Display panel and display device including heat transferring guiding layer
The present disclosure provides a display panel including a display component, an encapsulation structure and a guiding layer. The display component includes an electrode layer. The encapsulation structure is stacked on the display component. The electrode layer is adjacent to the encapsulation structure. The guiding layer is disposed in or on the encapsulation structure, and the guiding layer is connected to the electrode layer of the display component, and the guiding layer is configured to transfer heat generated by the display component to outside when the display component is in a working process.
1. A display panel comprising:
a display component comprising an electrode layer;
an encapsulation structure stacked on the display component and adjacent to the electrode layer; and
a guiding layer disposed in or on the encapsulation structure, the guiding layer being connected to the electrode layer of the display component, and the guiding layer being configured to transfer heat generated by the display component to the outside when the display component is in a working process;
wherein at least one connecting hole is defined in the encapsulation structure, and the guiding layer is in direct contact with the electrode layer by extending in and through the at least one connecting hole.
2. The display panel of claim 1 , wherein at least one connecting hole is defined in the encapsulation structure, and the encapsulation structure comprises at least one dispersed structure disposed in the at least one connecting hole, and the guiding layer is connected to the electrode layer by the at least one dispersed structure.
3. The display panel of claim 2 , wherein the dispersed structure comprises at least one electrically conductive structure configured to electrically connect the guiding layer with the electrode layer and at least one stress dispersed structure configured to disperse stress; or the dispersed structure only comprises at least one electrically conductive structure which is electrically connecting the guiding layer with the electrode layer; or the dispersed structure only comprises at least one stress dispersed structure which is configured to disperse stress.
4. The display panel of claim 3 , wherein the dispersed structure comprises the at least one electrically conductive structure and the at least one stress dispersed structure, and a ratio of a number of the at least one electrically conductive structure to a number of the at least one stress dispersed structure is between 3:1 and 1:3.
5. The display panel of claim 1 , wherein a material of the dispersed structure comprises at least one of polysiloxane, polyimide, polydimethylsiloxane, polymethacrylate, polystyrene, polycarbonate, indium tin oxide, indium gallium zinc oxide, and indium zinc oxide.
6. The display panel of claim 1 , wherein a plurality of connecting holes arranged in an array are defined in the encapsulation structure.
7. The display panel of claim 1 , wherein a projection of the guiding layer on a horizontal plane where the display component is located in is shaped as a grid, and the projection which is shaped as a grid comprises a plurality of grid openings defined by a plurality of gridlines, and each of the plurality of grid openings is aligned with a light-emitting region of the display component.
8. The display panel of claim 7 , wherein a range of a width of each of the plurality of gridlines is 5 μm to 20 μm.
9. The display panel of claim 1 , wherein a material of the guiding layer is a non-transparent material.
10. The display panel of claim 1 , wherein the encapsulation structure further comprises at least one layer, and the guiding layer is disposed between the display component and one layer of the at least one layer of the encapsulation structure.
11. The display panel of claim 10 , wherein the at least one layer of the encapsulation structure comprises a first inorganic layer, an organic layer and a second inorganic layer, and the first inorganic layer is adjacent to the electrode layer, and the guiding layer is located between the first inorganic layer and the organic layer, and the second inorganic layer is disposed at a side of the organic layer facing away from the guiding layer.
12. The display panel of claim 10 , wherein the at least one layer of the encapsulation structure comprises a first inorganic layer, an organic layer and a second inorganic layer, and the first inorganic layer is adjacent to a side of the electrode layer facing to the encapsulation structure, and the guiding layer is disposed between the organic layer and the second inorganic layer.
13. The display panel of claim 1 , wherein a material of the guiding layer comprises a metal or an electrically conductive oxide.
14. The display panel of claim 13 , wherein the metal is a layer of Ti—Al—Ti, and the electrically conductive oxide comprises at least one of indium tin oxide, indium gallium zinc oxide, and indium zinc oxide.
15. The display panel of claim 1 , wherein a range of a thickness of the guiding layer is 100 nm to 300 nm.
16. A display device, comprising the display panel of claim 1 .
17. A display panel comprising:
a display component comprising an electrode layer;
an encapsulation structure stacked on the display component and adjacent to the electrode layer; and
a guiding layer disposed in or on the encapsulation structure, the guiding layer being connected to the electrode layer of the display component, and the guiding layer being configured to transfer heat generated by the display component to the outside when the display component is in a working process;
wherein the encapsulation structure further comprises at least one layer, and the guiding layer is disposed between the display component and one layer of the at least one layer of the encapsulation structure; and
the at least one layer of the encapsulation structure comprises a first inorganic layer, an organic layer and a second inorganic layer, and the first inorganic layer is adjacent to the electrode layer, and the guiding layer is located between the first inorganic layer and the organic layer, and the second inorganic layer is disposed at a side of the organic layer facing away from the guiding layer; or
the at least one layer of the encapsulation structure comprises a first inorganic layer, an organic layer and a second inorganic layer, and the first inorganic layer is adjacent to a side of the electrode layer facing to the encapsulation structure, and the guiding layer is disposed between the organic layer and the second inorganic layer.