IP Library Granted Patent US 11,725,111
Granted Patent B2
US 11,725,111 · App. 17/507,771 · Granted Aug 15, 2023

Compositions and processes for depositing carbon-doped silicon-containing films

Inventors: Manchao Xiao (Tempe, AZ); Xinjian Lei (Vista, CA); Ronald Martin Pearlstein (Tempe, AZ); Haripin Chandra (Tempe, AZ); Eugene Joseph Karwacki (Tempe, AZ); Bing Han (Tempe, AZ); Mark Leonard O'Neill (Tempe, AZ)
Assignee: Versum Materials US, LLC
C09D7/63C07F7/0896C07F7/10C09D5/00C23C16/30C23C16/345C23C16/401C23C16/45553H01L21/0228H01L21/02126H01L21/02211
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Quick Facts
Patent No.
US 11,725,111
App. No.
17/507,771
Granted
Aug 15, 2023
Kind
B2
Abstract

Described herein are compositions for depositing a carbon-doped silicon containing film comprising: a precursor comprising at least one compound selected from the group consisting of: an organoaminosilane having a formula of R 8 N(SiR 9 LH) 2 , wherein R 8 , R 9 , and L are defined herein. Also described herein are methods for depositing a carbon-doped silicon-containing film using the composition wherein the method is one selected from the following: cyclic chemical vapor deposition (CCVD), atomic layer deposition (ALD), plasma enhanced ALD (PEALD) and plasma enhanced CCVD (PECCVD).

Claims (23)

1. A method of forming a carbon-doped silicon nitride film via an atomic layer deposition process, the method comprising the steps of:

a. providing a substrate in a reactor;

b. introducing into the reactor a precursor comprising at least one organoaminosilane having a formula of R 8 N(SiR 9 LH) 2 , wherein

R 8 is selected from the group consisting of a C 3 to C 10 linear or branched alkyl group, a C 3 to C 10 cyclic alkyl group, a linear or branched C2 to C 10 alkenyl group, a linear or branched C2 to C 10 alkynyl group, a C 5 to C 10 aromatic group, and a C 3 to C 10 saturated or unsaturated heterocyclic group;

R 9 selected from the group consisting of hydrogen, C 1 to C 10 linear or branched alkyl, a C 3 to C 10 cyclic alkyl group, a linear or branched C2 to C 10 alkenyl group, a linear or branched C 2 to C 10 alkynyl group, a C 5 to C 10 aromatic group, and a C 3 to C 10 saturated or unsaturated heterocyclic group; and

L is selected from the group consisting of Cl, Br, and I;

c. purging the reactor with a purge gas;

d. introducing a nitrogen source into the reactor wherein the nitrogen source is selected from the group consisting of ammonia, hydrazine, monoalkylhydrazine, dialkylhydrazine, nitrogen, nitrogen/hydrogen, ammonia plasma, nitrogen plasma, nitrogen/hydrogen plasma, and mixture thereof; and

e. purging the reactor with a purge gas, wherein steps b through e are repeated until a desired thickness of the film is obtained.

2. A method of forming a carbon-doped silicon oxide film via an atomic layer deposition process, the method comprising the steps of:

a. providing a substrate in a reactor;

b. introducing into the reactor at least one compound selected from the group consisting of:

an organoaminosilane having a formula of R 8 N(SiR 9 LH) 2 , wherein

R 8 is selected from the group consisting of a C 3 to C 10 linear or branched alkyl group, a C 3 to C 10 cyclic alkyl group, a linear or branched C2 to C 10 alkenyl group, a linear or branched C 2 to C 10 alkynyl group, a C 5 to C 10 aromatic group, and a C 3 to C 10 saturated or unsaturated heterocyclic group;

R 9 selected from the group consisting of hydrogen, C 1 to C 10 linear or branched alkyl, a C 3 to C 10 cyclic alkyl group, a linear or branched C 2 to C 10 alkenyl group, a linear or branched C 2 to C 10 alkynyl group, a C 5 to C 10 aromatic group, and a C 3 to C 10 saturated or unsaturated heterocyclic group; and

L is selected from the group consisting of Cl, Br, and I;

c. purging the reactor with a purge gas;

d. introducing an oxygen source into the reactor wherein the oxygen source is selected from the group consisting of water, water plasma, oxygen, peroxide, oxygen plasma, ozone, NO, NO 2 , carbon monoxide, carbon dioxide, and combinations thereof; and

e. purging the reactor with a purge gas, wherein steps b through e are repeated until a desired thickness of the film is obtained.

3. The method of claim 1 wherein R 8 is selected from the group consisting of nPr, iPr, nBu, iBu, sBu, tBu, isomers of pentyl, vinyl, phenyl, and alkyl substituted phenyl.

4. The method of claim 1 wherein R 9 is selected from the group consisting of hydrogen, Me, Et, nPr, iPr, nBu, iBu, sBu, tBu, isomers of pentyl, vinyl, phenyl, and alkyl substituted phenyl.

5. The method of claim 2 wherein R 8 is selected from the group consisting of nPr, iPr, nBu, iBu, sBu, tBu, isomers of pentyl, vinyl, phenyl, and alkyl substituted phenyl.

6. The method of claim 2 wherein R 9 is selected from the group consisting of hydrogen, Me, Et, nPr, iPr, nBu, iBu, sBu, tBu, isomers of pentyl, vinyl, phenyl, and alkyl substituted phenyl.