CLEANING SYSTEMS AND METHODS FOR SEMICONDUCTOR SUBSTRATE STORAGE ARTICLES
Provided are methods and systems for cleaning various semiconductor substrate storage articles, in particular, FOUP doors. The FOUP doors and other similar articles often have openings that may get contaminated with cleaning liquids if not covered. The described cleaning system includes contact points for engaging the article and covering these openings. The contact points may be also used for supporting the article and for pressurizing the openings in the article with a gas. The gas may be supplied through one or more contact points. It prevents liquids from getting into the openings if even the openings are not completely sealed. The pressurization may be maintained through the entire wet portion of the cleaning process. The article may be rotated within the cleaning system while cleaning and/or other liquids or gases are dispensed through a set of spraying nozzles. Spraying nozzles may move to enhance cleaning of the article.
1 . An apparatus for cleaning semiconductor containers, the apparatus comprising:
a cleaning chamber;
a support structure, wherein the support structure is configured to support a container door, wherein the support structure is configured to be positioned within the cleaning chamber;
a contact point for protecting a latch opening of the container door, wherein the contact point is configured to engage with the latch opening, wherein the contact point comprise a gas channel configured to flow a gas to the latch opening;
a set of spraying nozzles for dispensing a cleaning liquid onto the container door.
2 . The apparatus as in claim 1 , wherein the support structure is further configured to support a container body, wherein the apparatus further comprises
a second contact point for protecting an opening of the container body, wherein the second contact point is configured to engage with the opening of the container body, wherein the second contact point comprise a second gas channel configured to flow a gas to the opening of the container body.
3 . The apparatus as in claim 2 , the apparatus further including a set of second spraying nozzles for dispensing cleaning liquid onto the container body.
4 . The apparatus as in claim 1 , wherein the contact point is coupled to the support structure, the contact point including a gas inlet for accepting a gas to the gas channel, and wherein the gas inlet is coupled to a gas conduit, which is coupled to a gas source.
5 . An apparatus for cleaning semiconductor containers, the apparatus comprising:
a cleaning chamber;
a support structure, wherein the support structure is configured to support a container door, wherein the support structure is configured to be positioned within the cleaning chamber;
a projecting member projecting towards the container door, the projecting member being configured for protecting a latch opening of the container door, wherein the projecting member is configured to communicate with the latch opening; and
a set of spraying nozzles for dispensing a cleaning liquid onto the container door.
6 . The apparatus as in claim 5 , wherein the projecting member includes a gas channel configured to flow a gas to the latch opening.
7 . The apparatus as in claim 6 , wherein the projecting member is coupled to the support structure, the projecting member including a gas inlet for accepting a gas to the gas channel, and wherein the gas inlet is coupled to a gas conduit, which is coupled to a gas source.
8 . The apparatus as in claim 5 , wherein the support structure is further configured to support a container body, wherein the apparatus further comprises a second projecting member projecting towards the container body, the second projecting member being configured for protecting an opening of the container body, wherein the second projecting member is configured to communicate with the opening of the container body; and
a set of second spraying nozzles for dispensing a cleaning liquid onto the container body.
9 . The apparatus as in claim 8 , wherein the second projecting member comprises a second gas channel configured to flow a gas to the opening of the container body.