Circuit structure
A circuit structure including a pad assembly, a bonding pad assembly, and a bonding assembly is provided. The pad assembly includes a first pad, a second pad, and a third pad which are separated from one another. The bonding pad assembly is located on one side of the pad assembly and includes a first bonding pad. The bonding assembly includes a first bonding wire, a second bonding wire, and a plurality of bonding members. The first bonding wire is connected to the first bonding pad and the first pad. The second bonding wire is connected to the first bonding pad and the third pad. The bonding members are connected among the first pad, the second pad, and the third pad. The circuit structure provided here may have an improved wire bonding efficiency and an increased distribution density of bonding points, and the number of bonding wires may be reduced.
1. A circuit structure, comprising:
a pad assembly, comprising a first pad, a second pad, and a third pad separated from one another;
a bonding pad assembly, located at one side of the pad assembly and comprising a first bonding pad; and
a bonding assembly, comprising a first bonding wire, a second bonding wire, and a plurality of bonding members, wherein the first bonding wire is connected to the first bonding pad and the first pad, the second bonding wire is connected to the first bonding pad and the third pad, and the bonding members are connected among the first pad, the second pad, and the third pad, wherein a pitch between the first pad and the second pad and a pitch between the second pad and the third pad are both greater than 100 μm;
wherein the bonding members comprise a third bonding wire and a fourth bonding wire, the third bonding wire is connected to the first bonding wire on the first pad and connected to the second pad, and the fourth bonding wire is connected to the third bonding wire on the second pad and the second bonding wire on the third pad.
2. The circuit structure according to claim 1 , further comprising a chip and a circuit board, wherein the chip comprises the pad assembly, and the circuit board comprises the bonding pad assembly.
3. A circuit structure, comprising:
a pad assembly, comprising a first pad, a second pad, and a third pad separated from one another;
a bonding pad assembly, located at one side of the pad assembly and comprising a first bonding pad; and
a bonding assembly, comprising a first bonding wire, a second bonding wire, and a plurality of bonding members, wherein the first bonding wire is connected to the first bonding pad and the first pad, the second bonding wire is connected to the first bonding pad and the third pad, and the bonding members are connected among the first pad, the second pad, and the third pad;
wherein the pad assembly further comprises a fourth pad located between the second pad and the third pad, and a pitch between the second pad and the fourth pad is less than 100 μm;
wherein the bonding members comprise a third bonding wire, a fourth bonding wire, and a metal ball, the third bonding wire is connected to the first bonding wire on the first pad and connected to the second pad, the metal ball is connected to the third bonding wire on the second pad and connected to the fourth pad, and the fourth bonding wire is connected to the metal ball on the fourth pad and the second bonding wire on the third pad.
4. The circuit structure according to claim 3 , wherein the metal ball comprises a gold ball or a copper ball.
5. The circuit structure according to claim 3 , wherein the pad assembly further comprises a fifth pad located between the first pad and the second pad, the bonding members further comprise a fifth bonding wire, the bonding pad assembly further comprises a second bonding pad, and the fifth bonding wire is connected to the fifth pad and the second bonding pad.
6. The circuit structure according to claim 5 , wherein an orthographic projection of the third bonding wire on the fifth pad does not overlap the fifth pad.
7. The circuit structure according to claim 5 , wherein a size of the first bonding pad is larger than a size of the second bonding pad.