Coated electrical assembly

1. A method for conformally coating an electrical assembly, the method comprising:

plasma polymerization of a first compound of formula (1) and deposition of a resulting polymer of the first compound of formula (I) onto at least one surface of an electrical assembly, the electrical assembly comprising a substrate, a substrate surface, at least one conductive track, at least one electrical component, and a bond connection between the at least one conductive track and the at least one electrical component, and

plasma polymerization of a first fluorocarbon and deposition of the resulting polymer of the first fluorocarbon onto the resulting polymer of the first compound of formula (1);

wherein:

R1 represents C 1 -C 3 alkyl or C 2 -C 3 alkenyl;

R2 represents hydrogen, C 1 -C 3 alkyl or C 2 -C 3 alkenyl;

R3 represents hydrogen, C 1 -C 3 alkyl or C 2 -C 3 alkenyl;

R4 represents hydrogen, C 1 -C 3 alkyl or C 2 -C 3 alkenyl;

R5 represents hydrogen, C 1 -C 3 alkyl or C 2 -C 3 alkenyl; and

R6 represents hydrogen, C 1 -C 3 alkyl or C 2 -C 3 alkenyl; and

wherein the resulting polymer comprising of the first compound of formula (I) has a thickness from 250 nanometers to 300 nanometers and the resulting polymer comprising of the first fluorocarbon has a thickness from 25 nanometers to 50 nanometers, wherein the polymer of the first compound of formula (I) comprises crosslinked structure and retains reactive sites, and wherein the resulting polymer is deposited onto the substrate surface, the at least one conductive track, the at least one electrical component, and the bond connection,

wherein the resulting polymer is deposited onto a top side of the electrical component and further deposited on an underside of the electrical component opposite to the top side; and

wherein the resulting polymer is deposited on the substrate below the electrical component.

2. The method of claim 1 , further comprising:

plasma polymerization of a second compound of formula (I) and deposition of a resulting polymer of the second compound of formula (1) onto the resulting polymer of the first fluorocarbon; and

plasma polymerization of a second fluorocarbon and deposition of a resulting polymer of the second fluorocarbon onto the resulting polymer of the second compound of formula (I).

3. The method of claim 1 , wherein the first compound of formula (I) is selected from the group consisting of 1,4-dimethylbenzene, 1,3-dimethylbenzene, 1,2-dimethylbenzene, toluene, 4-methyl styrene, 3-methyl styrene, 2-methyl styrene, 1,4-divinyl benzene, 1,3-divinyl benzene, and 1,2-divinyl benzene.

4. The method of claim 1 , wherein the first fluorocarbon is selected from the group consisting of CF 4 , C 2 F 4 , C 2 F 6 , C 3 F 6 , C 3 F 8 , and C 4 F 8 .

5. The method of claim 1 , wherein the first compound of formula (I) comprises 1,4-dimethylbenzene and the first fluorocarbon comprises C 3 F 6 .

6. A method for conformally coating an electrical assembly, the method comprising:

plasma polymerization of a first fluorocarbon and deposition of a resulting polymer of the first fluorocarbon onto at least one surface of the

electrical assembly, the electrical assembly comprising a substrate, a substrate surface, at least one conductive track, at least one electrical component, and a bond connection between the at least one conductive track and the at least one electrical component, and

plasma polymerization of a first compound of formula (1) and deposition of a resulting polymer of the first compound of formula (J) onto the resulting polymer of the first fluorocarbon;

wherein:

R1 represents C 1 -C 3 alkyl or C 2 -C 3 alkenyl;

R2 represents hydrogen, C 1 -C 3 alkyl or C 2 -C 3 alkenyl;

R3 represents hydrogen, C 1 -C 3 alkyl or C 2 -C 3 alkenyl;

R4 represents hydrogen, C 1 -C 3 alkyl or C 2 -C 3 alkenyl;

R5 represents hydrogen, C 1 -C 3 alkyl or C 2 -C 3 alkenyl; and

R6 represents hydrogen, C 1 -C 3 alkyl or C 2 -C 3 alkenyl; and

wherein the resulting polymer consisting essentially of the first compound of formula (1) has a thickness from 250 nanometers to 300 nanometers and the resulting polymer consisting essentially of the first fluorohydrocarbon has a thickness from 25 nanometers to 50 nanometers, wherein the polymer of the first compound of formula (I) comprises crosslinked structure and retains reactive sites and wherein the resulting polymer is deposited onto the substrate surface the at least one conductive track, the at least one electrical component, and the bond connection, and

wherein the resulting polymer is deposited onto a top side of the electrical component and further deposited on an underside of the electrical component opposite to the top side; and

wherein the resulting polymer is deposited on the substrate below the electrical component.

7. The method of claim 6 , further comprising plasma polymerization of a second fluorocarbon and deposition of a resulting polymer of the second fluorocarbon onto the resulting polymer of the first compound of formula (I).

8. The method of claim 6 , wherein the first compound of formula (I) is selected from the group consisting of 1,4-dimethylbenzene, 1,3-dimethylbenzene, 1,2-dimethylbenzene, toluene, 4-methyl styrene, 3-methyl styrene, 2-methyl styrene, 1,4-divinyl benzene, 1,3-divinyl benzene, and 1,2-divinyl benzene.

9. The method of claim 6 , wherein the first fluorocarbon is selected from the group consisting of CF 4 , C 2 F 4 , C 2 F 6 , C 3 F 6 , C 3 F 8 , and C 4 F 8 .

10. The method of claim 6 , wherein the first compound of formula (I) comprises 1,4-dimethylbenzene and the first fluorocarbon comprises C 3 F 6 .