IP Library Granted Patent US 11,631,535
Granted Patent B1
US 11,631,535 · App. 17/495,994 · Granted Apr 18, 2023

Longitudinal sensor bias structures and method of formation thereof

Inventors: Masaya Nishioka (San Jose, CA); Diane L. Brown (San Jose, CA); Jianhua Hu (Palo Alto, CA); Cherngye Hwang (San Jose, CA)
Assignee: Western Digital Technologies, Inc.
H01F41/14C23C14/34H01F10/14G11B5/3163G11B5/33G11B5/3932G11B2220/90
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Quick Facts
Patent No.
US 11,631,535
App. No.
17/495,994
Granted
Apr 18, 2023
Kind
B1
Abstract

The present disclosure generally relates to a storage device comprising soft bias structures having high coercivity and high anisotropy, and a method of forming thereof. The soft bias structures may be formed by moving a wafer in a first direction under a plume of NiFe to deposit a first NiFe layer at a first angle, moving the wafer in a second direction anti-parallel to the first direction to deposit a second NiFe layer at a second angle on the first NiFe layer, and repeating one or more times. The soft bias structures may be formed by rotating a wafer to a first position, depositing a first NiFe layer at a first angle, rotating the wafer to a second position, depositing a second NiFe layer at a second angle on the first NiFe layer, and repeating one or more times. The first and second NiFe layers have different grain structures.

Claims (10)

1. A method of forming soft bias structures, comprising:

moving a wafer a first direction under a plume of NiFe to deposit a first NiFe layer on a surface of the wafer, the first NiFe layer being deposited at a first angle with respect to the surface of the wafer; and

moving the wafer a second direction opposite the first direction under the plume of NiFe to deposit a second NiFe layer on the first NiFe layer, the second NiFe layer being deposited at a second angle with respect to the surface of the wafer.

2. The method of claim 1 , further comprising:

repeating moving the wafer under the plume of NiFe alternatingly in the first direction and the second direction one or more times to deposit one or more additional NiFe layers on the second NiFe layers.

3. The method of claim 1 , wherein the first angle and the second angle are between about 5° to about 30° with respect to the surface of the wafer.

4. The method of claim 1 , wherein the first angle and the second angle are the same.

5. The method of claim 1 , wherein the first and second NiFe layers each comprises Ni 80 Fe 20 or Ni 45 Fe 55 .

6. The method of claim 1 , wherein the first NiFe layer and the second NiFe layer have different grain structures.

7. The method of claim 1 , wherein the soft bias structures are formed adjacent to a magnetic read sensor.

Assignments (5)
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
RELEASE OF SECURITY INTEREST AT REEL 058426 FRAME 0815 Recorded Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 058965/0679 →
SECURITY INTEREST Recorded Dec 9, 2021
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS AGENT
Reel/Frame 058426/0815 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 8, 2021
From: NISHIOKA, MASAYA; BROWN, DIANE L.; HU, JIANHUA; HWANG, CHERNGYE
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 057740/0135 →