IP Library Granted Patent US 11,817,433
Granted Patent B2
US 11,817,433 · App. 17/515,349 · Granted Nov 14, 2023

Light-emitting device

Inventor: Min-Hsun Hsieh (Hsinchu, TW)
Assignee: EPISTAR CORPORATION
H01L25/0753H01L33/60H01L33/62H01L2933/0066
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Quick Facts
Patent No.
US 11,817,433
App. No.
17/515,349
Granted
Nov 14, 2023
Kind
B2
Abstract

An embodiment of present invention discloses a light-emitting device which includes a first light-emitting area, a second light-emitting area, and a third light-emitting area. The first light-emitting area emits a red light and includes a first light-emitting unit. The second light-emitting area emits a blue light and includes a second light-emitting unit. The third light-emitting area emits a green light and includes a third light-emitting unit. The first light-emitting area is larger than the second light-emitting area and larger than the third light-emitting area. Each of the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit has a width of less than 100 μm and a length of less than 100 μm.

Claims (28)

1. A display module, comprising:

a substrate comprising a top surface;

a plurality of light-emitting devices arranged in an array configuration on the top surface, each light-emitting device comprising:

a first light-emitting area comprising a first semiconductor light-emitting unit configured to emit a red light;

a second light-emitting area comprising a second semiconductor light-emitting unit configured to emit a blue light; and

a third light-emitting area comprising a third semiconductor light-emitting unit configured to emit a green light,

wherein the first light-emitting area is larger than the second light-emitting area and larger than the third light-emitting area,

wherein the first semiconductor light-emitting unit is overlapped with the second semiconductor light-emitting unit or the third semiconductor light-emitting unit in a normal direction of the top surface, and the second semiconductor light-emitting unit and the third semiconductor light-emitting unit do not overlap with each other in the normal direction of the top surface,

wherein each of the first semiconductor light-emitting unit, the second semiconductor light-emitting unit, and the third semiconductor light-emitting unit has a width of less than 100 μm, and a length of less than 100 μm.

2. The display module according to claim 1 , further comprising a supporting body, wherein the first semiconductor light-emitting unit, the second semiconductor light-emitting unit, and the third semiconductor light-emitting unit are disposed on the supporting body.

3. The display module according to claim 1 , wherein the first semiconductor light-emitting unit, the second semiconductor light-emitting unit, and the third semiconductor light-emitting unit are flip chips.

4. The display module according to claim 1 , wherein the first light-emitting area is at least 1.5 times of the second light-emitting area.

5. The display module according to claim 4 , wherein the first light-emitting area is at least 1.5 times of the third light-emitting area.

6. The display module according to claim 1 , wherein the first semiconductor light-emitting unit does not have a growth substrate or has a thinned growth substrate.

7. The display module according to claim 1 , wherein the second semiconductor light-emitting unit and the third semiconductor light-emitting unit are disposed on the first semiconductor light-emitting unit.

8. The display module according to claim 1 , further comprising a glue continuously covering the first semiconductor light-emitting unit, the second semiconductor light-emitting unit, and the third semiconductor light-emitting unit.

9. The display module according to claim 2 , further comprising a paste disposed between the first semiconductor light-emitting unit and the supporting body, wherein the paste comprises an insulating material and a conductive structure surrounded by the insulating material.

10. The display module according to claim 9 , wherein the conductive structure comprises an outer side surface, which has a necking shape.

11. The display module according to claim 9 , wherein the insulating material comprises an outermost surface, the outermost surface has an angle with respect to the supporting body, and the angle increases along a direction from the supporting body toward the first semiconductor light-emitting unit.

12. The display module according to claim 9 , wherein the supporting body comprises a bonding pad, the first semiconductor light-emitting unit comprises an electrode pad facing to the bonding pad, the conductive structure is connected to the bonding pad and the electrode pad, and the conductive structure comprises a minimum width smaller than widths of the bonding pad and the electrode pad.

13. The display module according to claim 9 , further comprising another paste which is connected to the second and third semiconductor light-emitting units.

14. The display module according to claim 1 , wherein the first semiconductor light-emitting unit has at least two separated portions which are not covered by the second semiconductor light-emitting unit and the third semiconductor light-emitting unit.

15. The display module according to claim 1 , wherein the first semiconductor light-emitting unit has a longitudinal side perpendicular to that of the second semiconductor light-emitting unit.

16. The display module according to claim 1 , wherein the first semiconductor light-emitting unit has a geometric center not aligned with that of the second semiconductor light-emitting unit in the normal direction of the top surface.

17. The display module according to claim 1 , wherein the first semiconductor light-emitting unit has a geometric center overlapped with that of the second semiconductor light-emitting unit in the normal direction of the top surface.

18. The display module according to claim 1 , wherein the first semiconductor light-emitting unit is electrically connected to an external power source in a flip bonding configuration, and the second semiconductor light-emitting unit is electrically connected to the external power source by wire bonding.

19. The display module according to claim 1 , wherein at least two of the first, second and third semiconductor light-emitting units have different shapes.

20. The display module according to claim 1 , wherein the second semiconductor light-emitting unit or the third semiconductor light-emitting unit is bonded to the first semiconductor light-emitting unit by a glue.

Assignments (2)
CHANGE OF NAME Recorded Feb 18, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075171/0402 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 1, 2021
From: HSIEH, MIN-HSUN
To: EPISTAR CORPORATION
Reel/Frame 057979/0668 →