IP Library Granted Patent US 11,820,060
Granted Patent B2
US 11,820,060 · App. 17/507,168 · Granted Nov 21, 2023

Mold positioning device

Inventors: Dietmar Tiemo Brand (North York, CA); Ralf Walter Fisch (Saarburg, DE); Sven Kmoch (Platten, DE); Andre Axel Kromberg (Newmarket, CA); Adrian Peter Looije (Aurora, CA); Peter Adrian Looije (Newmarket, CA); Ruud Maria Theodorus Luijs (Copenhagen, DK); Jan Marius Manda (Toronto, CA); Renato Papa (Toronto, CA); Dirk Holger Schlums (Mansfield, CA); Alex Teng (Richmond Hill, CA); Jean-Christophe Witz (Yutz, FR); Bruno Giuseppe Sodaro (Erin, CA); Maxfield Paul Bradshaw (Etobicoke, CA)
Assignee: HUSKY INJECTION MOLDING SYSTEMS LTD.
B29C45/80B29C45/1742B29C45/1743B29C45/1756B29C2945/76083B29C2945/76227B29C2945/76344B29C2945/76568
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Quick Facts
Patent No.
US 11,820,060
App. No.
17/507,168
Granted
Nov 21, 2023
Kind
B2
Abstract

There is provided a structure for positioning a first mold part of a mold on a mold mounting face in an injection molding machine. The structure comprises a positioner configured to connect the first mold part to part of the injection molding machine, wherein the positioner is adjustable to position the first mold part on the mold mounting face. The structure further comprises controller executable instructions executable in a controller with which to resolve an alignment parameter of the mold using a feedback signal from a sensor. Further provided is a method of operating an injection molding machine which method comprises the steps of positioning a first mold part of a mold on a mold mounting face using a positioner and appreciating an alignment parameter of the mold with reference to a feedback signal from a sensor.

Claims (5)

1. A structure for positioning a mold on a mold mounting face in an injection molding machine, comprising:

a first mold part including a mold plate having a connection interface configured to interconnect with a mold connection interface defined on a connection block recessed within a pocket defined in a first platen, the connection interface and the mold connection interface having a complementary configuration, a pin and recess, to interconnect so that selectively positioning the connection block within the pocket, positions the first mold part on a mold mounting face.

2. The structure of claim 1 , wherein the connection interface on the first mold part is the pin.

3. The structure of claim 2 , wherein the pin is a taper pin.

4. The structure of claim 1 , further comprising a sensor configured to provide a feedback signal to a controller for appreciating an alignment parameter of the mold, which alignment parameter includes one or more of a position of the first mold part on the mold mounting face relative to a second mold part.

Assignments (7)
SECURITY AGREEMENT Recorded Mar 16, 2026
From: HUSKY INJECTION MOLDING SYSTEMS LTD.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 075094/0766 →
SECURITY AGREEMENT Recorded Mar 16, 2026
From: HUSKY INJECTION MOLDING SYSTEMS LTD.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 075094/0711 →
RELEASE OF PATENT SECURITY INTERESTS Recorded Jan 14, 2026
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: HUSKY INJECTION MOLDING SYSTEMS LTD.
Reel/Frame 074356/0435 →
RELEASE OF SECURITY INTEREST IN PATENTS (RELEASES 67204/0757) Recorded Jan 13, 2026
From: WILMINGTON TRUST, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: HUSKY INJECTION MOLDING SYSTEMS LTD.
Reel/Frame 074332/0001 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Apr 24, 2024
From: HUSKY INJECTION MOLDING SYSTEMS LTD.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 067204/0757 →
SECURITY AGREEMENT Recorded Apr 23, 2024
From: HUSKY INJECTION MOLDING SYSTEMS LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 067202/0708 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 21, 2021
From: HONTHEIM, DANIEL, MR.; BRAND, DIETMAR TIEMO, MR.; FISCH, RALF WALTER, MR.; KMOCH, SVEN, MR.; KROMBERG, ANDRE AXEL, MR.; LOOIJE, ADRIAN PETER, MR.; LOOIJE, PETER ADRIAN, MR.; LUIJS, RUUD MARIA THEODORUS, MR.; MANDA, JAN MARIUS, MR.; PAPA, RENATO, MR.; SCHLUMS, DIRK HOLGER, MR.; TENG, ALEX, MR.; WITZ, JEAN-CHRISTOPHE, MR.; GOW, GEOFFREY ANDREW, MR.; SODARO, BRUNO GIUSEPPE, MR.; BRADSHAW, MAXFIELD PAUL, MR.
To: HUSKY INJECTION MOLDING SYSTEMS LTD.
Reel/Frame 057886/0164 →
Continuity (6)
Division 15831569 · Dec 5, 2017
Division 14760301
Provisional Application 61875764 · Sep 10, 2013
Provisional Application 61840095 · Jun 27, 2013
Provisional Application 61761354 · Feb 6, 2013
Related Publication 20220040898A1 · Feb 10, 2022