Systems and methods for floating pin joint design
Techniques for joining nodes and subcomponents are presented herein. An apparatus in accordance with an aspect of the present disclosure comprises a 3-D printed first part having an interconnect co-printed with the first part such that the interconnect of the first part can float within the first part, and a 3-D printed second part having an interconnect co-printed with the second part such that the interconnect of the second part can float within the second part, wherein the interconnects of the first and second parts are configured to form a connection between the first and second parts.
1. An apparatus, comprising:
a 3-D printed first part having a surface and an interconnect co-printed with the first part such that the interconnect of the first part can float within the first part;
a 3-D printed second part having a surface and an interconnect co-printed with the second part such that the interconnect of the second part can float within the second part;
wherein the interconnects of the first and second parts are configured to form a flush connection between the surfaces of the first and second parts.
2. The apparatus of claim 1 , wherein the interconnect of the first part comprises a cup and the interconnect of the second part comprises a cone.
3. The apparatus of claim 2 , further comprising adhesive between the cup and the cone.
4. The apparatus of claim 1 , further comprising adhesive:
between the interconnect of the first part and the first part; and
between the interconnect of the second part and the second part.
5. The apparatus of claim 1 , wherein the interconnect of the first part or the second part comprises a centering feature.
6. The apparatus of claim 1 , wherein the interconnect of the first part or the second part comprises a locating feature.
7. The apparatus of claim 1 , wherein the interconnects of the first and second parts are connected.
8. The apparatus of claim 5 , wherein the centering feature is a region that widens an opening of the interconnect of the first part or the second part and is configured to couple the interconnect of the first part to the interconnect of the second part.