Systems and methods for cooling electronics
In accordance with at least one aspect of this disclosure, a thermal management system for an electronics assembly includes, a reservoir housing a compressible fluid in a compressed state, a throttling orifice disposed in fluid communication with the reservoir and configured to expand the compressible fluid, cooling the compressible fluid, and a heat exchange volume in fluid communication with the throttling orifice to receive cooled compressible fluid from the throttling orifice.
1. A thermal management system for an electronics assembly, comprising:
a reservoir housing a compressible fluid in a compressed state;
a throttling orifice disposed in fluid communication with the reservoir and configured to expand the compressible fluid, cooling the compressible fluid;
a heat exchange volume in fluid communication with the throttling orifice to receive cooled compressible fluid from the throttling orifice; and
an exhaust path fluidly connecting the heat exchange volume to an ambient environment external to the volume via an exhaust path outlet, wherein the reservoir includes a passive pressure release mechanism configured to retain the compressible fluid at a first predetermined pressure and configured to allow discharge of the compressible fluid at a second predetermined pressure.
2. The system as recited in claim 1 , wherein the thermal management system is configured to cool an electronics assembly within a moving platform.
3. The system as recited in claim 2 , wherein the moving platform includes a guided munition.
4. The system as recited in claim 2 , wherein the cooled compressible fluid is in fluid communication with the heat exchange volume to cool the heat exchange volume through convection, and wherein the heat exchange volume is in thermal communication with a heat generating electronics component of the electronics assembly to remove heat from the heat generating electrics component through conduction.
5. The system as recited in claim 1 , wherein the reservoir is configured to discharge the compressible fluid upon acceleration of the moving platform.
6. The system as recited in claim 1 , wherein the compressible fluid includes at least one of carbon dioxide, nitrogen, argon, neon and/or krypton.
7. A moving platform comprising:
a platform body;
an electronics assembly housed within the platform body, the electronics assembly comprising an electronics component; and
a thermal management system configured to cool the electronics assembly, comprising:
a reservoir disposed in the platform body, housing a compressible fluid in a compressed state;
a throttling orifice disposed in fluid communication with the reservoir and configured to expand the compressible fluid, cooling the compressible fluid;
a heat exchange volume in fluid communication with the throttling orifice to receive cooled compressible fluid from the throttling orifice; and
an exhaust path fluidly connecting the heat exchange volume to an ambient environment external to the volume via an exhaust path outlet, wherein the reservoir includes a passive pressure release mechanism configured to retain the compressible fluid at a first predetermined pressure and configured to allow discharge of the compressible fluid at a second predetermined pressure.
8. The platform as recited in claim 7 , wherein the reservoir is positioned in the platform body such that the reservoir is configured to absorb heat from inside the platform body.
9. The platform as recited in claim 8 , wherein the reservoir includes at least one reservoir, wherein the at least one reservoir is housed in at least one of a nose of the platform body and/or in thermal communication with an outer shell of the platform body.
10. A method of cooling an electronics assembly of a moving platform, comprising:
discharging a compressible fluid from an onboard reservoir into a heat exchange volume of the moving platform, wherein the reservoir includes a passive pressure release mechanism configured to retain the compressible fluid at a first predetermined pressure and configured to allow discharge of the compressible fluid at a second predetermined pressure;
expanding the compressible fluid to cool the compressible fluid;
flowing the cooled compressible fluid through the heat exchange volume into thermal communication with a heat generating electronics component of the electronics assembly; and
exhausting the compressible fluid to an ambient environment external to the volume.
11. The method as recited in claim 10 , further comprising;
monitoring a temperature of the electronics component;
monitoring a temperature of the heat exchange volume; and
controlling expansion of the compressible fluid as a function the temperature of the electronics component and the temperature of the heat exchange volume.
12. A thermal management system for an electronics assembly, comprising:
a reservoir housing a compressible fluid in a compressed state;
a throttling orifice disposed in fluid communication with the reservoir and configured to expand the compressible fluid, cooling the compressible fluid;
a heat exchange volume in fluid communication with the throttling orifice to receive cooled compressible fluid from the throttling orifice; and
an exhaust path fluidly connecting the heat exchange volume to an ambient environment external to the volume via an exhaust path outlet,
wherein the thermal management system is configured to cool an electronics assembly within a moving platform,
wherein the cooled compressible fluid is in fluid communication with the heat exchange volume to cool the heat exchange volume through convection, and wherein the heat exchange volume is in thermal communication with a heat generating electronics component of the electronics assembly to remove heat from the heat generating electrics component through conduction,
wherein the heat exchange volume is configured to direct the cooled compressible fluid from the throttling orifice outlet to and along a centerline of the heat generating electronics component, then outward from the centerline to the exhaust path outlet.
