Photocurable adhesive compositions

1. A photocurable adhesive composition comprising:

(a) a (meth)acrylate component comprising isobornyl (meth)acrylate, N,N-dimethylacrylamide, and β-carboxyethyl acrylate dimer, wherein the (meth)acrylate component is present in the range of about 55 percent by weight to about 65 percent by weight;

(b) a urethane (meth)acrylate resin component present in an amount from about 18% to about 24% by weight based on the total weight of the composition; and

(c) a photoinitiator component present in an amount from about 0.01% to about 5% by weight based on the total weight of the composition.

2. The composition of claim 1 , having a tack-free surface cure in 4 seconds or less when photocured using radiation at 405 nm at an intensity of 400 mW/cm 2 or less.

3. The composition of claim 1 , wherein after cure the composition demonstrates a bond strength of greater than about 32 lbf.

4. The composition of claim 1 , wherein the urethane (meth)acrylate resin component comprises one or more urethane (meth)acrylate resins having a number average molecular weight of from about 500 to about 100,000.

5. The composition of claim 1 , wherein the isobornyl (meth)acrylate of the (meth)acrylate component is present in an amount from about 15% to about 35% by weight based on the total weight of the composition.

6. The composition of claim 1 , wherein the N,N-dimethylacrylamide is present in an amount from about 18% to about 35% by weight based on the total weight of the composition.

7. The composition of claim 1 , wherein the β-carboxyethyl acrylate dimer is present from about 1.5% to about 7.5% by weight based on the total weight of the composition.

8. The composition of claim 1 , wherein the photoinitiator component is selected from ethyl(2,4,6 trimethylbenzoyl)phenylphosphinate, 1-hydroxycyclohexylphenylketone, (2,4,6-trimethylbenzoyl)diphenylphosphineoxide, oxy-phenyl-acetic acid 2-[2 oxo-2-phenyl-acetoxy-ethoxy]-ethyl ester, oxy-phenyl-acetic 2-[2-hydroxy-ethoxy]-ethyl ester, 2-hydroxy-2-methyl-1-phenyl-1-propanone, phosphine oxide phenyl bis(2,4,6-trimethyl benzoyl), iodonium(4-methylphenyl)[4-(2-methylpropyl) phenyl]-hexafluorophosphate(1-), or combinations thereof.

9. The composition of claim 1 , comprising

(a) isobornyl (meth)acrylate in an amount of about 30% by weight based on the total weight of the composition;

(b) N,N-dimethylacrylamide in an amount of from about 25% to about 31% by weight based on the total weight of the composition;

(c) β-carboxyethyl acrylate dimer in an amount of about 5% by weight based on the total weight of the composition;

(d) urethane (meth)acrylate resin in an amount of from about 24% to about 34% by weight based on the total weight of the composition; and

(e) a photoinitiator component.

10. The composition of claim 1 , wherein after exposure to radiation at 405 nm for a period of time of about 4 seconds the composition cures to a tack free surface and then

(a) after 24 hour room temperature exposure, the cured composition exhibits greater than about 30 lbf bond strength between a stainless steel substrate and a polypropylene substrate, and/or

(b) after exposure to 90% relative humidity and a temperature of 60° C. for a period of time of about 72 hours, the cured composition retains greater than about 90% of its 24 hour room temperature bond strength between a stainless steel substrate and a polypropylene substrate, and/or

(c) after exposure to a temperature of 60° C. for a period of time of about 4 weeks the cured composition retains greater than about 90% of its 24 hour room temperature bond strength between a stainless steel substrate and a polypropylene substrate.

11. The composition of claim 1 , comprising

(a) isobornyl (meth)acrylate in an amount of about 30% by weight based on the total weight of the composition;

(b) N,N-dimethylacrylamide in an amount of from about 25% to about 31% by weight based on the total weight of the composition;

(c) β-carboxyethyl acrylate dimer in an amount of about 5% by weight based on the total weight of the composition;

(d) urethane (meth)acrylate resin in an amount of from about 24% to about 34% by weight based on the total weight of the composition; and

(e) a photoinitiator component.

12. The composition of claim 1 , wherein the urethane (meth)acrylate resin is cyclohexanol, 4,4-(1-methylethylidene)bis-, polymer with 1,3-disocyanatomethylbenzene and tetrahydrofuran, propylene glycol monomer.

13. A method of curing a photocurable adhesive composition according to claim 1 comprising the steps of:

(a) applying the composition according to, at least a first substrate; and

(b) exposing the composition to radiation emitted from an LED so as to cure the composition.

14. The method according to claim 13 comprising bonding the first substrate to a second substrate, wherein the first substrate and the second substrate are each parts of medical devices and optionally thereafter sterilising the bonded assembly created by bonding the first substrate to the second substrate.