Electronic housing element comprising a radiator, and associated adjustment method

1. An electronic housing element intended to be fastened to a circuit board having a component to be cooled in order to form an electronic housing, said electronic housing element comprising: a frame made of plastics material having a rigid surround and an upper wall; and a radiator intended to cool the component when in thermal contact therewith, the radiator having: a gripping portion protruding from the upper wall of the frame, said gripping portion being designed so as to be able to engage with gripping claws of a gripping device, and a holding portion intended to engage with the upper wall of the frame, the upper wall of the frame being formed from a material that has a deflection temperature under load and being designed to deform in order to allow an orientation of the radiator to be adjusted with respect to the surround of the frame when the upper wall reaches the deflection temperature under load.

2. The electronic housing element as claimed in claim 1 , wherein the frame is formed by being overmolded on the holding portion of the radiator.

3. The electronic housing element as claimed in claim 2 , wherein the upper wall has an undulating wall portion and a center; a portion configured to cooperate with the holding portion of the radiator.

4. The electronic housing element as claimed in claim 1 , wherein the material forming the upper wall of the frame is chosen such that the deflection temperature under load is greater than a temperature reached by the electronic housing during operation.

5. The electronic housing element as claimed in claim 1 , wherein the holding portion and the gripping portion of the radiator are formed from a thermally conducting material.

6. The electronic housing element as claimed in claim 5 , wherein the holding portion of the radiator is in thermal contact with the upper wall of the frame.

7. A method for adjusting an orientation of a radiator included in an electronic housing element according to claim 1 , comprising:

inserting the electronic housing element into a suitable holding device;

measuring the orientation of a lower face of the radiator with respect to a reference plane;

gripping the gripping portion of the radiator with gripping claws of a gripping device;

heating the gripping claws of the gripping device in order to heat the upper wall of the frame by way of the radiator and monitoring the temperature of the upper wall of the frame;

adjusting the orientation of the radiator with the aid of the gripping device when the upper wall of the frame reaches the deflection temperature under load; and

stopping the heating and the cooling of said claws while maintaining the adjusted orientation of the radiator.

8. Equipment for implementing the method as claimed in claim 7 , the equipment comprising:

a holding device intended to accommodate and hold the electronic housing element;

a detector configured to measure an orientation of a lower face, intended to be in thermal contact with the component to be cooled, of the radiator with respect to a reference plane;

a temperature sensor configured to measure a temperature of the upper wall of the frame;

a gripping device comprising:

gripping claws intended to cooperate with the gripping portion of the radiator; and

a system for heating and cooling said claws, said system being designed to heat the gripping claws to a temperature greater than the deflection temperature under load of the upper wall of the frame,

the gripping device being configured to be able to adjust the orientation of the radiator with respect to the reference plane.