Protection coating for solar cell wafers
A solar module includes solar cells that are encapsulated. A back layer is disposed towards back sides of the solar cells and a transparent layer is disposed towards front sides of the solar cells. A protection coating is formed on a surface of the solar cells. The protection coating can be continuous or have a pattern with cutouts that expose the surface of the solar cells.
1. A method comprising:
applying a dielectric polymer coating on a surface of a solar cell wafer, the dielectric polymer coating having a pattern with a plurality of cutouts that expose the surface of the solar cell wafer; and
after applying the dielectric polymer coating on the surface of the solar cell wafer, cleaving the wafer into a plurality of solar cells,
wherein the dielectric polymer coating has a mesh pattern.
2. The method of claim 1 , wherein the dielectric polymer coating comprises a thermoset material.
3. The method of claim 1 , further comprising:
placing a first sheet of encapsulant on a transparent layer;
placing the plurality of solar cells on the first sheet of encapsulant;
placing a second sheet of encapsulant on the plurality of solar cells;
placing a back layer on the second sheet of encapsulant; and
laminating the transparent layer, the first sheet of encapsulant, the plurality of solar cells, the second sheet of encapsulant, and the back layer.
4. The method of claim 1 , further comprising:
shingling the plurality of solar cells to interconnect the plurality of solar cells in series.
5. The method of claim 2 , wherein the thermoset material comprises epoxy, acrylate, or silicone.
6. The method of claim 1 , wherein the dielectric polymer coating has a pattern with one of the plurality of cutouts that exposes an electrical contact area of the solar cell wafer.
7. The method of claim 6 , wherein the dielectric polymer coating surrounds the electrical contact area of the solar cell wafer.
8. The method of claim 1 , wherein the surface of the solar cell wafer is a front side surface of the solar cell wafer.
9. The method of claim 1 , wherein the surface of the solar cell wafer is a back side surface of the solar cell wafer.