13. A thermal management system for an electronics assembly, comprising:
a reservoir housing a compressible fluid in a compressed state;
a throttling orifice disposed in fluid communication with the reservoir and configured to expand the compressible fluid, cooling the compressible fluid;
a heat exchange volume in fluid communication with the throttling orifice to receive cooled compressible fluid from the throttling orifice; and
an exhaust path fluidly connecting the heat exchange volume to an ambient environment external to the volume via an exhaust path outlet,
wherein the thermal management system is configured to cool an electronics assembly within a moving platform,
wherein the cooled compressible fluid is in fluid communication with the heat exchange volume to cool the heat exchange volume through convection, and wherein the heat exchange volume is in thermal communication with a heat generating electronics component of the electronics assembly to remove heat from the heat generating electrics component through conduction,
wherein the heat exchange volume is configured to direct the cooled compressible fluid from the throttling orifice outlet to a periphery of the heat generating electronics component, then inward to a centerline of the heat generating electronics component, then outward from the centerline to the exhaust path outlet.
14. A thermal management system for an electronics assembly, comprising:
a reservoir housing a compressible fluid in a compressed state;
a throttling orifice disposed in fluid communication with the reservoir and configured to expand the compressible fluid, cooling the compressible fluid;
a heat exchange volume in fluid communication with the throttling orifice to receive cooled compressible fluid from the throttling orifice; and
an exhaust path fluidly connecting the heat exchange volume to an ambient environment external to the volume via an exhaust path outlet,
wherein the thermal management system is configured to cool an electronics assembly within a moving platform,
wherein the cooled compressible fluid is in fluid communication with the heat exchange volume to cool the heat exchange volume through convection, and wherein the heat exchange volume is in thermal communication with a heat generating electronics component of the electronics assembly to remove heat from the heat generating electrics component through conduction,
wherein the heat exchange volume is configured to direct the cooled compressible fluid from the throttling orifice outlet to a location aft of the heat generating electronics component, then along the heat generating electronics component to a location forward of the heat generating electronics component and to the exhaust path outlet.
15. A thermal management system for an electronics assembly, comprising:
a reservoir housing a compressible fluid in a compressed state;
a throttling orifice disposed in fluid communication with the reservoir and configured to expand the compressible fluid, cooling the compressible fluid;
a heat exchange volume in fluid communication with the throttling orifice to receive cooled compressible fluid from the throttling orifice; and
an exhaust path fluidly connecting the heat exchange volume to an ambient environment external to the volume via an exhaust path outlet,
wherein the thermal management system is configured to cool an electronics assembly within a moving platform, wherein the moving platform includes a guided munition,
wherein the heat exchange volume is configured to direct the cooled compressible fluid from the throttling orifice outlet to a location forward of the heat generating electronics, then along the heat generating electronics to a location aft of the heat generating electronics and to the exhaust path outlet.
16. A thermal management system for an electronics assembly, comprising:
a reservoir housing a compressible fluid in a compressed state;
a throttling orifice disposed in fluid communication with the reservoir and configured to expand the compressible fluid, cooling the compressible fluid;
a heat exchange volume in fluid communication with the throttling orifice to receive cooled compressible fluid from the throttling orifice, wherein the heat exchange volume is in thermal communication with a cooling path housing a working fluid, and is configured to exchange heat between the working fluid and the compressible fluid in the heat exchange volume while maintaining fluid isolation between the compressible fluid and the working fluid, wherein the working fluid is thermal communication with a heat generating electronics component to cool the heat generating electronics component.
17. A thermal management system for an electronics assembly, comprising:
a reservoir housing a compressible fluid in a compressed state;
a throttling orifice disposed in fluid communication with the reservoir and configured to expand the compressible fluid, cooling the compressible fluid;
a heat exchange volume in fluid communication with the throttling orifice to receive cooled compressible fluid from the throttling orifice, wherein the reservoir further includes an actuated discharge valve, and further comprising a controller operatively connected to control the actuated discharge valve to discharge the compressible fluid at a predetermined time.
18. A thermal management system for an electronics assembly, comprising:
a reservoir housing a compressible fluid in a compressed state;
a throttling orifice disposed in fluid communication with the reservoir and configured to expand the compressible fluid, cooling the compressible fluid;
a heat exchange volume in fluid communication with the throttling orifice to receive cooled compressible fluid from the throttling orifice,
wherein the reservoir includes an active pressure release mechanism configured to retain the compressible fluid at a first predetermined pressure and configured to allow discharge of the compressible fluid at a second predetermined pressure.