Device source wafers with patterned dissociation interfaces
A transfer-printable (e.g., micro-transfer-printable) device source wafer comprises a growth substrate comprising a growth material, a plurality of device structures comprising one or more device materials different from the growth material, the device structures disposed on and laterally spaced apart over the growth substrate, each device structure comprising a device, and a patterned dissociation interface disposed between each device structure of the plurality of device structures and the growth substrate. The growth material is more transparent to a desired frequency of electromagnetic radiation than at least one of the one or more device materials. The patterned dissociation interface has one or more areas of relatively greater adhesion each defining an anchor between the growth substrate and a device structure of the plurality of device structures and one or more dissociated areas of relatively lesser adhesion between the growth substrate and the device structure of the plurality of device structures.
1. A method of making a transfer-printable device source wafer, comprising:
providing a growth substrate comprising a growth material;
disposing a plurality of laterally spaced-apart device structures comprising one or more device materials different from the growth material on the growth substrate, thereby forming an interface between each of the device structures and the growth substrate for each of the plurality of device structures;
exposing each interface to a desired frequency of electromagnetic radiation, wherein the growth material is more transparent to the desired frequency of electromagnetic radiation than at least one of the one or more device materials; and
dissociating one or more areas of the interface to form a patterned dissociation interface, wherein the patterned dissociation interface has one or more areas of relatively greater adhesion each defining an anchor between the growth substrate and each device structure of the plurality of device structures and one or more dissociated areas of relatively lesser adhesion between the growth substrate and each device structure of the plurality of device structures.
2. The method of claim 1 , comprising micro-transfer printing one or more devices of the plurality of device structures from the source wafer to a destination substrate with a stamp.
3. The method of claim 1 , wherein one or more of the one or more dissociated areas is exposed at one or more edges of the laterally spaced device structures and the method comprises:
disposing a stabilization layer over each device structure of the plurality of device structures at least partially on a side of the device structure opposite the growth substrate.
4. The method of claim 3 , comprising forming one or more vias through the stabilization layer to at least one of the one or more exposed edges.
5. The method of claim 1 , wherein the growth substrate has a growth side and an opposing mask side, the plurality of device structures are disposed on the growth side, and the method comprises disposing a patterned mask that is less transparent than the growth material on the mask side of the growth substrate in one or more locations corresponding to each of the one or more anchors.
6. The method of claim 1 , wherein the step of exposing the interface to a desired frequency of electromagnetic radiation exposes the interface to a blanket, unpatterned field of radiation.
7. The method of claim 1 , wherein the step of exposing the interface to a desired frequency of electromagnetic radiation exposes the interface to a patterned field of radiation.
8. The method of claim 1 , comprising etching the patterned dissociation interface with an etchant.
9. The method of claim 8 , wherein the etching is liquid etching.
10. The method of claim 8 , wherein the etchant is a gas.
11. The method of claim 8 , wherein the etchant comprises any one or more of: HCl, Cl 2 , BCl 3 , H 2 O 2 , XeF 2 , TMAH, and oxygen plasma.
12. The method of claim 8 , wherein the etching is gas etching.
13. The method of claim 8 , wherein the etching is plasma etching.
14. The method of claim 8 , wherein the etching is inductively coupled plasma etching.
15. The method of claim 8 , wherein the etchant is a liquid.
16. The method of claim 8 , wherein the etchant is a plasma.
17. The method of claim 8 , wherein the etchant is HCl, Cl 2 , BCl 3 , H 2 O 2 , XeF 2 , TMAH, or oxygen plasma.