IP Library Granted Patent US 11,710,903
Granted Patent B2
US 11,710,903 · App. 17/521,271 · Granted Jul 25, 2023

Antenna-like matching component

Inventors: Olivier Pajona (Nice, FR); Sebastian Rowson (San Diego, CA); Laurent Deselos (San Diego, CA)
Assignee: Kyocera AVX Components (San Diego), Inc.
H01Q9/36H01Q1/52H01Q5/50
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Quick Facts
Patent No.
US 11,710,903
App. No.
17/521,271
Granted
Jul 25, 2023
Kind
B2
Abstract

An antenna-like matching component is provided, comprising one or more conductive portions formed on a substrate. Shapes and dimensions of the one or more conductive portions are determined to provide impedance matching for one or more antennas coupled to the matching component.

Claims (15)

1. A matching component, comprising:

a multilayer substrate of dielectric material, the multilayer substrate comprising a first layer, a second layer and a third layer, the second layer being arranged between the first layer and the third layer;

a first conductive patch arranged on a first side surface of the first layer and a first side surface of the second layer;

a second conductive patch connected to the first conductive patch, the second conductive patch arranged between the second layer and the third layer;

a via in the third layer and connected to the second conductive patch;

a third conductive patch arranged on the third layer, the third conductive patch connected to the via;

a fourth conductive patch arranged on a second side surface of the first layer and a side surface of the second layer;

a fifth conductive patch connected to the fourth conductive patch, the fifth conductive patch arranged between the second layer and the third layer.

2. The matching component of claim 1 , wherein the first conductive patch, the second conductive patch, and the third conductive patch form a driving element of the matching component.

3. The matching component of claim 1 , wherein the fourth conductive patch and the fifth conductive patch form a parasitic element of the matching component.

4. The matching component of claim 1 , further comprising:

a first solder pad arranged on the first layer, the first solder pad coupled to the first conductive patch;

a second solder pad arranged on the second layer, the second solder pad coupled to the second conductive patch.

5. The matching component of claim 1 , further comprising an L-shaped arm coupled to the fifth conductive patch.

6. The matching component of claim 5 , wherein the L-shaped arm is coupled to a circuit block comprising one or more capacitors, inductors, or switches.

Assignments (3)
CHANGE OF NAME Recorded Feb 22, 2023
From: ETHERTRONICS, INC.
To: AVX ANTENNA, INC.
Reel/Frame 062763/0342 →
CHANGE OF NAME Recorded Feb 22, 2023
From: AVX ANTENNA, INC.
To: KYOCERA AVX COMPONENTS (SAN DIEGO), INC.
Reel/Frame 062820/0684 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 8, 2021
From: PAJONA, OLIVIER; ROWSON, SEBASTIAN; DESCLOS, LAURENT
To: ETHERTRONICS, INC
Reel/Frame 058048/0552 →