Method and system for fabricating unique chips using a charged particle multi-beamlet lithography system
A method of creating electronic devices such as semiconductor chips using a maskless lithographic exposure system such as a charged particle multi-beamlet lithography system ( 301 A- 301 D). The maskless lithographic exposure system comprises a lithography subsystem ( 316 ) including a maskless pattern writer such as a charged particle multi-beamlet lithography machine ( 1 ) or ebeam machine. The method comprises introducing unique chip design data ( 430 ) or information related thereto into pattern data comprising common chip design data before streaming the pattern data to the maskless pattern writer.
1. An electronic device, which is a member of a set of semiconductor chips, comprising:
a common design layout part that is the same for all of the semiconductor chips of the set; and
a non-common design layout part that is the same for only a subset of the semiconductor chips of the set,
wherein the common design layout part and the non-common design layout part are formed in a plurality of layers, and
wherein the non-common design layout part includes at least one of: connections between a metal layer and a gate in a contact layer of the plurality of layers, or a P- or N-doped active region of a transistor of one of the plurality of layers.
2. The electronic device according to claim 1 , wherein the common design layout part and the non-common design layout part are interconnected to form an electronic circuit.
3. The electronic device according to claim 2 , wherein the electronic device comprises at least one input terminal for receiving a challenge and at least one output terminal for outputting a response, and the electronic circuit forms a challenge-response circuit connected for the at least one input terminal and the at least one outputterminal,
wherein the challenge-response circuit is adapted for generating a response at the at least one output terminal based on a challenge applied to the at least one input terminal, the challenge and the response having a predetermined relationship.
4. The electronic device according to claim 1 , wherein the non-common design layout part includes a via connection between two or more layers of the plurality of layers.
5. The electronic device according to claim 1 , wherein the electronic device is created using a maskless lithographic exposure system comprising a maskless pattern writer,
wherein the maskless lithographic exposure system is configured to expose a pattern on a surface of a target according to pattern data,
wherein the pattern data comprises common chip design data corresponding to the common design layout part, and
wherein the maskless lithographic exposure system is configured to insert unique chip design data corresponding to the non-common design layout part into the pattern data before streaming the pattern data to the maskless pattern writer.
6. The electronic device according to claim 1 , wherein the non-common design layout part is based on secret data.
7. The electronic device of claim 6 , wherein the secret data is decrypted before generating non-common chip design data corresponding to the non-common design layout part, the secret data being provided to a maskless lithographic exposure system during creation of the non-common design layout part by the maskless lithographic exposure system.
8. The electronic device according to claim 1 , wherein the electronic device is a read only memory.
9. An electronic device, which is a member of a set of semiconductor chips, comprising:
a common design layout part that is the same for all of the semiconductor chips of the set; and
a non-common design layout part that is the same for only a subset of the semiconductor chips of the set,
wherein the common design layout part and the non-common design layout part are formed in three or more layers, and
wherein the non-common design layout part is formed on at least a first one of the layers having a second one of the layers above the first layer and having a third one of the layers below the first layer.
10. The electronic device according to claim 9 , wherein the common design layout part and the non-common design layout part are interconnected to form an electronic circuit.
11. The electronic device according to claim 10 , wherein the electronic device comprises at least one input terminal for receiving a challenge and at least one output terminal for outputting a response, and the electronic circuit forms a challenge-response circuit connected for the at least one input terminal and the at least one outputterminal,
wherein the challenge-response circuit is adapted for generating a response at the at least one output terminal based on a challenge applied to the at least one input terminal, the challenge and the response having a predetermined relationship.
12. The electronic device according to claim 9 , wherein the non-common design layout part includes a via connection between two or more layers of the three or more layers.
13. The electronic device according to claim 9 , wherein the electronic device is created using a maskless lithographic exposure system comprising a maskless pattern writer,
wherein the maskless lithographic exposure system is configured to expose a pattern on a surface of a target according to pattern data,
wherein the pattern data comprises common chip design data corresponding to the common design layout part, and
wherein the maskless lithographic exposure system is configured to insert unique chip design data corresponding to the non-common design layout part into the pattern data before streaming the pattern data to the maskless pattern writer.
14. The electronic device according to claim 9 , wherein the non-common design layout part is based on secret data.
15. The electronic device of claim 14 , wherein the secret data is decrypted before generating non-common chip design data corresponding to the non-common design layout part, the secret data being provided to a maskless lithographic exposure system during creation of the non-common design layout part by the maskless lithographic exposure system.
16. The electronic device according to claim 9 , wherein the electronic device is a read only memory.
17. The electronic device according to claim 9 , wherein the non-common design layout part includes at least one of a plurality of electrical circuit elements and a plurality of connections between electrical circuit elements.
18. The electronic device according to claim 9 , wherein the non-common design layout part includes active regions of electrical circuit elements.
19. A method for manufacturing an electronic device that is a member of a set of semiconductor chips, the method comprising:
forming a common design layout part that is the same for all of the semiconductor chips of the set; and
forming a non-common design layout part that is the same for only a subset of the semiconductor chips of the set and is different for other ones of the semiconductor chips of the set, wherein the non-common design layout part includes at least one of: connections between a metal layer and a gate in a contact layer of a plurality of layers or a P- or N-doped active region of a transistor of one of a plurality of layers.
20. The electronic device of claim 19 , wherein the non-common design layout part is created using a maskless lithographic exposure system based on secret data provided to the maskless lithographic exposure system during creation of the non-common design layout part.