connect respectively to a plate line and a bit line, and in a write operation, said write electrode applies a bias voltage and said plate line applies a reverse bias voltage to write data to said ferroelectric capacitor;
a gate insulating layer on said source, said drain and said oxide semiconductor layer; and
a word line on said gate insulating layer, wherein said word line, said oxide semiconductor layer, said ferroelectric dielectric layer and said write electrode overlap each other in a direction vertical to said substrate.
2. The oxide semiconductor-based FRAM of claim 1 , further comprising a protection layer on said gate insulating layer and between said word line and said gate insulating layer.
3. The oxide semiconductor-based FRAM of claim 1 , wherein said source and said drain are not overlapped said write electrode in said direction vertical to said substrate.
4. The oxide semiconductor-based FRAM of claim 1 , wherein a surface of said substrate comprises an insulating layer, and said write electrode is on said insulating layer.
5. The oxide semiconductor-based FRAM of claim 1 , wherein in a read operation, said bit line applies a read voltage to read data stored in said ferroelectric dielectric layer.
6. The oxide semiconductor-based FRAM of claim 5 , wherein in a read operation, said word line applies a supply voltage to open a channel in said oxide semiconductor layer, and said write electrode applies said supply voltage to adjust a threshold voltage of said channel.