IP Library Granted Patent US 11,894,485
Granted Patent B2
US 11,894,485 · App. 17/487,623 · Granted Feb 6, 2024

Solar cell wafer wire bonding method

Inventors: Vergil R. Sandoval (Calamba, PH); Emmanuel C. Abas (Laguna, PH); Yafu Lin (San Jose, CA)
Assignee: Maxeon Solar Pte. Ltd
H01L31/188H01B13/0003H01L31/05Y10T29/49117
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,894,485
App. No.
17/487,623
Granted
Feb 6, 2024
Kind
B2
Abstract

A wire bonding system attaches wires to a solar cell wafer. The wire bonding system includes a feed tube through which a wire is drawn. Rollers contact the wire through openings in the feed tube to facilitate movement of the wire. The wire bonding system includes a soldering heater tip and a wire cutter. The solar cell wafer is placed on a platform, which moves the solar cell wafer. The system has multiple lanes for attaching multiple wires to the solar cell wafer at the same time in parallel operations.

Claims (16)

1. A method of attaching wires to a solar cell wafer, the method comprising:

soldering a first portion of each of a first plurality of wires on a solar cell wafer;

in a first instance, moving the solar cell wafer to draw the first plurality of wires across the solar cell wafer;

after moving the solar cell wafer in the first instance, soldering a second portion of each of the first plurality of wires on the solar cell wafer;

cutting each of the first plurality of wires; and

in a second instance, moving the solar cell wafer to create a gap between the first plurality of wires and a second plurality of wires on the solar cell wafer.

2. The method of claim 1 , further comprising:

soldering the first plurality of wires on the solar cell wafer along a length of each of the first plurality wires.

3. The method of claim 1 , wherein the first portion of each of the first plurality of wires is soldered on a corresponding attachment point on the solar cell wafer.

4. The method of claim 3 , wherein the attachment point is a bus bar.

5. The method of claim 3 , wherein the attachment point is a soldering pad.

6. The method of claim 1 , wherein soldering the first portion of each of the first plurality of wires on the solar cell comprises:

drawing each of the first plurality of wires through a corresponding feed tube of a plurality of feed tubes; and

soldering the first portion of each of the first plurality of wires at an exit end of the corresponding feed tube of the plurality of feed tubes.

7. The method of claim 6 , wherein cutting each of the first plurality of wires comprises:

cutting each of the first plurality of wires at the exit end of the corresponding feed tube of the plurality of feed tubes.

Assignments (4)
SECURITY INTEREST Recorded Jun 27, 2024
From: MAXEON SOLAR PTE. LTD.
To: DB TRUSTEES (HONG KONG) LIMITED
Reel/Frame 067924/0062 →
SECOND LIEN SECURITY INTEREST AGREEMENT Recorded Jun 26, 2024
From: MAXEON SOLAR PTE. LTD
To: DB TRUSTEES (HONG KONG) LIMITED
Reel/Frame 071343/0553 →
SECURITY INTEREST Recorded Jun 5, 2024
From: MAXEON SOLAR PTE. LTD.
To: DB TRUSTEES (HONG KONG) LIMITED
Reel/Frame 067637/0598 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 21, 2021
From: SANDOVAL, VERGIL R.; ABAS, EMMANUEL C.; LIN, YAFU
To: MAXEON SOLAR PTE. LTD.
Reel/Frame 057864/0227 →